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CN-122029968-A - Micro LED transfer system and micro LED transfer method using same

CN122029968ACN 122029968 ACN122029968 ACN 122029968ACN-122029968-A

Abstract

A micro LED transfer system according to embodiments of the present disclosure may include a first transfer device for transferring micro LEDs to a second substrate, and/or a second transfer device for transferring micro LEDs to a second substrate. The first transfer apparatus may include a first laser light source unit to irradiate a first substrate on which micro LEDs are disposed with a laser beam, a mask unit disposed between the first substrate and the first laser light source unit and selectively opening and closing at least one opening, and a first processor to control the mask unit such that openings corresponding to the micro LEDs transferred to the second substrate are opened and closed. The first transfer device and/or the second transfer device may transfer the micro LEDs to the second substrate having an irregular shape.

Inventors

  • JIN BINGCHE
  • HAN SHENGLONG
  • LI MINKUI

Assignees

  • 三星电子株式会社

Dates

Publication Date
20260512
Application Date
20241011
Priority Date
20231013

Claims (15)

  1. 1. A miniature light emitting diode, LED, transfer system comprising: At least one of a first transfer device transferring micro LEDs to a second substrate and a second transfer device transferring the micro LEDs to the second substrate, wherein the first transfer device comprises: A first laser light source unit irradiating a laser beam to a first substrate on which the micro LED is disposed; a mask unit disposed between the first substrate and the first laser light source unit and selectively opening and closing at least one opening, and A first processor including a processing circuit and controlling the mask unit to open and close openings corresponding to the micro LEDs transferred to the second substrate, and Wherein at least one of the first transfer device or the second transfer device is configured to transfer the micro LEDs to the second substrate having an irregular shape.
  2. 2. The micro LED transfer system of claim 1, wherein the mask unit comprises a curved portion having a predetermined curvature, and Wherein the first processor is configured to form irregularly shaped laser beams by moving and rotating the mask unit.
  3. 3. The micro LED transfer system of claim 2, wherein the mask unit has a quadrant shape including the curved portion, and Wherein the first processor is configured to form a circularly shaped laser beam by moving and rotating the mask unit.
  4. 4. The micro LED transfer system of any of claims 1-3, wherein the mask unit comprises: A first mask for shaping the laser beam, and And a second mask for scanning the laser beam onto the first substrate.
  5. 5. The micro LED transfer system of claim 4, wherein the first mask comprises a shaped aperture having at least one of a rectangular, triangular, circular, semi-circular, and scalloped shape.
  6. 6. The micro LED transfer system of claim 4, wherein the first processor is configured to form irregularly shaped laser beams by moving and rotating the first mask.
  7. 7. The micro LED transfer system of any one of claims 1-6, wherein the first transfer device is configured to transfer the micro LEDs to the second substrate in multiple transfers, and Wherein the second transfer device is configured to transfer the micro LEDs to the second substrate in a one-by-one transfer.
  8. 8. The micro LED transfer system of any one of claims 1-7, wherein the second transfer device comprises: A second laser light source unit outputting a laser beam; a path changing unit for changing the path of the laser beam, and And a second processor controlling the path changing unit to change a path of the laser beam toward the micro LED transferred to the second substrate.
  9. 9. The micro LED transfer system of claim 8, wherein the first transfer device is configured to transfer the micro LED to a first area of the second substrate, and Wherein the second transfer device is configured to transfer the micro LED to a second area of the second substrate.
  10. 10. The micro LED transfer system of claim 9, wherein the first region comprises a non-curved region of the second substrate, and Wherein the second region includes a curved region of the second substrate.
  11. 11. A micro LED transfer method comprising: transferring micro LEDs to a second substrate using a first transfer device, and Transferring the micro LED to the second substrate using a second transfer device, wherein transferring the micro LED to the second substrate using the first transfer device comprises: Irradiating a laser beam to a first substrate on which the micro LED is disposed using a first laser light source unit; selectively opening and closing at least one opening using a mask unit disposed between the first substrate and the first laser light source unit, and Controlling the mask unit to open and close openings corresponding to the micro LEDs transferred to the second substrate using a first processor, and Wherein at least one of the first transfer device and the second transfer device is configured to transfer the micro LED to the second substrate having an irregular shape.
  12. 12. The micro LED transfer method of claim 11, wherein the mask unit includes a curved portion having a predetermined curvature, and Wherein controlling the mask unit using the first processor includes forming irregularly shaped laser beams by moving and rotating the mask unit.
  13. 13. The micro LED transfer method of claim 12, wherein the mask unit has a quadrant shape including the curved portion, and Wherein controlling the mask unit using the first processor includes forming a circular-shaped laser beam by moving and rotating the mask unit.
  14. 14. The micro LED transfer method of any of claims 11-13, wherein selectively opening and closing at least one aperture using the mask unit comprises: shaping the laser beam using a first mask, and The laser beam is scanned onto the first substrate using a second mask.
  15. 15. The micro LED transfer method of claim 14, wherein the first mask comprises a shaped aperture having at least one of a rectangular, triangular, circular, semi-circular, and scalloped shape.

