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CN-224203497-U - Be used for centre gripping optical prism and disk laser to beat integrative device of mark

CN224203497UCN 224203497 UCN224203497 UCN 224203497UCN-224203497-U

Abstract

The utility model discloses an integrated laser marking device for clamping an optical prism and a wafer, which comprises a base, wherein a Z-axis vertical moving rod is arranged on the base, a Y-axis graduated scale is arranged on the Z-axis vertical moving rod, one side of the Y-axis graduated scale is connected with the Y-axis horizontal moving rod, the upper end surface of the Y-axis horizontal moving rod is provided with an X-axis graduated scale, the upper end of the Y-axis horizontal moving rod is also provided with an L-shaped boss, the lower end of the Y-axis horizontal moving rod is connected with the X-axis horizontal moving rod, the Y-axis graduated scale is provided with a Z-axis fixing bolt for adjusting the movement of the Z-axis vertical moving rod, the Y-axis horizontal moving rod is provided with a Y-axis fixing bolt for adjusting the movement of the Y-axis horizontal moving rod, the X-axis fixing bolt is used for moving the X-axis horizontal moving rod, the X-axis horizontal moving rod is used for clamping and locking of optical prisms and wafers with different specifications according to the three-dimensional movement of XYZ, the use and manufacturing of marking leaning bodies with different specifications are reduced, and the laser marking efficiency is improved.

Inventors

  • FANG QIONG
  • WU XIANGYOU
  • HUANG YONG
  • CHEN JIGEN
  • LIN ZHISHU
  • LI GUANGWEI

Assignees

  • 福建睿创光电科技有限公司

Dates

Publication Date
20260505
Application Date
20250507

Claims (8)

  1. 1. The integrated device for clamping the optical prism and the wafer laser marking is characterized by comprising a base (1), wherein a Z-axis vertical moving rod (2) is arranged on the base (1), a Y-axis graduated scale (3) is arranged on the Z-axis vertical moving rod (2), one side of the Y-axis graduated scale (3) is connected with a Y-axis horizontal moving rod (5), the upper end face of the Y-axis horizontal moving rod (5) is provided with an X-axis graduated scale (7), the upper end of the Y-axis horizontal moving rod (5) is also provided with an L-shaped boss (8), the lower end of the Y-axis horizontal moving rod (5) is connected with an X-axis horizontal moving rod (9), a Z-axis fixing bolt (4) for adjusting the movement of the Z-axis vertical moving rod (2) is arranged on the Y-axis graduated scale (3), a Y-axis fixing bolt (6) is arranged on the Y-axis horizontal moving rod (5), the X-axis horizontal moving rod (9) is provided with an X-axis fixing bolt (10), and the X-axis horizontal moving rod (10) is used for adjusting the movement of the Y-axis horizontal moving rod (5).
  2. 2. The integrated device for clamping the optical prism and the wafer laser marking according to claim 1, wherein two ends of the Y-axis graduated scale (3) are horizontally extended and provided with Y-axis horizontal limiting grooves (11), the Y-axis horizontal limiting grooves (11) are connected with two ends of the X-axis horizontal moving rod (9), and the Y-axis horizontal limiting grooves (11) are used for limiting the X-axis horizontal moving rod (9) to horizontally move along the Y-axis.
  3. 3. The integrated device for clamping an optical prism and laser marking of a wafer according to claim 1, wherein the X-axis horizontal moving rod (9) is provided with an optical prism (12) to be marked, and a laser marking machine (14) is arranged above the optical prism (12).
  4. 4. The integrated device for clamping an optical prism and laser marking a wafer according to claim 3, wherein the optical prism (12) is clamped and locked with the Y-axis horizontal moving rod (5) through the X-axis horizontal moving rod.
  5. 5. The integrated device for clamping an optical prism and laser marking of a wafer according to claim 1, wherein the X-axis horizontal moving rod (9) is further provided with a wafer (13) to be marked, and the wafer (13) is clamped and locked through an L-shaped boss (8) of the Y-axis horizontal moving rod (5).
  6. 6. The device for clamping an optical prism and laser marking a wafer as set forth in claim 3, wherein the laser marking machine (14) is a semiconductor pumped solid state laser.
  7. 7. The integrated device for clamping an optical prism and laser marking of a wafer according to claim 1, wherein the bottom of the base (1) is provided with a non-slip pad (15).
  8. 8. The integrated device for clamping an optical prism and laser marking a wafer according to claim 1, wherein a protective layer is arranged on the base (1) and is used for protecting the base (1) from scratches and corrosion.

