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CN-224201228-U - Valve and vacuum system

CN224201228UCN 224201228 UCN224201228 UCN 224201228UCN-224201228-U

Abstract

The application provides a valve and a vacuum system, the valve comprises a valve body, a valve plate and a first heater, a cavity is arranged in the valve body, a first valve port which is communicated with the cavity and the outside of the valve body is arranged on the valve body, the valve plate is movably arranged in the cavity and is configured to open or close the first valve port through movement, and the first heater is arranged on the outer surface of the valve body and is configured to transfer heat to the valve body through contact with the outer surface of the valve body. According to the valve, the first heater is arranged outside the valve body of the valve so as to heat the whole valve, and the uniformity of the whole temperature of the valve can be improved. Thereby greatly reducing the probability of occurrence of phenomena such as condensation, accumulation and the like, and finally enabling related process products to better meet the process requirements. In particular, the semiconductor product can better meet the process requirements.

Inventors

  • ZHANG YI
  • JIA YUANYING
  • CHEN LIN
  • SUN WEIHUA

Assignees

  • 四川九天真空科技有限公司

Dates

Publication Date
20260505
Application Date
20250418

Claims (10)

  1. 1. A valve, which is characterized by comprising a valve body, a valve plate and a first heater; The valve body is internally provided with a cavity; the valve body is provided with a first valve port which is communicated with the chamber and the outside of the valve body; the valve plate is movably arranged in the chamber and is configured to open or close the first valve port through movement; The first heater is arranged on the outer surface of the valve body and is configured to transfer heat to the valve body through contact with the outer surface of the valve body; The valve further comprises a second heater; The second heater is disposed within the chamber and configured to transfer heat to the valve body.
  2. 2. The valve of claim 1, further comprising a telescoping sleeve; the valve body is also provided with a second valve port; One end of the telescopic sleeve is connected with the valve plate, and the other end of the telescopic sleeve is connected with the first inner wall of the cavity, wherein the first inner wall of the cavity is a part of the inner wall of the cavity opposite to the first valve port; The second valve port is arranged on the side wall of the valve body, wherein the side wall of the valve body is a part with a section parallel to the telescopic direction of the telescopic sleeve; The telescopic sleeve is configured to stretch or compress under the drive of the valve plate and cover the second valve port in a stretched state.
  3. 3. The valve of claim 2, wherein the telescoping tube is sleeved over the second heater.
  4. 4. A valve according to claim 3, wherein the second heater has a spiral heating portion; the spiral heating portion spirals within the telescoping tube along an inner surface of the telescoping tube.
  5. 5. The valve of claim 1, wherein the valve body is cylindrical and has sides; the first heater has a heating surface; the heating surface surrounds and is attached to the side face of the valve body.
  6. 6. The valve of claim 5, wherein the side of the valve body is comprised of a first side and a second side; the first heater comprises a first heating part and a second heating part; The heating surface comprises a first heating surface positioned on the first heating part and a second heating surface positioned on the second heating part; The first heating surface is attached to the first side surface, and the second heating surface is attached to the second side surface.
  7. 7. The valve of claim 6, wherein the first heater further comprises a fastener; The fastener is sleeved and tightened on the first heating part and the second heating part to fix the first heating part and the second heating part on the side face of the valve body.
  8. 8. The valve of any one of claims 1 to 7, further comprising a piston assembly, an elastic member, and a connecting member; the piston assembly comprises a cylinder body and a piston rod and is arranged at one end of the valve body far away from the valve port; One end of the connecting piece is connected with the piston rod, and the other end of the connecting piece is connected with the valve plate; the piston assembly is configured to drive the valve plate away from the valve port through the connecting piece so as to open the valve port; The elastic piece is connected with the connecting piece and is configured to drive the valve plate to be close to the valve port through the connecting piece so as to close the valve port.
  9. 9. The valve of claim 8, wherein the resilient member is disposed within the cylinder; One end of the elastic piece is connected with one end of the connecting piece, which is far away from the valve plate, and the other end of the elastic piece is connected with the inner wall of the cylinder body, which is far away from one end of the valve body.
  10. 10. A vacuum system comprising a vacuum pump, a vacuum chamber and a valve according to any one of claims 1 to 9.

