CN-224203415-U - Sonar and receiving module applied to sonar

CN224203415UCN 224203415 UCN224203415 UCN 224203415UCN-224203415-U

Abstract

The utility model discloses a sonar and a receiving module applied to the sonar, wherein the receiving module comprises at least two circuit board assemblies stacked along the height direction, each circuit board assembly respectively comprises a bottom cover and at least one circuit board, the bottom cover is provided with at least one board groove, the circuit boards are locked on the bottom cover and are accommodated in the board groove, the bottom cover of one circuit board assembly positioned above closes the notch of the board groove of the bottom cover of one circuit board assembly positioned below, and the heat dissipation boss of the bottom cover of one circuit board assembly positioned above protrudes to the chip of the circuit board of one circuit board assembly positioned below.

Inventors

Deng Yuanzhu
SUN FENG
YANG BIN
Hui rui
Jiang Zhiju

Assignees

云南保利天同水下装备科技有限公司
海底鹰深海科技股份有限公司

Dates

Publication Date: 20260505
Application Date: 20250506

Claims (10)

1. The receiving module for sonar is characterized by comprising at least two circuit board assemblies stacked along the height direction, wherein each circuit board assembly comprises a bottom cover and at least one circuit board, the bottom cover is provided with at least one board groove, the circuit boards are locked on the bottom cover and are accommodated in the board groove, the bottom cover of one circuit board assembly positioned above closes the notch of the board groove of the bottom cover of one circuit board assembly positioned below, and the heat dissipation boss of the bottom cover of one circuit board assembly positioned above protrudes to the chip of the circuit board of one circuit board assembly positioned below.
2. The receiving module of claim 1, wherein the heat dissipating boss of the bottom cover of the upper one of the circuit board assemblies protrudes into the board slot of the bottom cover of the lower one of the circuit board assemblies.
3. The receiving module of claim 2, wherein the bottom cover has two of the board slots arranged side-by-side along a length of the bottom cover, and the circuit board assembly includes two of the circuit boards, each of the circuit boards being received in each of the board slots of the bottom cover.
4. The receiving module of claim 3, wherein the heat dissipating boss of the bottom cover extends along a length direction of the bottom cover, wherein the bottom cover has an avoidance groove, the avoidance groove is communicated with the two plate grooves, and the avoidance groove is used for avoiding the heat dissipating boss of the bottom cover above.
5. The receiving module of claim 4, wherein opposite ends of the bottom cover have a notch, respectively, each notch is respectively connected to each board slot, wherein opposite ends of the heat dissipating boss of the top cover extend to each notch of the bottom cover below.
6. The receiving module of any one of claims 1 to 5, wherein a heat dissipating silicone is provided between the heat dissipating boss of the bottom cover and the chip of the circuit board.
7. The receiving module of claim 5, wherein a heat dissipating silicone is disposed between the heat dissipating boss of the bottom cover and the chip of the circuit board, and a heat dissipating silicone is disposed between the heat dissipating boss of the top cover and the bottom cover below.
8. The receiving module of any one of claims 1 to 5, wherein each of the opposite ends of the bottom covers of the circuit board assemblies has a pin hole, respectively, wherein the receiving module includes two positioning pins, one of which is inserted into the pin hole of one end of the bottom covers and the other of which is inserted into the pin hole of the other end of the bottom covers.
9. The receiving module according to any one of claims 1 to 5, wherein the receiving module comprises four circuit board assemblies, opposite ends of the bottom covers of the three circuit board assemblies located at the upper side are respectively provided with at least one screw hole penetrating, opposite ends of the bottom plates of the one circuit board assembly located at the lower side are respectively provided with at least one screw hole, wherein the receiving module comprises at least two screws, one end of each screw extends to the screw hole of the bottom plate of the one circuit board assembly located at the lower side after sequentially penetrating through each screw hole of the bottom covers of the three circuit board assemblies located at the upper side, and the screw and the one bottom cover are screwed.
10. Sonar, characterized by comprising: Launch vehicle, and -A receiving bay, wherein the receiving bay comprises a receiving bay body and a receiving module according to any one of claims 1 to 9, the receiving bay body having a receiving cavity, the receiving module being received in the receiving cavity of the receiving bay body, the receiving bay body being mounted to the transmitting bay.

