CN-122029947-A - Liquid cooled negative pressure dispensing system

Abstract

A data center cooling system for cooling at least one rack system of a data center includes a cooling circuit having a cooling fluid circulated therethrough. The cooling circuit has a closed loop configuration and includes a pump for moving cooling fluid within the cooling circuit, a cooling distribution unit, and a heat recovery member mounted within the at least one rack system. The data center cooling system is thermally coupled to the at least one rack system such that heat is transferred directly from the at least one rack system to the cooling fluid at the heat recovery member.

Inventors

• M. Grabang

Assignees

• 开利公司

Dates

Publication Date

20260512

Application Date

20240809

Priority Date

20230810

Claims (19)

1. 1. A data center cooling system for cooling at least one rack system of a data center, the data center cooling system comprising: A cooling circuit having a cooling fluid circulated therethrough, the cooling circuit having a closed loop configuration and comprising: A pump disposed within the cooling circuit; Cooling distribution unit, and A heat recovery member mounted within the at least one rack system; Wherein heat is transferred from the at least one rack system directly to the cooling fluid at the heat recovery member, and Wherein the pump is operable to move the cooling fluid within the cooling circuit and create a negative pressure at the heat recovery member.
2. 2. The data center cooling system of claim 1, wherein the heat recovery member is a heat exchanger mounted to heat generating electronics components of the at least one rack system.
3. 3. The data center cooling system of claim 2, wherein the heat exchanger is directly thermally coupled to a surface of the heat generating electronic component.
4. 4. The data center cooling system of claim 1, wherein the pump is disposed downstream of the heat recovery member and upstream of the cooling distribution unit relative to the flow of cooling fluid.
5. 5. The data center cooling system of claim 4, wherein the pump is located directly downstream of an outlet of the heat recovery member.
6. 6. The data center cooling system of claim 1, wherein the pump is a positive pressure pump.
7. 7. The data center cooling system of claim 1, wherein the pump is disposed downstream of the cooling distribution unit and upstream of the heat recovery member relative to the flow of cooling fluid.
8. 8. The data center cooling system of any of the preceding claims, further comprising an inlet valve disposed directly upstream of the heat recovery member.
9. 9. The data center cooling system of claim 8, further comprising an outlet valve disposed directly downstream of the heat recovery member.
10. 10. The data center cooling system of any of the preceding claims, wherein the heat recovery member is positioned vertically below the cooling distribution unit.
11. 11. The data center cooling system of any one of claims 1 to 9, wherein the heat recovery member is positioned vertically above the cooling distribution unit.
12. 12. The data center cooling system of any of the preceding claims, wherein the cooling circuit comprises a plurality of fluid circuits arranged in parallel, each of the plurality of fluid circuits comprising a separate cooling distribution unit and a separate heat recovery member.
13. 13. The data center cooling system of claim 12, wherein the plurality of fluid circuits are fluidly coupled by at least one manifold.
14. 14. The data center cooling system of claim 12, wherein the cooling distribution unit is a heat exchanger fluidly coupled to a cooling system, wherein a heat transfer fluid is configured to absorb heat from the cooling fluid at the cooling distribution unit.
15. 15. A method of cooling at least one rack system of a data center, comprising: circulating a cooling fluid through a cooling circuit via a pump, the cooling circuit having a closed loop configuration; Transferring heat from the cooling fluid at a cooling distribution unit, and Transferring heat to the cooling fluid at a heat recovery member mounted within the at least one rack system, wherein heat is transferred from heat generating electronic components of the at least one rack system directly to the cooling circuit at the heat recovery member, and A negative pressure is generated at the heat recovery member via the pump.
16. 16. The method of claim 15, further comprising wherein the pump is positioned directly downstream of an outlet of the heat recovery member.
17. 17. The method of claim 15 or claim 16, further comprising cooling another heat generating electronic component of the at least one rack system with another fluid S, and cooling the other fluid S at the heat recovery component via the cooling fluid.
18. 18. The method of any one of claims 15 to 17, wherein the cooling circuit comprises a plurality of fluid circuits arranged in parallel, each of the plurality of fluid circuits comprising a separate heat recovery member, the method further comprising simultaneously providing the cooling fluid to the plurality of fluid circuits.
19. 19. The method of any one of claims 15 to 18, further comprising adjusting a position of at least one of an inlet valve and an outlet valve associated with the heat recovery member in response to a condition at the at least one rack system.