Description

Be used for centre gripping optical prism and disk laser to beat integrative device of mark Technical Field The utility model relates to a clamping device, in particular to an integrated device for clamping an optical prism and laser marking of a wafer. Background An optical prism is a transparent object surrounded by planes intersecting each other in pairs but not parallel to each other, and is mainly used for splitting light or dispersing ‌ light beams. Prisms are typically made of a transparent material such as glass or crystal and have multiple facets, each of which refracts or reflects light. The glass wafer is a glass product which is round in shape and is used in the fields of various scientific experiments, detection, processing and the like. The specification and the material are selected according to the application field and the requirement, and the common specification varies from 1mm diameter to 200mm diameter. With the rapid development of the optical manufacturing industry, in the field of optical application, according to the production process requirements of customers and the optical manufacturing industry, the surfaces of optical prisms and glass wafers with different sizes and shapes are often required to be subjected to laser marking, different characters and symbols are marked on the surfaces of the optical prisms and the glass wafers, the optical prisms and the glass wafers are positioned and laser marked by using different leaning bodies according to the original laser marking method, and the accurate marking cannot be performed in a designated area rapidly, so that the accuracy of the laser marking of the optical prisms and the glass wafers is conveniently and rapidly improved, the equipment investment and the manufacturing are reduced, and the laser marking efficiency is improved. Disclosure of utility model The utility model aims to provide an integrated device for clamping an optical prism and laser marking a wafer so as to solve the technical problems. The integrated device for clamping the optical prism and the wafer laser marking comprises a base, wherein a Z-axis vertical moving rod is arranged on the base, a Y-axis graduated scale is arranged on the Z-axis vertical moving rod, one side of the Y-axis graduated scale is connected with a Y-axis horizontal moving rod, an X-axis graduated scale is arranged on the upper end face of the Y-axis horizontal moving rod, an L-shaped boss is further arranged at the upper end of the Y-axis horizontal moving rod, the lower end of the Y-axis horizontal moving rod is connected with an X-axis horizontal moving rod, a Z-axis fixing bolt for adjusting the movement of the Z-axis vertical moving rod is arranged on the Y-axis graduated scale, a Y-axis fixing bolt is arranged on the Y-axis horizontal moving rod and used for adjusting the movement of the Y-axis horizontal moving rod, an X-axis fixing bolt is arranged on the X-axis horizontal moving rod, and the X-axis fixing bolt is used for moving the X-axis horizontal moving rod. Preferably, two ends of the Y-axis graduated scale horizontally extend to form Y-axis horizontal limiting grooves, the Y-axis horizontal limiting grooves are connected with two ends of the X-axis horizontal moving rod, and the Y-axis horizontal limiting grooves are used for limiting the X-axis horizontal moving rod to move horizontally along the Y-axis. Preferably, an optical prism to be marked is arranged on the X-axis horizontal moving rod, and a laser marking machine is arranged above the optical prism. Preferably, the optical prism is clamped and locked with the Y-axis horizontal moving rod through the X-axis horizontal moving rod. Preferably, the X-axis horizontal moving rod is further provided with a wafer to be marked, and the wafer is clamped and locked through an L-shaped boss of the Y-axis horizontal moving rod. Preferably, the laser marking machine is a semiconductor pump solid laser machine. Preferably, the bottom of the base is provided with an anti-slip pad. Preferably, a protective layer is arranged on the base, and the protective layer is used for protecting the base from scratches and corrosion. Compared with the prior art, the utility model has the beneficial effects that: According to the three-dimensional space movement of XYZ, the device can clamp and lock optical prisms and discs of different specifications and shapes, reduces the use and manufacture of marking leaning bodies of different specifications, reduces the investment of equipment, is provided with graduated scales on an X axis and a Y axis, and can rapidly and accurately perform laser marking on appointed areas of marking surfaces of the optical prisms and the discs according to the specifications and the shapes of the optical prisms and the discs and observe corresponding graduations of the graduated scales, thereby improving the laser marking efficiency. Drawings In order to more clearly illustrate the technical solutions of the embodimen