CN-122029984-A - Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device

Abstract

The laser irradiation apparatus according to this embodiment includes a laser light source configured to generate laser light, an optical system configured to irradiate a substrate with the laser light, a conveying mechanism configured to convey the substrate, and a driving unit configured to drive the conveying mechanism, wherein the driving unit includes a first motor and a second motor configured to move the conveying mechanism, a PWM driver configured to PWM-drive the first motor, an analog driver configured to linearly drive the second motor, and a control unit configured to control the analog driver and the PWM driver.

Inventors

• SHIMIZU RYO
• YAMAGUCHI YOSHIHIRO
• ODA YOSHIYASU
• Teng Guiyang

Assignees

• JSW阿克迪纳系统有限公司

Dates

Publication Date

20260512

Application Date

20231018

Claims (20)

1. 1. A laser irradiation apparatus comprising: a laser light source configured to generate laser light; An optical system configured to irradiate a substrate with the laser light; A conveying mechanism configured to convey the substrate, and A driving unit configured to drive the conveying mechanism, Wherein the driving unit includes: a first motor and a second motor, the first motor and the second motor are configured to move the conveying mechanism; a PWM driver configured to PWM-drive the first motor; an analog driver configured to linearly drive the second motor, and A control unit configured to control the analog driver and the PWM driver.
2. 2. The laser irradiation apparatus according to claim 1, wherein, When the substrate is irradiated with the laser light, the mode is switched to a high-precision mode in which the analog driver drives the second motor, and In the modes other than the high-precision mode, a mode is switched to a large torque mode in which the PWM driver drives the first motor.
3. 3. The laser irradiation apparatus according to claim 1, wherein, When the substrate is irradiated with the laser light, the mode is switched to a high-precision mode in which the analog driver drives the second motor, and In the modes other than the high-precision mode, a mode is switched to a large torque mode in which the PWM driver drives the first motor and the analog driver drives the second motor.
4. 4. The laser irradiation apparatus according to any one of claims 1 to 3, wherein, The second motor driven by the analog driver has a higher positional accuracy than the first motor driven by the PWM driver, and The torque of the second motor driven by the analog driver is smaller than the torque of the first motor driven by the PWM driver.
5. 5. The laser irradiation apparatus according to any one of claims 1 to 3, further comprising a sensor configured to detect a position of the conveying mechanism, Wherein the control unit performs feedback control based on the position detected by the sensor.
6. 6. The laser irradiation apparatus according to any one of claims 1 to 3, further comprising a floating unit configured to float the substrate above a top surface of the floating unit, wherein, The optical system shapes the laser light into a straight line shape on the substrate, The conveying mechanism comprises: a holding mechanism configured to hold the substrate floating above the floating unit, and A first moving mechanism configured to move the holding mechanism in a first direction, and The first moving mechanism is moved by the first motor and the second motor.
7. 7. The laser irradiation apparatus according to claim 6, further comprising a second moving mechanism configured to move the holding mechanism in a second direction inclined from the first direction, Wherein the first moving mechanism moves the second moving mechanism and the holding mechanism.
8. 8. The laser irradiation apparatus according to claim 6, wherein the first moving mechanism moves the holding mechanism in a direction inclined from a direction perpendicular to a longitudinal direction of the linear-shaped laser light when viewed from the top.
9. 9. The laser irradiation apparatus according to any one of claims 1 to 3, wherein, The conveying mechanism includes a tray on which the substrate is placed, and The first motor and the second motor move the tray.
10. 10. A laser irradiation method comprising: Step (A1), generating laser; a step (A2) of irradiating the substrate with the laser light, and Step (A3) of transporting the substrate by a transport mechanism, wherein The conveying mechanism includes a driving unit configured to convey the substrate, and The driving unit includes: a first motor and a second motor, the first motor and the second motor are configured to move the conveying mechanism; a PWM driver configured to PWM-drive the first motor; an analog driver configured to linearly drive the second motor, and A control unit configured to control the analog driver and the PWM driver.
11. 11. The laser irradiation method according to claim 10, wherein, When the substrate is irradiated with the laser light, the mode is switched to a high-precision mode in which the analog driver drives the second motor, and In the modes other than the high-precision mode, a mode is switched to a large torque mode in which the PWM driver drives the first motor.
12. 12. The laser irradiation method according to claim 10, wherein, When the substrate is irradiated with the laser light, the mode is switched to a high-precision mode in which the analog driver drives the second motor, and In the modes other than the high-precision mode, a mode is switched to a large torque mode in which the PWM driver drives the first motor and the analog driver drives the second motor.
13. 13. The laser irradiation method according to any one of claims 10 to 12, wherein, The second motor driven by the analog driver has a higher positional accuracy than the first motor driven by the PWM driver, and The torque of the second motor driven by the analog driver is smaller than the torque of the first motor driven by the PWM driver.
14. 14. The laser irradiation method according to any one of claims 10 to 12, wherein, The position of the transport mechanism is detected by a sensor, The control unit performs feedback control based on the position detected by the sensor.
15. 15. The laser irradiation method according to any one of claims 10 to 12, wherein, A floating unit floats the substrate above a top surface of the floating unit, In the step (A2), the laser is formed in a straight line shape on the substrate, The conveying mechanism comprises: a holding mechanism configured to hold the substrate floating above the floating unit, and A first moving mechanism configured to move the holding mechanism in a first direction, and The first moving mechanism is moved by the first motor and the second motor.
16. 16. The laser irradiation method according to claim 15, wherein, A second moving mechanism moving the holding mechanism in a second direction inclined from the first direction, and The first moving mechanism moves the second moving mechanism and the holding mechanism.
17. 17. The laser irradiation method according to claim 15, wherein the first moving mechanism moves the holding mechanism in a direction inclined from a direction perpendicular to a longitudinal direction of the linear-shaped laser light when viewed from the top.
18. 18. The laser irradiation method according to any one of claims 10 to 12, wherein, The conveying mechanism includes a tray on which the substrate is placed, and The first motor and the second motor move the tray.
19. 19. A method for manufacturing a semiconductor device, the method comprising: step (S1), generating laser; A step (S2) of irradiating the substrate with the laser light, and A step (S3) of conveying the substrate by a conveying mechanism, wherein The conveying mechanism includes a driving unit configured to convey the substrate, and The driving unit includes: a first motor that moves the conveying mechanism; a second motor that moves the conveying mechanism; a PWM driver configured to PWM-drive the first motor; an analog driver configured to linearly drive the second motor, and A control unit configured to control the analog driver and the PWM driver.
20. 20. The method for manufacturing a semiconductor device according to claim 19, wherein, When the substrate is irradiated with the laser light, the mode is switched to a high-precision mode in which the analog driver drives the second motor, and In the modes other than the high-precision mode, a mode is switched to a large torque mode in which the PWM driver drives the first motor.