Description

Valve and vacuum system Technical Field The application relates to the technical field of vacuum, in particular to a valve and a vacuum system. Background In most manufacturing processes, high temperature products are usually produced during the manufacturing process, and corresponding manufacturing equipment usually involves a working chamber, a medium line, and valves for closing and opening the medium line. In the case of semiconductor fabrication, which is typically performed in a vacuum chamber, a valve is typically provided in a gas line connecting the vacuum chamber and a vacuum pump. High temperature products are easily produced during the preparation process and flow through the valve. Under the condition, because the temperature difference exists between the valve and the high-temperature product, the high-temperature product is easy to be condensed, accumulated and the like in the normal-temperature valve, thereby being unfavorable for the generation of the high-temperature product and leading the finally prepared semiconductor to not meet the requirements. That is, most of the valves currently cannot meet the requirements of the related processes in the face of the process in which the high-temperature product is generated and flows, and thus the finally obtained related process products cannot meet the requirements of the processes. Disclosure of utility model The application aims to provide a valve and a vacuum system, wherein a heater is arranged outside a valve body of the valve to heat the whole valve, so that the uniformity of the whole temperature of the valve can be improved, the occurrence probability of phenomena such as condensation and accumulation can be greatly reduced, and finally related process products can better meet the process requirements. In a first aspect, the application provides a valve, comprising a valve body, a valve plate and a first heater, wherein a cavity is formed in the valve body, a first valve port which is communicated with the cavity and the outside of the valve body is arranged on the valve body, the valve plate is movably arranged in the cavity and is configured to open or close the first valve port through movement, and the first heater is arranged on the outer surface of the valve body and is configured to transfer heat to the valve body through contact with the outer surface of the valve body. According to the valve, the first heater is arranged outside the valve body of the valve so as to heat the whole valve, and therefore the uniformity of the whole temperature of the valve can be improved. Thereby greatly reducing the probability of occurrence of phenomena such as condensation, accumulation and the like, and finally enabling related process products to better meet the process requirements. In particular, the semiconductor product can better meet the process requirements. With the combination of the first aspect, the valve further comprises a telescopic sleeve and a second heater, a second valve port is further arranged on the valve body, one end of the telescopic sleeve is connected with the valve plate, the other end of the telescopic sleeve is connected with the first inner wall of the cavity, the first inner wall of the cavity is a position, opposite to the first valve port, of the inner wall of the cavity, the second valve port is arranged on the side wall of the valve body, the side wall of the valve body is a position, the section of the side wall of the valve body is parallel to the telescopic direction of the telescopic sleeve, the telescopic sleeve is stretched or compressed under the driving of the valve plate and covers the second valve port in a stretched state, and the second heater is arranged in the cavity and is configured to transfer heat to the valve body. According to the valve, the second heater is arranged in the cavity of the valve body, and the first heater arranged on the outer surface of the valve body is combined, so that the valve body is heated from the inside and the outside of the valve body respectively by the first heater and the second heater, and the uniformity of the overall temperature of the valve is further improved. Thereby greatly reducing the probability of coagulation, accumulation and other phenomena, and finally enabling the related process products to better meet the process requirements. With reference to the first aspect, optionally, the telescopic sleeve is sleeved over the second heater. According to the valve, the telescopic sleeve is sleeved on the second heater, so that the space layout in the valve body cavity is optimized. And the telescopic sleeve is sleeved on the second heater, so that the second heater can directly heat the telescopic sleeve through contact, and the first heater and the second heater respectively directly heat the valve body and the telescopic sleeve in the valve body, so that the uniformity of the overall temperature of the valve is further improved, the occurrence probabil