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CN-224203221-U - Semiconductor power device test fixture with temperature control function

CN224203221UCN 224203221 UCN224203221 UCN 224203221UCN-224203221-U

Abstract

The application belongs to the field of device testing, and particularly discloses a semiconductor power device testing jig with temperature control, which comprises a jig base, a flip cover, a temperature control assembly and a conduction module, wherein the testing jig comprises a device main body crimping zone and a pin crimping zone which are arranged between the jig base and the flip cover, the temperature control assembly is arranged in the device main body crimping zone, the conduction module is arranged in the pin crimping zone, when the device body is tested, the main body part of the device body is positioned in the device main body crimping zone, and the pin part of the device body is positioned in the pin crimping zone. Through the structural design of the testing device, the temperature of the device during testing can be monitored, the temperature can be regulated and controlled according to the testing requirement, and the accuracy of the testing result of the semiconductor power device is improved.

Inventors

  • LIU ZHAOQING
  • ZHANG XIN
  • WANG RUIXING
  • Wei Zitong
  • ZHOU LANG

Assignees

  • 武汉精立电子技术有限公司
  • 武汉精测电子集团股份有限公司

Dates

Publication Date
20260505
Application Date
20250429

Claims (10)

  1. 1. The utility model provides a take semiconductor power device test fixture of control by temperature change, its characterized in that, including tool base (1), flip (2), control by temperature change subassembly (3) and switch on module (4), this test fixture is including being located device main part crimping district and stitch crimping district between tool base (1) and flip (2), control by temperature change subassembly (3) set up in device main part crimping district, switch on module (4) set up in stitch crimping district, and during the device body test, the main part of device body is located device main part crimping district, and the stitch part of device body is located stitch crimping district.
  2. 2. The semiconductor power device testing jig with temperature control according to claim 1, wherein the temperature control component (3) is disposed on the jig base (1) and/or the flip (2), and the conduction module (4) is disposed on the jig base (1) and/or the flip (2).
  3. 3. The semiconductor power device testing jig with temperature control according to claim 2, wherein the temperature control component (3) is disposed on the flip cover (2), the conducting module (4) is disposed on the jig base (1), the testing jig further comprises a device main body compressing component (5) and a stitch compressing component (6), the device main body compressing component (5) is disposed in a device main body compression region, and the stitch compressing component (6) is disposed in a stitch compression region.
  4. 4. A semiconductor power device testing jig with temperature control according to claim 3, wherein the device body pressing assembly (5) comprises a device body pressing head (51), a device body base (52) and a plurality of first springs (53), the device body pressing head (51) is fixedly connected to one side of the flip cover (2) facing the jig base (1), and the device body base (52) is connected to the jig base (1) through the plurality of first springs (53).
  5. 5. The semiconductor power device testing jig with temperature control according to claim 4, wherein the temperature control assembly (3) comprises a heating plate (31), a copper block (32) and a temperature sensor (33), the device body pressure head (51) is fixedly connected to the flip cover (2) through the copper block (32), the heating plate (31) is fixedly connected to one side, away from the device body pressure head (51), of the copper block (32) for heating, and the temperature sensor (33) is fixedly connected between the copper block (32) and the device body pressure head (51) for measuring and feeding back temperature.
  6. 6. The semiconductor power device testing jig with temperature control according to claim 5, wherein the conducting module (4) comprises a pin base (41), and the pin base (41) is detachably connected with the jig base (1).
  7. 7. The semiconductor power device testing jig with temperature control according to claim 6, wherein the pin pressing assembly (6) comprises a pin pressing head (61) and a plurality of second springs (62), the pin pressing head (61) is fixedly connected to one side, facing the jig base (1), of the flip cover (2), and the pin base (41) is connected to the jig base (1) through the plurality of second springs (62).
  8. 8. The semiconductor power device testing jig with temperature control according to claim 6, wherein the pin base (41) is a three-pin base (411) or a four-pin base (412).
  9. 9. The testing fixture for the semiconductor power device with the temperature control according to claim 1, wherein the flip cover (2) and the fixture base (1) are arranged in a matched mode, and when the fixture is in a buckling state, the flip cover (2) and the fixture base (1) are fixed through a clamping mechanism.
  10. 10. The semiconductor power device testing jig with temperature control according to claim 7, wherein the heating sheet (31) is made of ceramic and internally provided with heating wires, the jig base (1) and the stitch indenter (61) are made of synthetic stone, polyphenylene sulfide or polyether ether ketone, and the device body indenter (51) is made of a high heat conduction metal material.

