CN-224201995-U - Cooling device is used in production of solidification epoxy

Abstract

The utility model belongs to the technical field of epoxy glue production, in particular to a cooling device for producing solidified epoxy glue, which comprises a cooling box, wherein a cooling mechanism and a circulating mechanism are respectively arranged in the cooling box, the cooling mechanism comprises a mounting box, the epoxy glue is arranged in the mounting box to realize fixed clamping, so that the cooling action is facilitated, the circulating mechanism comprises a circulating water pump, and the circulating water pump realizes the action of circulating cooling water, so that the cooling application is facilitated. This cooling device is used in production of solidification epoxy glue, through setting up cooling body and circulation mechanism, cooling body passes through the mounting box to the fixed clamping of epoxy glue, and circulation mechanism uses cooling water circulation cooling through circulating water pump, is convenient for cool off and uses, has solved current device and has cooled epoxy glue through the water cooling, and the temperature of coolant liquid itself can rise, and the reuse cools off the technical problem that can influence the cooling effect to epoxy glue.

Inventors

• XU MIAOMIAO
• LIU SHENGMING
• YU LEI
• ZHANG FENGGANG
• CHENG YUAN
• LI DAN
• ZHANG CHAO
• XIA QI

Assignees

• 池州科成新材料开发有限公司

Dates

Publication Date

20260505

Application Date

20250508

Claims (7)

1. 1. The cooling device for producing the solidified epoxy glue comprises a cooling box (1) and is characterized in that a cooling mechanism and a circulating mechanism are respectively arranged in the cooling box (1); the circulating mechanism is positioned below the cooling mechanism; the cooling mechanism comprises a mounting box (2), epoxy glue is arranged in the mounting box (2) to realize fixed clamping, and cooling is convenient to perform; The circulating mechanism comprises a circulating water pump (3), and the circulating water pump (3) is used for realizing the circulating cooling of cooling water, so that the cooling operation is convenient.
2. 2. The cooling device for producing the cured epoxy glue according to claim 1, wherein the cooling mechanism further comprises an installation pressing plate (201), an upper cooling groove (202) is formed in the surface of the installation pressing plate (201), sliding rods (203) are fixedly connected to the surface of the installation pressing plate (201), the two sliding rods (203) are symmetrically distributed by taking the axis in the width direction of the installation pressing plate (201) as the center, compression springs (204) are arranged on the outer side of the sliding rods (203), and two ends of each compression spring (204) are fixedly connected with the surface of the installation pressing plate (201) and the top of the installation box (2) respectively.
3. 3. The cooling device for producing the cured epoxy glue according to claim 2, wherein a connecting plate (205) is fixedly connected to the top end of the sliding rod (203), a handle (206) is fixedly connected to the upper surface of the connecting plate (205), a lifting cylinder (207) is fixedly connected to the top of the cooling box (1), the output end of the lifting cylinder (207) is fixedly connected with the upper surface of the mounting box (2), and the two lifting cylinders (207) are symmetrically distributed with the axis in the width direction of the mounting box (2) as the center.
4. 4. The cooling device for producing the cured epoxy glue according to claim 1, wherein the bottom of the installation box (2) is provided with an installation groove (208), the surface of the installation groove (208) is provided with a lower cooling hole (209), both sides of the installation box (2) are fixedly connected with guide sliding blocks (210), the surface of the guide sliding blocks (210) is slidingly connected with guide rods (211), and the upper ends of the two guide rods (211) are fixedly connected with the top of the cooling box (1).
5. 5. The cooling device for producing the cured epoxy glue according to claim 4, wherein the circulating mechanism further comprises a separation plate (301), the surface of the separation plate (301) is fixedly connected with the inner wall of the cooling box (1), the separation plate (301) is positioned below the mounting box (2), the surface of the separation plate (301) is provided with a communication groove (302), the surface of the separation plate (301) is respectively fixedly connected with the lower ends of the two guide rods (211), and the surface of the separation plate (301) is fixedly connected with a temperature sensor (303).
6. 6. The cooling device for producing the cured epoxy glue according to claim 5, wherein a stirring rod (304) is arranged below the partition plate (301), two ends of the stirring rod (304) are rotatably connected with the inner wall of the cooling box (1), a stirring motor (305) is fixedly connected to the surface of the cooling box (1), and an output shaft of the stirring motor (305) is fixedly connected with one end of the stirring rod (304) through a coupling.
7. 7. The cooling device for producing the cured epoxy glue, as set forth in claim 1, characterized in that the circulating water pump (3) is located below the cooling box (1), a water inlet of the circulating water pump (3) is fixedly communicated with the bottom of the cooling box (1), a water outlet of the circulating water pump (3) is fixedly connected with a circulating water pipe (306), one end of the circulating water pipe (306) is fixedly connected with a shunt pipe (307), the surface of the shunt pipe (307) is fixedly connected with the inner wall of the cooling box (1), a spray pipe (308) is fixedly connected with the surface of the shunt pipe (307), and a plurality of the spray pipes (308) are distributed in a linear array along the length direction of the shunt pipe (307).