Description

Sonar and receiving module applied to sonar Technical Field The utility model relates to sonar, in particular to sonar and a receiving module applied to the sonar. Background The sonar is a core product for ocean exploration and consists of a receiving cabin and a transmitting cabin, when the sonar works, a transmitting transducer of the transmitting cabin transmits sound wave signals with specific frequency, power and waveform, and a receiving transducer of the receiving cabin receives the reflected sound wave signals and then processes the reflected sound wave signals by a receiving module of the receiving cabin so as to realize the exploration of underwater targets. In the chinese patent application with publication number CN118604791a, the inventor discloses a sonar, whose receiving cabin is composed of a receiving cabin body and a receiving module which is accommodated in an accommodating cavity of the receiving cabin body, wherein the receiving module includes a bottom cover, a first receiving module circuit board, a first copper pipe, a partition board, a second receiving module circuit board, a second copper pipe and a top cover, and these components are mutually installed according to a design scheme. The receiving module in the prior art utilizes the first copper pipe and the second copper pipe to radiate heat of the chip of the first receiving module circuit board and the chip of the second receiving module circuit board, which not only leads to complex structure and higher assembly cost of the receiving module, but also leads to larger overall size of the receiving module due to the space reserved by the first copper pipe and the second copper pipe of the receiving module, which is unfavorable for the miniaturization of sonar. Disclosure of utility model It is an object of the present utility model to provide a sonar and a receiving module applied to the sonar, in which the receiving module does not need to use a copper pipe for heat dissipation, and therefore the receiving module of the present utility model can have a smaller size and lower cost than the receiving module of the prior art. An object of the present utility model is to provide a sonar and a receiving module applied to the sonar, in which the receiving module allows a heat radiation boss of a bottom cover of a circuit board assembly located above to protrude toward a chip of a circuit board of the circuit board assembly located below, and heat generated by the chip when operating can be rapidly radiated through the bottom cover, so that the receiving module of the present utility model does not need to radiate heat using a copper pipe. An object of the present utility model is to provide a sonar and a receiving module applied to the sonar, in which the heat dissipating boss of the bottom cover located above can be sunk to the board groove of the bottom cover located below, so that the heat dissipating boss of the bottom cover located above can be more adjacent to the chip of the circuit board located below, to facilitate improvement of the heat dissipating effect of the receiving module. According to one aspect of the present utility model, there is provided a receiving module for sonar, comprising at least two circuit board assemblies stacked in a height direction, each of the circuit board assemblies including a bottom cover and at least one circuit board, the bottom cover having at least one board groove, the circuit board being locked to the bottom cover and being received in the board groove, wherein the bottom cover of one of the circuit board assemblies located above closes a notch of the board groove of the bottom cover of one of the circuit board assemblies located below, and a heat dissipating boss of the bottom cover of one of the circuit board assemblies located above protrudes toward a chip of the circuit board of one of the circuit board assemblies located below. According to one embodiment of the present utility model, the heat dissipating boss of the bottom cover of the upper one of the circuit board assemblies protrudes into the board groove of the bottom cover of the lower one of the circuit board assemblies. According to one embodiment of the utility model, the bottom cover has two board slots arranged side by side along the length direction of the bottom cover, and correspondingly, the circuit board assembly comprises two circuit boards, and each circuit board is respectively accommodated in each board slot of the bottom cover. According to one embodiment of the utility model, the heat dissipation boss of the bottom cover extends along the length direction of the bottom cover, wherein the bottom cover is provided with an avoidance groove, the avoidance groove is communicated with the two plate grooves, and the avoidance groove is used for avoiding the heat dissipation boss of the bottom cover above. According to one embodiment of the present utility model, opposite ends of the bottom cover are respectively prov