CN-224203116-U - Biochip structure
Abstract
The utility model discloses a biochip structure, which comprises a conductive base layer, a plurality of conductive convex points distributed in an array form, an insulating layer and a gold plating layer, wherein the conductive convex points are formed on one side surface of the conductive base layer, the conductive convex points and the conductive base layer are integrally formed, the insulating layer covers one side surface of the conductive base layer with the conductive convex points, an opening for exposing a part of the conductive convex points is formed on the insulating layer, the exposed part is used as an electrode point, and the electrode point can be further provided with the gold plating layer. The structure realizes electric field focusing through the array design of the conductive convex points, reduces the working voltage requirement and the energy loss, eliminates interface contact resistance through the integrated molding design, improves the current transmission efficiency, accurately controls the action range of an electric field through the opening design of the insulating layer, enhances the space targeting, omits the design of a transition layer and a groove, reduces the manufacturing complexity and the cost, is suitable for the efficient transdermal delivery of active ingredients, and is not limited to beauty and medicine treatment scenes.
Inventors
- Yang Bingcong
Assignees
- 广州姿洁科学技术有限公司
Dates
- Publication Date
- 20260505
- Application Date
- 20250509
Claims (9)
- 1. A biochip-type structure is disclosed, which comprises a substrate, characterized by comprising the following steps: A conductive base layer (1); A plurality of conductive bumps (2) formed on one side surface of the conductive base layer (1); an insulating layer (3) covering one side surface of the conductive base layer (1) with the conductive bumps (2); Wherein, an opening (4) for exposing a part of the conductive bump (2) is formed on the insulating layer (3).
- 2. The biochip structure according to claim 1, wherein the plurality of conductive bumps (2) are distributed in an array.
- 3. The biochip structure according to claim 1, characterized in that the conductive bumps (2) are integrally formed with the conductive substrate (1).
- 4. The biochip structure according to claim 1, characterized in that a portion of each conductive bump (2) exposed outside the insulating layer (3) serves as an electrode point (21).
- 5. The biochip structure according to claim 4, further comprising a gold plating layer (5) formed on the electrode dots (21).
- 6. The biochip structure according to claim 1, characterized in that the surface of a portion of the conductive bump (2) exposed is planar.
- 7. The biochip structure according to claim 1, characterized in that the spacing between two adjacent conductive bumps (2) is 1-999 micrometers.
- 8. The biochip structure according to claim 1 or 2, characterized in that the plurality of conductive bumps (2) are distributed in a circular array.
- 9. The biochip structure according to claim 1, characterized in that the conductive bumps (2) are truncated cone-shaped and the openings (4) are circular openings.
Description
Biochip structure Technical Field The utility model relates to the field of biochips, in particular to a biochip structure. Background Electroporation is a very unique physical phenomenon of cells, and under the action of an electric field, particularly when the field intensity exceeds a certain threshold value, compact structures formed by keratinocytes and intercellular lipid layers are physically rearranged to form instantaneous tunnels, so that efficient transdermal delivery of drugs/components is realized. However, conventional monopolar/bipolar electroporation techniques still face the following technical bottlenecks in practical applications: 1. Low energy utilization efficiency The existing bipolar electroporation system needs to rely on voltage gradients of up to 100V or more to generate effective electric field strength, but the energy actually applied to the target tissue accounts for only 10% -20%. A large amount of energy is wasted in the form of heat loss or non-specific ionization, so that the power consumption of the equipment is high, the cruising ability is poor, and the safety risks such as skin burn and the like can be caused by continuous high-voltage output. 2. Insufficient space targeting The traditional electrode configuration adopts single-point or bipolar plane arrangement, and the electric field distribution of the traditional electrode configuration shows dispersive characteristics. Non-target areas such as subcutaneous nerves, blood vessels are susceptible to high-intensity electric fields, resulting in a narrow therapeutic window. Experimental data shows that conventional two-electrode systems have a skin surface electric field strength of only 30V/cm at an energy density of 1.5J/cm 2, and that field strength decay is exponentially related to tissue depth. 3. Limited penetration depth Limited by the law of electric field attenuation, monopolar electroporation has a field strength retention of less than 20% at a frequency of 1Hz in the dermis. When the electric field penetrates to the depth of 4mm below the skin, the field intensity is attenuated to be below 10V/cm, and the treatment requirement of deep focus (such as scar tissue and follicular unit) is difficult to meet. Chinese patent publication No. CN115637225A discloses a microelectrode structure and a preparation method thereof, wherein the microelectrode structure comprises a substrate layer, a transition layer positioned at one side of the substrate layer, a groove penetrating through the transition layer, an electrode layer positioned at one side of the transition layer, which is far away from the substrate layer, the electrode layer covers the bottom and the side wall of the groove and covers the surface of the transition layer, which is far away from the substrate layer, an insulating layer positioned in the groove and positioned at one side of the electrode layer, which is far away from the substrate layer, the insulating layer exposes out a part of the electrode layer positioned at one side of the transition layer, which is far away from the substrate layer, to form a plurality of microelectrode units, and the microelectrode units are arranged in an array. The microelectrode structure is based on the regular array arrangement of a plurality of microelectrode units with smaller sizes, the number of microelectrodes in a unit area is large, the electric field distribution is more uniform through the microcosmization and regular arrangement mode of the electrodes, the microcosmized electric field can effectively focus the electric field to cells, and the microelectrode structure of the multilayer composite structure has the advantages of being strong in inertia, good in stability, good in biocompatibility and the like. Although a plurality of microelectrode units are also formed to realize the electroporation technology, the electroporation device adopts a multi-layer composite structure (comprising a basal layer, a transition layer, an electrode layer and an insulating layer), and has complex structure, so that the preparation process is complicated and the cost is high. In addition, the interfaces of the multi-layer materials may suffer from poor adhesion or stress concentration problems, affecting long-term stability and thus the lifetime of the product to which the structure is applied. Therefore, how to overcome the above-mentioned drawbacks has become an important issue to be solved by the person skilled in the art. Disclosure of utility model The utility model provides a biochip structure for solving the problems of low energy utilization efficiency, insufficient space targeting, limited penetration depth, complex structure, complicated preparation process and high cost of the existing biochip. In order to achieve the above purpose, the present utility model adopts the following technical scheme: A biochip structure comprising: A conductive base layer 1; A plurality of conductive bumps 2 formed on one side surfac