Description

Semiconductor power device test fixture with temperature control function Technical Field The application belongs to the field of device testing, and particularly relates to a semiconductor power device testing jig with temperature control. Background In the high-temperature and high-pressure test process of the packaging of the third-generation semiconductor material silicon carbide power device TO (a semiconductor packaging form), a single packaging needs TO be subjected TO high-temperature heating test, and the temperature of the single packaging is controlled through sensor feedback. However, the existing test fixture is usually not provided with a heating device, and the test fixture is required to be put into a high-temperature furnace body for integral heating during test, but when a plurality of devices are tested at the same time, the temperature of one device cannot be controlled independently, so that the test result is inaccurate. Disclosure of utility model Aiming at the defects of the prior art, the application provides a semiconductor power device testing jig with temperature control, which aims to solve the problem that a plurality of testing jigs are simultaneously put into a high-temperature furnace body to be heated integrally, and the temperature of a device in one of the testing jigs cannot be controlled independently, so that the testing result is inaccurate. The application provides a semiconductor power device testing jig with temperature control, which specifically comprises a jig base, a flip cover, a temperature control component and a conduction module, wherein the testing jig comprises a device main body crimping area and a pin crimping area which are arranged between the jig base and the flip cover, the temperature control component is arranged in the device main body crimping area, the conduction module is arranged in the pin crimping area, when a device body is tested, the main body part of the device body is positioned in the device main body crimping area, and the pin part of the device body is positioned in the pin crimping area. Compared with the prior art, the device body is tested by adopting the technical scheme, the main body part of the device body is positioned in the device body crimping area, the pin part of the device body is positioned in the pin crimping area, the temperature control assembly can heat the device body, the testing temperature of the device body is changed by adjusting the temperature of the temperature control assembly, when a plurality of device bodies are required to be tested, a plurality of devices can be adopted for simultaneous operation, the device body in each device can be heated to different testing temperatures according to the requirement, and the beneficial effect of improving the accuracy of the testing result of the device body can be obtained. As a further preferable mode, the temperature control component is arranged on the jig base and/or the flip cover, and the conduction module is arranged on the jig base and/or the flip cover. As a further preferred aspect, the temperature control component is disposed on the flip cover, the conduction module is disposed on the fixture base, the test fixture further includes a device main body pressing component and a pin pressing component, the device main body pressing component is disposed in a device main body crimping area, and the pin pressing component is disposed in a pin crimping area. As a further preferred aspect, the device body pressing assembly includes a device body pressing head, a device body base, and a plurality of first springs, where the device body pressing head is fixedly connected to a side of the flip cover facing the jig base, and the device body base is connected to the jig base through a plurality of first springs. As a further preferred option, the temperature control assembly comprises a heating plate, a copper block and a temperature sensor, the device main body pressure head is fixedly connected to the flip cover through the copper block, the heating plate is fixedly connected to one side, deviating from the device main body pressure head, of the copper block for heating, and the temperature sensor is fixedly connected between the copper block and the device main body pressure head for measuring and feeding back temperature. As a further preferable aspect, the conducting module includes a pin base, and the pin base is detachably connected with the jig base. As a further preferable mode, the pin pressing assembly comprises a pin pressing head and a plurality of second springs, the pin pressing head is fixedly connected to one side, facing the jig base, of the flip cover, and the pin base is connected to the jig base through the plurality of second springs. As a further preferred aspect, the pin base is a three pin base or a four pin base. As a further preferable mode, the flip cover and the jig base are matched, and when the jig is in a buckling state, the flip