Description

Micro LED transfer system and micro LED transfer method using same Technical Field Embodiments of the present disclosure relate to a micro Light Emitting Diode (LED) transfer system that transfers a plurality of micro LEDs formed on a wafer to a printed circuit board of a display panel, and a micro LED transfer method using the same. Background Micro LEDs are a kind of ultra-small phosphor that emits light by itself without the need for a color filter or backlight. In particular, micro LEDs have a length of one tenth and an area of one hundredth of a common Light Emitting Diode (LED) chip, and may refer to ultra-small LEDs having a width, length, and height of 10 μm to 100 μm. Micro LEDs are fabricated in chip form on a wafer and are disposed on a target substrate to constitute a light emitting module of a display. The process of disposing the micro LED on the target substrate is a process of effectively transferring the micro LED to a space of the substrate and electrically or physically connecting the micro LED to the substrate, and is a core process in manufacturing the micro LED display module. Meanwhile, recently, with the advent of various types of display devices such as wearable devices, a technology capable of effectively transferring micro LEDs onto various types of target substrates is required. Disclosure of Invention Solution to the problem Embodiments of the present disclosure may provide a micro LED transfer system that efficiently transfers micro LEDs onto a target substrate having an irregular shape using at least one of a first transfer device and a second transfer device, and a micro LED transfer method using the same. A micro LED transfer system according to embodiments of the present disclosure may include at least one of a first transfer device transferring micro LEDs to a second substrate and a second transfer device transferring micro LEDs to the second substrate. The first transfer apparatus may include a first laser light source unit irradiating a laser beam to a first substrate on which micro LEDs are disposed, a mask unit disposed between the first substrate and the first laser light source unit and selectively opening and closing at least one opening, and a first processor controlling the mask unit to open and close the opening corresponding to the micro LEDs transferred to the second substrate. At least one of the first transfer device or the second transfer device may transfer the micro LEDs to the second substrate having an irregular shape. According to an embodiment, the mask unit may include a curved portion having a predetermined curvature. The first processor may form irregularly shaped laser beams by moving and rotating the mask unit. According to an embodiment, the mask unit may have a quadrant shape including a curved portion. The first processor may form the laser beam in a circular shape by moving and rotating the mask unit. According to an embodiment, the mask unit may include a first mask shaping the laser beam, and a second mask scanning the laser beam onto the first substrate. According to an embodiment, the first mask may comprise a shaping aperture having at least one of a rectangular, triangular, circular, semi-circular and fan shape. According to an embodiment, the first processor may form the irregularly shaped laser beam by moving and rotating the first mask. According to an embodiment, the first transfer device may transfer the micro LEDs to the second substrate in a multiple transfer manner. The second transfer device may transfer the micro LEDs to the second substrate in a one-by-one transfer manner. According to an embodiment, the second transfer apparatus may include a second laser light source unit outputting a laser beam, a path changing unit changing a path of the laser beam, and a second processor controlling the path changing unit to change the path of the laser beam toward the micro LED transferred to the second substrate. According to an embodiment, the first transfer device may transfer the micro LEDs to the first area of the second substrate. The second transfer device may transfer the micro LEDs to a second area of the second substrate. According to an embodiment, the first region may comprise a non-curved region of the second substrate. The second region may include a curved region of the second substrate. A micro LED transfer method according to an embodiment of the present disclosure may include transferring a micro LED to a second substrate using a first transfer device, and transferring a micro LED to the second substrate using a second transfer device. Transferring the micro LED onto the second substrate using the first transfer apparatus may include irradiating a laser beam onto the first substrate having the micro LED disposed thereon using the first laser light source unit, selectively opening or closing at least one opening using a mask unit disposed between the first substrate and the first laser light source unit, and controlling