Description

Cooling device is used in production of solidification epoxy Technical Field The utility model relates to the technical field of epoxy glue production, in particular to a cooling device for producing cured epoxy glue. Background The utility model discloses a solidification epoxy glue cooling device (bulletin number: CN 220624576U) on Chinese patent website, although solved traditional device and sprayed through the shower head, the angle of shower head can not change, can't carry out even spraying and at the in-process that sprays to glue the goods, because of the effect of water pressure, the goods take place the off normal easily, causes the shower head to carry out effectual spray cooling to the goods of gluing, sprays the worse technical problem, nevertheless still has following problem: in the in-service use, only cool down the epoxy glue through the water cooling, the coolant liquid absorbs the heat of epoxy glue after spraying the cooling, and the temperature of coolant liquid itself can rise, and the cooling effect to the epoxy glue can be influenced in the cooling of recycling again to be inconvenient for use. Disclosure of utility model Based on the technical problems that the cooling effect on the epoxy glue is affected by cooling through water cooling in the prior art, the cooling liquid absorbs the heat of the epoxy glue after spraying and cooling, the temperature of the cooling liquid can rise, and the cooling liquid can be recycled for cooling again, the utility model provides a cooling device for producing the solidified epoxy glue. The cooling device for producing the cured epoxy adhesive comprises a cooling box, wherein a cooling mechanism and a circulating mechanism are respectively arranged in the cooling box. The circulation mechanism is located below the cooling mechanism. The cooling mechanism comprises a mounting box, epoxy glue is placed in the mounting box to achieve fixed clamping, and cooling is convenient to conduct. The circulating mechanism comprises a circulating water pump, and the circulating water pump is used for realizing the action of circulating cooling water and facilitating the cooling use. Preferably, the cooling mechanism further comprises a mounting pressing plate, an upper cooling groove is formed in the surface of the mounting pressing plate, sliding rods are fixedly connected to the surface of the mounting plate, the two sliding rods are symmetrically distributed with the axis of the width direction of the mounting pressing plate as the center, compression springs are arranged on the outer sides of the sliding rods, and two ends of each compression spring are fixedly connected with the surface of the mounting pressing plate and the top of the mounting box respectively. Preferably, the top fixedly connected with connecting plate of slide bar, the upper surface fixedly connected with handle of connecting plate, the top fixedly connected with lift cylinder of cooling tank, the output of lift cylinder with the upper surface fixedly connected with of installation case, two the lift cylinder is symmetrical distribution with the axis of installation case width direction is the center. Preferably, the mounting groove has been seted up to the bottom of mounting box, the lower cooling hole has been seted up to the surface of mounting groove, the equal fixedly connected with direction slider in both sides of mounting box, the surface sliding connection of direction slider has the guide bar, two the upper end of guide bar all with the top fixed connection of cooling box. Preferably, the circulation mechanism further comprises a separation plate, the surface of the separation plate is fixedly connected with the inner wall of the cooling box, the separation plate is located below the installation box, a communication groove is formed in the surface of the separation plate, the surface of the separation plate is fixedly connected with the lower ends of the guide rods, and a temperature sensor is fixedly connected with the surface of the separation plate. Preferably, the stirring rod is arranged below the partition plate, two ends of the stirring rod are both rotationally connected with the inner wall of the cooling box, a stirring motor is fixedly connected with the surface of the cooling box, and an output shaft of the stirring motor is fixedly connected with one end of the stirring rod through a coupler. Preferably, the circulating water pump is located the below of cooling tank, circulating water pump's water inlet with the bottom fixed intercommunication of cooling tank, circulating water pump's delivery port fixedly connected with circulating water pipe, circulating water pipe's one end fixedly connected with shunt tubes, the surface of shunt tubes with the inner wall fixed connection of cooling tank, the surface fixedly connected with shower of shunt tubes, a plurality of the shower is followed the length direction of shunt tubes is linear array and distributes. The ben