Description

Liquid cooled negative pressure dispensing system Cross Reference to Related Applications The present application claims the benefit of U.S. provisional patent application No. 63/518670 filed on 8/10 of 2023, the entire contents of which are incorporated herein by reference. Background Exemplary embodiments relate to the field of thermal management, and more particularly, to thermal management of servers within a data center. "Data center" refers to the physical location of one or more servers. Data centers and servers housed within the data centers typically consume significant amounts of electrical power. Existing servers are designed to be at least partially cooled by an air stream. Such servers typically include one or more printed circuit boards on which are mounted a plurality of operable heat generating devices. The printed circuit board is typically housed in a housing having vents configured to direct outside air from the data center into, through, and out of the housing. The air absorbs heat dissipated by the components and mixes with ambient air after being exhausted from the housing. The air conditioner is then used to cool and recirculate the heated air of the data center, and the cooling process is repeated. The higher performance server components generally dissipate more power. However, the amount of heat that conventional cooling systems may remove from the servers is limited in part by the range of air conditioning available from the data center. In general, lower air temperatures in the data center allow each server component cooled by the air stream to dissipate higher power and thus allow each server to operate at a corresponding higher performance level. Disclosure of Invention According to an embodiment, a data center cooling system for cooling at least one rack system of a data center includes a cooling circuit having a cooling fluid circulated therethrough. The cooling circuit has a closed loop configuration and includes a pump disposed within the cooling circuit, a cooling distribution unit, and a heat recovery member mounted within the at least one rack system. The data center cooling system is thermally coupled to the at least one rack system such that heat is transferred directly from the at least one rack system to the cooling fluid at the heat recovery member. The pump is operable to move the cooling fluid within the cooling circuit and generate a negative pressure at the heat recovery member. In addition to or alternatively to one or more of the features described above, in other embodiments, the heat recovery member is a heat exchanger mounted to the heat generating electronic components of the at least one rack system. In addition to or alternatively to one or more of the features described above, in other embodiments, the heat exchanger is directly thermally coupled to a surface of the heat generating electronic component. In addition to or as an alternative to one or more of the above features, in other embodiments the pump is arranged downstream of the heat recovery member and upstream of the cooling distribution unit with respect to the flow of cooling fluid. In addition to, or as an alternative to, one or more of the above features, in other embodiments the pump is located directly downstream of the outlet of the heat recovery member. In addition to, or as an alternative to, one or more of the features described above, in other embodiments the pump is a positive pressure pump. In addition to or alternatively to one or more of the features described above, in other embodiments the pump is arranged downstream of the cooling distribution unit and upstream of the heat recovery member with respect to the flow of cooling fluid. In addition to, or as an alternative to, one or more of the above features, in other embodiments, an inlet valve is included that is disposed directly upstream of the heat recovery member. In addition to, or as an alternative to, one or more of the above features, in other embodiments, an outlet valve is included that is disposed directly downstream of the heat recovery member. In addition to or alternatively to one or more of the features described above, in other embodiments the heat recovery member is positioned vertically below the cooling distribution unit. In addition to or alternatively to one or more of the features described above, in other embodiments, the heat recovery member is positioned vertically above the cooling distribution unit. In addition to or as an alternative to one or more of the above features, in other embodiments the cooling circuit comprises a plurality of fluid circuits arranged in parallel, and each of the plurality of fluid circuits comprises a separate cooling distribution unit and a separate heat recovery member. Additionally or alternatively to one or more of the features above, in other embodiments, the plurality of fluid circuits are fluidly coupled by at least one manifold. In addition to or alternatively to one o