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CN-122029974-A - Display device and method for manufacturing display device

CN122029974ACN 122029974 ACN122029974 ACN 122029974ACN-122029974-A

Abstract

A display device (100) according to the present disclosure includes a thin Film Substrate (FS), a light emitting element layer (ED) that is located at an upper layer of the thin Film Substrate (FS) and includes a plurality of light emitting elements, an inorganic sealing film (K1) that covers the light emitting element layer (ED), a plurality of pairs of banks (B1, B2) that are located between an outer periphery of the inorganic sealing film (K1) and an outer periphery of the thin Film Substrate (FS) in a plan view and are opposed to each other with a space therebetween, and a Filler (FM) that is located between at least one pair of banks (B1, B2) of the plurality of pairs of banks (B1, B2) in a plan view and that contracts or expands due to curing.

Inventors

  • OKA MASAKI

Assignees

  • 夏普显示科技株式会社

Dates

Publication Date
20260512
Application Date
20231024

Claims (16)

  1. 1. A display device, comprising: A thin film substrate; a light emitting element layer which is located on an upper layer of the thin film substrate and includes a plurality of light emitting elements; An inorganic sealing film covering the light emitting element layer; A plurality of pairs of banks which are located between the outer periphery of the inorganic sealing film and the outer periphery of the film substrate in a plan view and are opposed to each other with a gap therebetween, and And a filler material which is positioned between at least one of the plurality of pairs of banks in a plan view and which contracts or expands due to curing.
  2. 2. The display device of claim 1, wherein the display device comprises a display device, A recess is provided between at least one of the plurality of pairs of banks.
  3. 3. The display device according to claim 1 or 2, wherein, The filler material comprises a cure shrinkage resin.
  4. 4. A display device according to claim 3, wherein, The curing shrinkage resin is acrylic resin, epoxy resin or silicon resin.
  5. 5. The display device according to claim 3 or 4, wherein, The shrinkage of the filler is 5.0% or more and 15% or less.
  6. 6. The display device according to any one of claims 1 to 5, further comprising: And an inorganic bonding film which covers the side surfaces of at least one pair of the banks facing each other and at least a part of the region between the at least one pair of the banks, and which is made of the same material as the inorganic sealing film.
  7. 7. The display device according to any one of claims 1 to 6, wherein, At least one of the plurality of pairs of banks forms a surrounding structure in plan view.
  8. 8. The display device of claim 7, wherein the display device comprises a display device, The surrounding structure is provided in plurality between the outer periphery of the inorganic sealing film and the outer periphery of the thin film substrate.
  9. 9. The display device of claim 8, wherein the display device comprises a display device, At least a part of the plurality of surrounding structures are arranged in a column.
  10. 10. The display device of claim 9, wherein the display device comprises a display device, A plurality of the columns surrounding the structure are arranged.
  11. 11. The display device according to any one of claims 8 to 10, wherein, At least a part of the plurality of surrounding structures are arranged in a staggered manner.
  12. 12. The display device according to claim 2, further comprising: A back plate between the thin film substrate and the light emitting element layer, The recess penetrates the back plate.
  13. 13. A method of manufacturing a display device, comprising: forming or fixing a thin film substrate on an upper layer of the rigid substrate; Forming a light-emitting element layer including a plurality of light-emitting elements on an upper layer of the thin film substrate; Forming a plurality of pairs of banks on an upper layer of the thin film substrate, the banks being opposed to each other with a space therebetween; forming an inorganic sealing film covering the light emitting element layer such that the plurality of pairs of banks are located between an outer periphery of the inorganic sealing film and an outer periphery of the thin film substrate in a plan view; a step of injecting a filler material between at least one of the pair of banks, the filler material shrinking or expanding due to curing; A step of solidifying the filler, and And peeling the thin film substrate from the rigid substrate.
  14. 14. The method for manufacturing a display device according to claim 13, wherein, Further comprising a step of dividing the film substrate along a dividing line, The plurality of pairs of banks are formed between the outer periphery of the inorganic sealing film and the dividing line in a plan view.
  15. 15. The method for manufacturing a display device according to claim 13 or 14, further comprising: a step of forming a back plate on the upper layer of the thin film substrate, and And forming a recess in the back plate between at least one of the plurality of pairs of banks.
  16. 16. The method for manufacturing a display device according to claim 15, wherein, The step of forming the recess includes forming a through hole in the back plate and forming a recess in the thin film substrate in communication with the through hole.