Description

Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device Technical Field The present disclosure relates to a laser irradiation apparatus, a laser irradiation method, and a method for manufacturing a semiconductor device. Background Patent document 1 discloses a laser annealing apparatus for forming a polycrystalline silicon thin film. In patent document 1, a projection lens focuses laser light onto a substrate so that the laser light forms a linear irradiation region. Thereby, the amorphous silicon film is crystallized into a polysilicon film. In patent document 1, a conveying mechanism conveys a substrate in a state where the substrate floats, i.e., floats, by a floating unit. Further, the substrate is carried in and carried out at the same position in the floating unit. The conveying mechanism conveys the substrate along each side of the floating unit. Further, the substrate is circularly moved twice over the floating unit, so that substantially the entire surface of the substrate is irradiated with the laser light. Reference to the literature Patent literature Patent document 1 Japanese unexamined patent application publication No. 2018-64048 Disclosure of Invention In such a laser irradiation apparatus, it is desirable to perform laser irradiation processing at a high speed in a stable manner. Other problems and novel features that are to be addressed will become apparent from the description in this specification and drawings. According to one embodiment, a laser irradiation apparatus includes a laser light source configured to generate laser light, an optical system configured to irradiate a substrate with the laser light, a conveying mechanism configured to convey the substrate, and a driving unit configured to drive the conveying mechanism, wherein the driving unit includes a first motor and a second motor configured to move the conveying mechanism, a PWM driver configured to PWM-drive the first motor, an analog driver configured to linearly drive the second motor, and a control unit configured to control the analog driver and the PWM driver. According to one embodiment, a laser irradiation method includes a step (A1) of generating a laser, a step (A2) of irradiating a substrate with the laser, and a step (A3) of conveying the substrate by a conveying mechanism, wherein the conveying mechanism includes a driving unit configured to convey the substrate, and the driving unit includes a first motor and a second motor configured to move the conveying mechanism, a PWM driver configured to PWM-drive the first motor, an analog driver configured to linearly drive the second motor, and a control unit configured to control the analog driver and the PWM driver. According to one embodiment, a method for manufacturing a semiconductor device includes a step (S1) of generating a laser, a step (S2) of irradiating a substrate with the laser, and a step (S3) of conveying the substrate by a conveying mechanism, wherein the conveying mechanism includes a driving unit provided to convey the substrate, and the driving unit includes a first motor that moves the conveying mechanism, a second motor that moves the conveying mechanism, a PWM driver configured to PWM-drive the first motor, an analog driver configured to linearly drive the second motor, and a control unit configured to control the analog driver and the PWM driver. In such a laser irradiation apparatus, laser irradiation processing can be performed at high speed in a stable manner. Drawings Fig. 1 is a perspective view showing the overall configuration of a conveying apparatus; fig. 2 is an xy-plane view schematically showing the configuration of the conveying device; FIG. 3 is an xz sectional view schematically showing the construction of a laser irradiation apparatus; Fig. 4 is a yz cross-sectional view schematically showing the construction of the laser irradiation apparatus; fig. 5 is an xy plane view for describing a conveying operation of the conveying apparatus; FIG. 6 is an xy-plane view for describing a conveying operation of the conveying device; Fig. 7 is an xy plane view for describing a conveying operation of the conveying apparatus; Fig. 8 is a perspective view schematically showing the configuration of the conveying mechanism and the driving unit thereof; Fig. 9 is a perspective view schematically showing the configuration of the conveying mechanism; Fig. 10 is a diagram for describing an operation of the PWM driver; FIG. 11 is a diagram for describing the operation of an analog driver; FIG. 12 is a diagram for describing operation examples 1 and 2 of the conveying mechanism; Fig. 13 is an xy plane view showing an irradiation start position and an irradiation end position of laser light; FIG. 14 is a diagram for describing operation example 3 of the conveying mechanism; Fig. 15 is a perspective view showing the configuration of a conveying mechanism according to a second embodiment; Fig. 16 is a pers