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CN-224199513-U - Copper conductor processing is with preventing tinning stack that splashes

CN224199513UCN 224199513 UCN224199513 UCN 224199513UCN-224199513-U

Abstract

The utility model relates to the technical field of copper conductor processing, and discloses an anti-splashing tinning device for copper conductor processing, which comprises a bottom plate, wherein an electroplating tin box is fixedly arranged on the upper surface of the bottom plate, movable grooves are formed in the upper surfaces of two sides of the electroplating tin box, a baffle cover is slidably arranged in two movable grooves, fixing plates are fixedly connected to two side surfaces of the electroplating tin box, a supporting frame is fixedly connected between the upper surfaces of the two fixing plates, threaded holes are formed in the upper surfaces of the supporting frames, a screw rod is sleeved on the internal threads of the threaded holes, the bottom end of the screw rod is rotationally connected with the baffle cover, and when the anti-splashing tinning device is used, the plating solution inside the electroplating tin box can be prevented from splashing in a tinning process through the baffle cover, meanwhile, the height of the baffle cover can be adjusted, the applicability is higher, and the anti-splashing effect is better.

Inventors

  • JIN SHOUCHENG
  • WANG SHU

Assignees

  • 江苏鑫海高导新材料有限公司

Dates

Publication Date
20260505
Application Date
20250523

Claims (6)

  1. 1. The anti-splashing tinning device for copper conductor processing comprises a bottom plate (1) and is characterized in that an electrotinning box (2) is fixedly arranged on the upper surface of the bottom plate (1), movable grooves (3) are formed in the upper surfaces of two sides of the electrotinning box (2), and a baffle cover (4) is slidably arranged in each of the two movable grooves (3); Both sides face of electrotinning case (2) are all fixedly connected with fixed plate (5), two fixedly connected with support frame (6) between the upper surface of fixed plate (5), screw hole (7) have been seted up to the upper surface of support frame (6), screw rod (8) have been cup jointed to the internal thread of screw hole (7), the bottom of screw rod (8) with rotate between fender cover (4) and be connected.
  2. 2. The anti-splashing tinning device for copper conductor processing is characterized in that two limiting holes (9) are formed in the upper surface of the supporting frame (6), limiting rods (10) are sleeved in the two limiting holes (9) in a sliding mode, and the bottom ends of the two limiting rods (10) are fixedly connected with the shielding cover (4).
  3. 3. The anti-splashing tinning device for copper conductor processing is characterized in that a group of connecting plates (11) are fixedly connected to the upper surfaces of the two ends of the electrotinning box (2), a rotating rod (12) is rotatably connected between each group of connecting plates (11), limiting plates (13) are fixedly sleeved on the surfaces of the two rotating rods (12), and a circle of groove is formed in the surface of each limiting plate (13).
  4. 4. The anti-splashing tin plating device for copper conductor processing is characterized in that a press roller (14) is rotatably connected between two inner side walls of the tin plating box (2), and the press roller (14) is positioned in the middle of the tin plating box (2).
  5. 5. The anti-splashing tinning device for copper conductor processing according to claim 4, wherein the two limit rods (10) and the two limit holes (9) are symmetrically distributed on two sides of the screw rod (8), limiting blocks (15) are fixedly connected to the top ends of the two limit rods (10), and an operating panel (16) is fixedly connected to the top end of the screw rod (8).
  6. 6. The anti-splashing tinning device for copper conductor processing according to claim 5, wherein two ends of the shielding cover (4) are fixedly connected with baffle plates (17), and the two baffle plates (17) are obliquely arranged.

Description

Copper conductor processing is with preventing tinning stack that splashes Technical Field The utility model relates to the technical field of copper conductor processing, in particular to an anti-splashing tinning device for copper conductor processing. Background In the copper conductor processing process, tin plating is a key process, and aims to improve the weldability, corrosion resistance and other performances of the copper conductor, and is widely applied to various fields of electronics, electrics and the like. However, the conventional copper conductor tin plating apparatus has many problems in practical operation. During the tin plating process, gases are generated due to the electrode reaction, and the gases agitate the plating solution, so that the plating solution is easy to splash out of the plating tank. Moreover, when the copper conductor enters and exits the plating solution, impact is generated on the plating solution, and the splashing phenomenon of the plating solution is further aggravated. The splashing of the plating solution not only causes the waste of the plating solution and increases the production cost, but also can pollute the working environment and corrode peripheral equipment. If the operator is improperly protected, the splashed plating solution can also cause damage to the skin and eyes of the operator, and a great potential safety hazard exists. Disclosure of utility model Aiming at the defects of the prior art, the utility model provides an anti-splashing tinning device for copper conductor processing, which solves the problem that in the process of electroplating tin, gas is generated due to electrode reaction and can stir plating solution, so that the plating solution is easy to splash out of an electroplating tank. Moreover, when the copper conductor enters and exits the plating solution, impact is generated on the plating solution, and the splashing phenomenon of the plating solution is further aggravated. The splashing of the plating solution not only causes the waste of the plating solution and increases the production cost, but also can pollute the working environment and corrode peripheral equipment. If the operator is improperly protected, the splashed plating solution can damage the skin and eyes of the operator, so that the problem of great potential safety hazard exists. The utility model provides a splash-proof tinning device for copper conductor processing, which comprises a bottom plate, wherein an electrotinning box is fixedly arranged on the upper surface of the bottom plate, movable grooves are formed in the upper surfaces of two sides of the electrotinning box, and a baffle cover is slidably arranged in each of the two movable grooves; Fixing plates are fixedly connected to two side surfaces of the electrotinning box, a supporting frame is fixedly connected between the upper surfaces of the two fixing plates, the upper surface of support frame has offered the screw hole, the screw rod has been cup jointed to the internal thread of screw hole, the bottom of screw rod with rotate between the fender cover and be connected. According to the first preferred technical scheme, two limiting holes are formed in the upper surface of the supporting frame, limiting rods are sleeved in the two limiting holes in a sliding mode, and the bottom ends of the two limiting rods are fixedly connected with the retaining cover. According to the second technical scheme, a group of connecting plates are fixedly connected to the upper surfaces of the two ends of the electrotinning box, a rotating rod is rotatably connected between each group of connecting plates, limiting plates are fixedly sleeved on the surfaces of the two rotating rods, and a circle of groove is formed in the surface of each limiting plate. According to the preferred technical scheme III, a press roller is rotatably connected between two inner side walls of the electrotinning box, and the press roller is positioned in the middle of the electrotinning box. The four preferred technical schemes are that the two limit rods and the two limit holes are symmetrically distributed on two sides of the screw rod, limit blocks are fixedly connected to the top ends of the two limit rods, and an operation panel is fixedly connected to the top ends of the screw rod. The fifth preferred technical scheme is that two ends of the baffle cover are fixedly connected with baffle plates, and the two baffle plates are obliquely arranged. Compared with the prior art, the anti-splashing tinning device for copper conductor processing has the beneficial effects that when the anti-splashing tinning device is used, a plurality of copper conductors needing tinning pass through the limit disc on the rotating rod on one side, then pass through the lower part of the press roller and pass through the limit disc on the rotating rod on the other side, tinning can be completed in the tinning box, meanwhile, the situation of splashing in the tin