Description

Display device and method for manufacturing display device Technical Field The present disclosure relates to a display device and a method of manufacturing the display device. Background Patent document 1 discloses a structure in which an organic EL element is formed on a substrate obtained by laminating a gas barrier film and a heat-resistant film with a stress relaxation sheet interposed therebetween. Prior art literature Patent literature Patent document 1 Japanese patent laid-open No. 2015-88246 Summary of The Invention The invention aims to solve the technical problems It is required to reduce warpage of the display device. Solution to the problem The display device includes a thin film substrate, a light emitting element layer which is located on an upper layer of the thin film substrate and includes a plurality of light emitting elements, an inorganic sealing film which covers the light emitting element layer, a plurality of pairs of banks which are located between an outer periphery of the inorganic sealing film and an outer periphery of the thin film substrate in a plan view and are opposed to each other with a space therebetween, and a filler which is located between at least one pair of banks of the plurality of pairs of banks in a plan view and which contracts or expands due to curing. The method for manufacturing a display device includes a step of forming or fixing a thin film substrate on a top layer of a rigid substrate, a step of forming a light emitting element layer including a plurality of light emitting elements on the top layer of the thin film substrate, a step of forming a plurality of pairs of banks on the top layer of the thin film substrate, the plurality of pairs of banks facing each other with a gap therebetween, a step of forming an inorganic sealing film that covers the light emitting element layer such that the plurality of pairs of banks are located between an outer periphery of the inorganic sealing film and an outer periphery of the thin film substrate in a plan view, a step of injecting a filler material that is cured to cause shrinkage or expansion between at least one pair of banks in the plurality of pairs of banks, a step of curing the filler material, and a step of peeling the thin film substrate from the rigid substrate. Effects of the invention According to one embodiment of the present disclosure, warpage of the display device can be reduced. Drawings Fig. 1 is a plan view showing an example of the configuration of a display device according to an embodiment of the present disclosure. Fig. 2 is a cross-sectional view showing an example of the configuration of a display device according to an embodiment of the present disclosure, which corresponds to the AB cross-sectional view of fig. 1. Fig. 3 is a cross-sectional view showing an example of a method for manufacturing a display device according to an embodiment of the present disclosure. Fig. 4 is a plan view showing an example of the configuration of a display device according to an embodiment of the present disclosure. Fig. 5 is a cross-sectional view showing an example of the configuration of a display device according to an embodiment of the present disclosure. Fig. 6 is a cross-sectional view showing an example of a method for manufacturing a display device according to an embodiment of the present disclosure. Fig. 7 is a cross-sectional view showing an example of the configuration of a display device according to an embodiment of the present disclosure. Fig. 8 is a cross-sectional view showing another example of the configuration of a display device according to an embodiment of the present disclosure. Fig. 9 is a plan view showing an example of the structure of a display device according to an embodiment of the present disclosure. Fig. 10 is a partial plan view showing another example of the configuration of a display device according to an embodiment of the present disclosure. Detailed Description [ Embodiment 1] Fig. 1 is a plan view showing an example of the configuration of a display device according to an embodiment of the present disclosure. Fig. 2 is a cross-sectional view showing an example of the configuration of a display device according to an embodiment of the present disclosure, which corresponds to the AB cross-sectional view of fig. 1. To aid in understanding the invention, filler material FM is hatched in top view. As shown in fig. 1 and 2, the display device 100 according to the present disclosure includes a thin film substrate FS, a light emitting element layer ED including a plurality of light emitting elements, which is located on an upper layer of the thin film substrate FS, an inorganic sealing film K1 covering the light emitting element layer ED, a plurality of pairs of banks B1 and B2 which are located between an outer periphery of the inorganic sealing film K1 and an outer periphery of the thin film substrate FS and are opposed to each other with a gap therebetween in a plan view, a