CN-224199512-U - Brush plating type electroplating device

CN224199512UCN 224199512 UCN224199512 UCN 224199512UCN-224199512-U

Abstract

The utility model relates to a brush plating type electroplating device which comprises an electroplating liquid tank, a conductive wire mesh arranged on the electroplating liquid tank, a barrier strip paved on the conductive wire mesh and a conductive seat arranged on the electroplating liquid tank. The plating tank includes an outer tank and an inner tank located in the outer tank. The conductive wire mesh is positioned in the inner groove and is used for electrically connecting with the positive electrode of the power supply. The barrier strips are arranged along the preset advancing direction of the material belt. The barrier strip has electrical insulation properties and is permeable to the plating solution. The barrier strips are immersed in the electroplating solution in the inner tank. The conductive seat is arranged adjacent to the inner groove. The conductive seat is used for electrically connecting the negative electrode of the power supply and contacting the material belt so as to realize the electrical connection between the material belt and the negative electrode of the power supply. An electric field is formed between the conductive wire mesh and the pins of the terminals of the material tape by loading the plating solution with the inner bath of the plating bath, and direct contact between the conductive wire mesh and the terminals of the material tape is prevented by the barrier rib to prevent short circuit, thereby efficiently completing plating treatment of both sides of the pins of the terminals in a brush plating manner.

Inventors

SUN ZHENHUA
LI DAO
FAN YONG

Assignees

东莞普瑞迅表面处理科技有限公司

Dates

Publication Date: 20260505
Application Date: 20250425

Claims (8)

1. A brush plating type plating apparatus, comprising: the electroplating solution tank comprises an outer tank and an inner tank positioned in the outer tank, wherein the inner tank is used for loading electroplating solution; the conductive wire mesh is arranged on the electroplating liquid tank, is positioned in the inner tank and is used for being electrically connected with the anode of a power supply; the barrier strips are laid on the conductive wire net, are arranged along the preset advancing direction of the material belt, have electric insulation property and are permeated by the plating solution, are soaked in the plating solution of the inner groove, and The electric conduction seat is arranged on the electroplating liquid tank, is adjacent to the inner tank and is used for being electrically connected with the negative electrode of the power supply and is contacted with the material belt to realize the electric connection between the material belt and the negative electrode of the power supply.
2. The brush plating apparatus according to claim 1, wherein said outer tank and said inner tank are each an electrically insulating tank body.
3. The brush plating apparatus according to claim 1, wherein the conductive wire mesh is a platinum-titanium mesh.
4. The brush plating type electroplating device according to claim 1, wherein the barrier strip is a non-woven fabric strip.
5. The brush plating apparatus according to claim 1, wherein both ends of the barrier rib are detachably connected to an outer side of the inner tub.
6. The brush plating apparatus according to claim 1, wherein the conductive base includes a bracket connected to an outer side of the inner tub, a first cathode post mounted on the bracket, and a second cathode post mounted on the bracket, the bracket being for electrically connecting a negative electrode of a power source, the first cathode post and the second cathode post being parallel to each other, the first cathode post being for abutting a top surface at an edge of the material belt, the second cathode post being for abutting a bottom surface at the edge of the material belt.
7. The brush plating type electroplating device according to claim 6, wherein the bracket is provided with a first swing arm and a second swing arm, the angle of the first swing arm is adjustable, the first swing arm is used for installing the first cathode column, and the second swing arm is used for installing the second cathode column.
8. The brush plating apparatus according to claim 6, wherein the number of the conductive seats is two and is located outside both ends of the inner tub, respectively.

Description

Brush plating type electroplating device Technical Field The utility model relates to the technical field of electroplating, in particular to a brush plating type electroplating device. Background In the conventional electroplating process, the surface plating of the pins for the terminals is generally performed by a wheel type plating structure in which the outer peripheral side of a rotating plating wheel is in contact with the surface of the tape, thereby achieving the surface plating of the pins for the terminals. However, for some terminals with special structures, such as usb cases, it is necessary to perform electroplating (usually tin plating) on both sides of the pin of the usb case, and at this time, since the plane where the area to be electroplated on the pin is located is perpendicular to the plane where the advancing direction of the tape is located, the conventional electroplating wheel cannot precisely control the degree of adhesion with both sides of the pin of the usb case, so it is difficult to effectively perform electroplating on both sides of the pin of the usb case simultaneously. Disclosure of utility model In view of the above, the present utility model provides a brush plating type plating apparatus in which an electric field is formed between a conductive wire mesh and a lead of a terminal of a material tape by loading a plating solution in an inner bath of a plating bath, and a short circuit is prevented by preventing direct contact between the conductive wire mesh and the terminal of the material tape by a barrier strip, thereby efficiently performing plating on both sides of the lead of the terminal in a brush plating manner. A brush plating type electroplating device comprising: The electroplating solution tank comprises an outer tank and an inner tank positioned in the outer tank, wherein the inner tank is used for loading electroplating solution; The conductive wire mesh is arranged on the electroplating liquid tank, is positioned in the inner tank and is used for being electrically connected with the anode of the power supply; The barrier strips are laid on the conductive wire net, are arranged along the preset advancing direction of the material belt, have electric insulation property and are permeated by the plating solution, are soaked in the plating solution in the inner groove, and The conductive seat is arranged adjacent to the inner groove and is used for electrically connecting the negative electrode of the power supply and contacting the material belt so as to realize the electric connection between the material belt and the negative electrode of the power supply. When the brush plating type electroplating device works, the material belt advances at the liquid level of the electroplating solution in the inner groove of the electroplating liquid groove according to the preset advancing direction, and the pins of the terminals on the material belt are inserted into the electroplating solution according to the preset depth. The material belt is connected with the negative electrode of the power supply through the conductive seat to form a cathode required by electroplating, and the conductive wire mesh is electrically connected with the positive electrode of the power supply to form an anode required by electroplating. The barrier strip is used to prevent the pins of the terminals from directly contacting the conductive wire mesh to prevent shorting. Therefore, an electric field is formed between the conductive wire mesh and the pins of the terminals on the material belt, so that metal ions in the electroplating solution accumulate and precipitate on the surfaces of the pins of the terminals under the action of the electric field, thereby efficiently completing the simultaneous electroplating treatment on both sides of the pins of the terminals. Through the design, the electroplating solution is loaded by utilizing the inner groove of the electroplating liquid tank, an electric field is formed between the conductive wire mesh and the pins of the terminals of the material belt, and the barrier strip is utilized to prevent the conductive wire mesh from directly contacting the terminals of the material belt so as to prevent short circuit, so that electroplating treatment on the two sides of the pins of the terminals is efficiently completed in a brush plating mode. In one embodiment, the outer groove and the inner groove are electrically insulated groove bodies, so that the risk of electric shock of operators can be reduced, and the operation safety is improved. In one embodiment, the conductive mesh is a platinum titanium mesh. The platinum titanium mesh has good corrosion resistance, structural stability and electrical conductivity. In one embodiment, the barrier strip is a nonwoven strip. The nonwoven fabric strip has good electrical insulation, solution permeability, and abrasion resistance. In one embodiment, the two ends of the barrier strip are detachably connecte