CN-122029963-A - Light detecting element

Abstract

The present invention provides a light shielding portion using a void in a pixel. The light detection element of the present invention includes a pixel, an on-chip lens, and a light shielding portion. The pixels each include a photoelectric conversion portion provided in a semiconductor substrate and performing photoelectric conversion of incident light, and a color filter that allows transmission of incident light having a predetermined wavelength among the incident light and causes the incident light to enter the photoelectric conversion portion. The on-chip lens is disposed in the pixel and includes a member that transmits incident light having a predetermined wavelength among the incident light. An incident surface of the on-chip lens for incident light is formed as a curved surface so that the incident light having a predetermined wavelength is condensed and incident to the photoelectric conversion portion via the color filter. The light shielding portion is provided at a boundary between the pixels and is adjacent to the color filter, and includes a wall portion and a void formed inside the wall portion.

Inventors

• KONNO RYOTA
• MUTO KOJI

Assignees

• 索尼半导体解决方案公司

Dates

Publication Date

20260512

Application Date

20241101

Priority Date

20231109

Claims (13)

1. 1. A light detecting element comprising: A pixel including a photoelectric conversion portion provided in a semiconductor substrate and configured to perform photoelectric conversion of incident light, and a color filter configured to allow transmission of incident light having a predetermined wavelength among the incident light and cause the incident light to be incident into the photoelectric conversion portion; An on-chip lens provided in the pixel and including a member capable of transmitting incident light having a predetermined wavelength among the incident light, an incident surface of the on-chip lens for the incident light being formed into a curved surface, the on-chip lens converging the incident light having the predetermined wavelength and causing the incident light to be incident to the photoelectric conversion portion via the color filter, and A light shielding portion provided at a boundary between the pixels and adjoining the color filter, the light shielding portion including a wall portion and a void formed inside the wall portion.
2. 2. The light detecting element as in claim 1, wherein, The on-chip lens is disposed adjacent to the color filter.
3. 3. The light detecting element according to claim 2, wherein, The on-chip lens is integrally formed with the color filter.
4. 4. The light detecting element according to claim 3, further comprising: A substrate disposed at a bottom surface of the color filter and configured to form the curved surface of the on-chip lens.
5. 5. The light detecting element as in claim 1, wherein, The on-chip lens is configured such that it is capable of transmitting the same wavelength of the incident light as the color filter allows transmission.
6. 6. The light detecting element of claim 1, further comprising: And a first sealing film provided on a surface side of the on-chip lens on which incident light is incident, the first sealing film being configured to seal the on-chip lens.
7. 7. The light detecting element of claim 1, further comprising: and a second sealing film provided inside the wall portion of the light shielding portion, the second sealing film being configured to seal the color filter.
8. 8. The light detecting element of claim 1, further comprising: And a third sealing film disposed near the side surfaces and the bottom surface of the color filter, the third sealing film being configured to seal the color filter.
9. 9. The light detecting element as in claim 1, wherein, The light shielding portion includes an opening portion formed in the wall portion.
10. 10. The light detecting element of claim 9, further comprising: and a blocking film for blocking the opening.
11. 11. The light detecting element of claim 10, wherein, The blocking film is disposed between the color filter and the on-chip lens.
12. 12. The light detecting element of claim 1, further comprising: A light shielding film provided at a bottom of the void of the light shielding portion.
13. 13. The light detecting element as in claim 1, wherein, The position of the on-chip lens in the pixel is adjusted according to the incident angle of the incident light.

Description

Light detecting element Technical Field The present disclosure relates to light detecting elements. Background A light detection element (image pickup element) for picking up an image of an object is constructed by arranging a plurality of pixels in a two-dimensional matrix shape. Such a pixel is provided with a photoelectric conversion portion which is formed in a semiconductor substrate and performs photoelectric conversion on incident light, a color filter which allows transmission of incident light having a predetermined wavelength among the incident light, an on-chip lens which condenses the incident light on the photoelectric conversion portion, and the like. As such an image pickup element, an image pickup element (solid-state image pickup element) in which a color filter is formed in a lens shape has been proposed (for example, see patent document 1). Since the solid-state image pickup element performs convergence of incident light through the color filter, an on-chip lens is not required. By adopting such a configuration, the height of the optical member on the semiconductor substrate can be reduced in the pixel, and the diffusion of the incident light after light collection can be reduced. In addition, an inter-pixel light shielding portion is provided between pixels adjacent to each other. The inter-pixel light shielding portion is constituted by a member having a refractive index lower than that of the color filter, and is used to prevent mixing of light from adjacent pixels. For example, air may be used as the inter-pixel light shielding portion. CITATION LIST Patent literature Patent document 1 International publication WO 2023/007796 Disclosure of Invention Technical problem to be solved However, in the above-described related art, the inter-pixel light shielding portion formed of air is not disclosed, and there is a problem in that the inter-pixel light shielding portion using air cannot be realized. Accordingly, the present disclosure proposes a light detection element including pixels using color filters formed in a lens shape, in which light shielding portions using a void formed of air or the like as a low refractive index portion are provided between the pixels. Technical proposal for solving the problems The light detection element according to the present disclosure includes a pixel, an on-chip lens, and a light shielding portion. The pixel includes a photoelectric conversion portion provided in a semiconductor substrate and configured to perform photoelectric conversion of incident light, and a color filter configured to allow transmission of incident light having a predetermined wavelength among the incident light and cause the incident light to be incident into the photoelectric conversion portion. The on-chip lens is disposed in the pixel and includes a member that transmits incident light having a predetermined wavelength among the incident light. An incident surface of the on-chip lens for incident light is formed as a curved surface, the on-chip lens converging the incident light having a predetermined wavelength and causing the incident light to be incident to the photoelectric conversion portion via the color filter. The light shielding portion is provided at a boundary between the pixels and is adjacent to the color filter, and includes a wall portion and a void formed inside the wall portion. Drawings Fig. 1 is a diagram showing a configuration example of a light detection device according to one embodiment of the present disclosure. Fig. 2 is a diagram showing a configuration example of a pixel array section according to the first embodiment of the present disclosure. Fig. 3 is a diagram showing a configuration example of a pixel according to the first embodiment of the present disclosure. Fig. 4A is a diagram showing an example of a method of manufacturing a light detection element according to the first embodiment of the present disclosure. Fig. 4B is a diagram showing an example of a method of manufacturing a light detection element according to the first embodiment of the present disclosure. Fig. 4C is a diagram showing an example of a method of manufacturing a light detection element according to the first embodiment of the present disclosure. Fig. 4D is a diagram showing an example of a method of manufacturing a light detection element according to the first embodiment of the present disclosure. Fig. 4E is a diagram showing an example of a method of manufacturing a light detection element according to the first embodiment of the present disclosure. Fig. 4F is a diagram showing an example of a method of manufacturing a light detection element according to the first embodiment of the present disclosure. Fig. 4G is a diagram showing an example of a method of manufacturing a light detection element according to the first embodiment of the present disclosure. Fig. 4H is a diagram showing an example of a method of manufacturing a light detection element according to the fi