CN-224203624-U - Independent chip temperature control system

CN224203624UCN 224203624 UCN224203624 UCN 224203624UCN-224203624-U

Abstract

The application relates to the technical field of chip testing, in particular to an independent chip temperature control system. The chip independent temperature control system comprises a heating assembly, wherein the heating assembly comprises at least one circuit board, at least two heaters and at least two temperature sensors, any one heater is used for bearing a corresponding chip to be tested, any one temperature sensor is arranged on the heater and used for detecting the temperature of the corresponding heater, any one heater and any one temperature sensor are electrically connected with the corresponding circuit board, and any circuit board is arranged for adjusting the heating power of the corresponding heater according to the temperature of any connected heater. The system can independently adjust and control the test temperatures of different chips to be tested, so that the temperatures of the different chips to be tested are kept consistent, and the influence on the accuracy of test results due to temperature differences among the different chips to be tested is avoided.

Inventors

LIU JUNTAO
GUO SHICHENG
Xie Gaohu
TANG RENWEI

Assignees

苏州联讯仪器股份有限公司

Dates

Publication Date: 20260505
Application Date: 20250611

Claims (10)

1. The chip independent temperature control system is characterized by comprising a heating assembly, a temperature sensor and a control unit, wherein the heating assembly comprises at least one circuit board, at least two heaters and at least two temperature sensors, any one of the heaters is used for bearing a corresponding chip to be tested, any one of the temperature sensors is arranged on the heater and used for detecting the temperature of the corresponding heater, and any one of the heaters and any one of the temperature sensors are electrically connected with the corresponding circuit board; any one of the circuit boards is arranged to adjust the heating power of the corresponding heater according to the temperature of any one of the heaters connected.
2. The chip independent temperature control system according to claim 1, wherein any two of the adjacently disposed circuit boards are arranged at intervals, and at least two of the heaters corresponding to the same circuit board are arranged at intervals along the extending direction of the circuit board.
3. The chip independent temperature control system according to claim 1, wherein the temperature sensor is inserted in the heater.
4. The chip independent temperature control system of claim 1, further comprising a cooling assembly comprising a cooling plate, wherein any of the heaters is attached to a surface of the cooling plate.
5. The chip independent temperature control system according to claim 4, wherein a refrigerant channel is provided in the cooling plate, one end of the refrigerant channel is provided with a medium inlet, the other end is provided with a medium outlet, the flow of the medium is a preset flow value, and the temperature of the medium inlet is a preset temperature value.
6. The chip independent temperature control system according to claim 4, wherein a surface of the cooling plate facing the heating assembly is provided with a groove, and any one of the circuit boards is mounted in the groove.
7. The chip independent temperature control system of claim 1, further comprising a positioning assembly comprising a positioning plate covering a portion of the heating assembly, the positioning plate being provided with at least two positioning slots, any of the heaters being embedded in a corresponding one of the positioning slots.
8. The chip independent temperature control system of claim 7, wherein the depth of the positioning groove is no greater than the height of the heater.
9. The chip independent temperature control system of claim 1, further comprising a chip securing assembly configured to secure each of the chips under test to a corresponding one of the heaters.
10. The chip independent temperature control system according to claim 9, wherein the heater is provided with a through hole; The chip fixing assembly comprises an air extraction pipeline and a connector, wherein the air extraction pipeline is arranged in the cooling plate and is communicated with the through hole, the connector is arranged on the circumference of the cooling plate and is communicated with the air extraction pipeline, and the connector is used for connecting the air extraction pipeline with vacuumizing equipment.

Description

Independent chip temperature control system Technical Field The application relates to the technical field of chip testing, in particular to an independent chip temperature control system. Background With the rapid development of the semiconductor industry, the improvement of chip performance is often accompanied by higher power consumption and heating value. Especially in the chip-scale batch burn-in process, it becomes important to maintain a stable test environment temperature for those chips with a large thermal load. However, most of the temperature testing systems for chips or wafers in the market are mainly designed for small-load chip products, and in these application scenarios, the heat generated by the chips or wafers in the whole testing process is small, the temperature difference between the chips is relatively easy to control, and the requirement can be met by adopting an integrated temperature control system. When facing high power heat generating chips, existing integrated temperature control schemes are struggling in terms of heat dissipation capability and accurate control of the temperature of the individual chips. Due to the lack of an effective single-chip temperature regulation mechanism, a large temperature difference may be caused, which not only affects the consistency and accuracy of the test result, but also may damage the chip due to overheating, reducing the quality and yield of test screening. Disclosure of utility model The embodiment of the application provides at least one chip independent temperature control system which can independently adjust and control the test temperatures of different chips to be tested so as to keep the temperatures of the different chips to be tested consistent and avoid the influence on the accuracy of test results due to temperature differences among the different chips to be tested. The embodiment of the application provides a chip independent temperature control system, which comprises a heating assembly, wherein the heating assembly comprises at least one circuit board, at least two heaters and at least two temperature sensors, any one of the heaters is used for bearing a corresponding chip to be tested, any one of the temperature sensors is arranged on the heater and used for detecting the temperature of the corresponding heater, any one of the heaters and any one of the temperature sensors are electrically connected with the corresponding circuit board, and any one of the circuit boards is used for adjusting the heating power of the corresponding heater according to the temperature of any one of the connected heaters. In an alternative embodiment, any two adjacent circuit boards are arranged at intervals, and at least two heaters corresponding to the same circuit board are arranged at intervals along the extending direction of the circuit board. In an alternative embodiment, the temperature sensor is inserted in the corresponding heater. In an alternative embodiment, the system further comprises a cooling assembly comprising a cooling plate, and any of the heaters is attached to a surface of the cooling plate. In an alternative embodiment, a refrigerant channel is disposed in the cooling plate, one end of the refrigerant channel is provided with a medium inlet, the other end of the refrigerant channel is provided with a medium outlet, the flow of the medium is a preset flow value, and the temperature of the medium inlet is a preset temperature value. In an alternative embodiment, the surface of the cooling plate facing the heating assembly is provided with grooves, and any one of the circuit boards is mounted in the groove. In an alternative embodiment, the system further comprises a positioning assembly, the positioning assembly comprises a positioning plate, the positioning plate covers part of the heating assembly, the positioning plate is provided with at least two positioning grooves, and any heater is embedded in the corresponding positioning groove. In an alternative embodiment, the depth of the detent is no greater than the height of the heater. In an alternative embodiment, the system further comprises a chip fixing assembly configured to fix each of the chips to be tested to a corresponding one of the heaters, respectively. In an alternative embodiment, the heater is provided with a through hole; The chip fixing assembly comprises an air extraction pipeline and a connector, wherein the air extraction pipeline is arranged in the cooling plate and is communicated with the through hole, the connector is arranged on the circumference of the cooling plate and is communicated with the air extraction pipeline, and the connector is used for connecting the air extraction pipeline with vacuumizing equipment. The technical scheme of the application has the following beneficial technical effects: According to the chip independent temperature control system provided by the embodiment of the application, the circuit board, the heaters and the t