CN-122029992-A - Chip pick-up device

Abstract

The chip pickup device includes a pickup head having a holder, and a chip lifting device that lifts the chip from a lower surface of the adhesive sheet to assist the holder in holding the chip. The chip jack device includes a tubular body having an inner space, a cover having an upper surface in contact with the adhesive sheet, a through hole opened in the upper surface, and an air flow path for introducing negative pressure to the upper surface, a center pin and an angle pin protruding from the through hole to jack the chip, a flow path switching unit for introducing any one of negative pressure, atmospheric pressure, and positive pressure to the air flow path, and a pipe for connecting the flow path switching unit and the air flow path without passing through the inner space.

Inventors

• Ping Mumian

Assignees

• 松下知识产权经营株式会社

Dates

Publication Date

20260512

Application Date

20240716

Priority Date

20231107

Claims (10)

1. 1. A chip pickup device is provided with: A pick-up head having a holder for holding the chip supplied onto the adhesive sheet, and A chip lifting device which lifts the chip from the lower surface of the adhesive sheet to assist the holder in holding the chip, The chip jacking device comprises: a cylindrical body having an inner space; A cover which is attached to an upper portion of the tubular body and has an upper surface that contacts the adhesive sheet, a through hole that opens on the upper surface, and an air flow path that introduces negative pressure to the upper surface; A pin protruding from the through hole to lift up the chip; A lifter that holds the pin and moves up and down in the internal space; a flow path switching part for introducing any one of negative pressure, atmospheric pressure and positive pressure into the air flow path, and And a pipe connecting the flow path switching unit and the air flow path without passing through the internal space.
2. 2. The chip pickup apparatus according to claim 1, wherein, The piping is separate from the cylindrical body.
3. 3. The chip pickup apparatus according to claim 1, wherein, The chip pickup apparatus further includes a seal member that prevents a flow of air passing through the through hole by being in contact with a surface of the pin.
4. 4. The chip pickup apparatus according to claim 3, wherein, The seal is disposed between the cylindrical body and the cover.
5. 5. The chip pickup apparatus according to claim 4, wherein, The cylindrical body further has a seal fitting portion that disposes the seal on an upper surface of the cylindrical body.
6. 6. The chip pickup apparatus according to claim 3, wherein, The seal is mounted to the back of the cover.
7. 7. The chip pickup apparatus according to claim 3, wherein, The pin has a shaft portion extending in the up-down direction with a constant thickness and a tip portion tapered toward the tip of the pin, The seal member is in contact with a surface of the shaft portion.
8. 8. The chip pickup apparatus according to claim 7, wherein, The front end of the pin rises from a standby position lower than the upper surface of the cover to jack up the chip, The dimension of the through hole of the cover in the height direction is larger than the dimension of the front end part in the height direction, When the tip of the pin is located at the standby position, the tip is entirely accommodated in the through hole.
9. 9. The chip pickup apparatus according to claim 1, wherein, The chip pickup device further includes a lifting mechanism for lifting the chip jack up device to separate the cover from the adhesive sheet or to bring the cover into contact with the adhesive sheet, The flow path switching unit is disposed to be lifted and lowered together with the chip lifting device by the lifting mechanism.
10. 10. The chip pickup apparatus according to claim 1, wherein, The cover further has a protrusion protruding in a horizontal direction, The air flow path is connected with the flow path opening of the lower surface of the protruding part and a plurality of vertical holes formed on the upper surface of the cover, One end of the pipe is connected to the flow path opening.

Description

Chip pick-up device Technical Field The present invention relates to a chip pickup device that picks up chips supplied in an aligned state to an adhesive sheet by pushing up the chips from a lower surface with pins. Background The chip pickup device lifts up chips supplied in an aligned state onto the adhesive sheet from the lower surface of the adhesive sheet with pins, and picks up (holds) with a nozzle or the like (holder). Further, a chip pickup device is known in which a pin is lifted up and a chip is peeled from an adhesive sheet while vacuum sucking the adhesive sheet against an upper surface of a chip lifting device that is in contact with a lower surface of the adhesive sheet (for example, patent documents 1 and 2). The chip pickup device (chip component supply device) of patent document 1 sucks the inner space of the supply head in which the supply pin is lifted up and down by a vacuum pump, and vacuum sucks the lower surface of the adhesive sheet from the suction hole formed in the upper surface of the supply head. In addition, the chip pickup device of patent document 2 sucks a gap between the outer periphery of the needle holder in which the pin is lifted up and down and the inner periphery of the tubular body disposed so as to surround the needle holder by a vacuum pump, and vacuum-sucks the lower surface of the adhesive sheet from suction ventilation holes formed in the upper surfaces of the needle holder and the tubular body. Prior art literature Patent literature Patent document 1 Japanese patent laid-open publication No. 2003-273195 Patent document 2 Japanese patent laid-open publication No. 2003-234396 Disclosure of Invention However, in the conventional techniques including patent document 1 and patent document 2, there is a problem that the suction response time from the start of vacuum suction to the time when the adhesive sheet is effectively vacuum sucked and the vacuum break response time from the end of vacuum suction to the time when the vacuum state is broken are long, and it is difficult to shorten the pickup time for sequentially picking up chips while relatively moving the adhesive sheet and the chip jack. That is, the apparatus of patent document 1 has a problem that the suction volume of the vacuum pump is large and the suction response time is long. Further, the apparatus of patent document 2 has a problem that the suction path of the vacuum pump is complicated and the line resistance is high, so that the suction response time and the vacuum break response time are long. Accordingly, an object of the present invention is to provide a chip pickup device capable of shortening an adsorption response time and a vacuum break response time. A chip pickup device is provided with a pickup head having a holder for holding a chip supplied to an adhesive sheet, and a chip lifting device for lifting the chip from the lower surface of the adhesive sheet to assist the holder in holding the chip. The chip jack device includes a tubular body having an internal space, a cover mounted on an upper portion of the tubular body and having an upper surface in contact with the adhesive sheet, a through hole opened in the upper surface, and an air flow path for introducing negative pressure to the upper surface, a pin protruding from the through hole to jack the chip, a lifter for holding the pin and lifting in the internal space, a flow path switching unit for introducing any one of negative pressure, atmospheric pressure, and positive pressure to the air flow path, and a pipe for connecting the flow path switching unit and the air flow path without via the internal space. According to the present invention, the adsorption response time and the vacuum break response time can be shortened. Drawings Fig. 1 is a schematic configuration diagram of a main part of a chip pickup device according to an embodiment of the present invention. Fig. 2 is a block diagram showing the structure of a chip pickup device according to an embodiment of the present invention. Fig. 3 is a perspective view showing a state in which a chip jack provided in a chip pickup apparatus according to an embodiment of the present invention is lowered. Fig. 4 is a perspective view showing a state in which a chip jack provided in a chip pickup apparatus according to an embodiment of the present invention is lifted. Fig. 5 is a plan view of a chip jack-up device provided in a chip pickup device according to an embodiment of the present invention. Fig. 6 is a partial cross-sectional view of a chip jack device provided in a chip pickup device according to an embodiment of the present invention. Fig. 7 is an exploded view of a chip jack device provided in a chip pickup device according to an embodiment of the present invention. Fig. 8 is a perspective view of a seal of a chip jack device provided in a chip pickup device according to an embodiment of the present invention. Fig. 9 (a) is a partial cross-sectional view showing a state in whi