CN-224203795-U - Display module and display device

Abstract

The utility model provides a display module assembly, this display module assembly includes display panel and flexonics structure, display panel's first bonding area is equipped with the bonding pad, flexonics structure is close to the one end of bonding pad and is equipped with the bonding pin, bonding pin at least partially surpasss display panel's edge, the bonding pin surpasss the part at display panel edge and is first lead portion, conductive lead's one end is connected with bonding pad, the other end is connected with first lead portion, display module assembly lower frame's width equals the width of bonding pin and the width sum of first lead portion, the width of first connecting portion is than the radius of bending region much less, therefore make display module assembly's lower frame can reduce greatly. A display device comprising the display module is also provided.

Inventors

• XIE CHUNYAN
• YANG CHAO
• ZHANG SONG
• CAI BAOMING
• SHI SHIMING

Assignees

• 京东方科技集团股份有限公司

Dates

Publication Date

20260505

Application Date

20250526

Claims (16)

1. 1. A display module, comprising: the display panel comprises a display layer and a back film, wherein the display side of the display layer is provided with a first binding area, the first binding area is provided with a binding pad, the binding pad is arranged on the display side of the display layer, and the back film is arranged on one side, far away from the binding pad, of the display layer; The flexible connection structure is arranged on the non-display side of the display panel, one end, close to the binding pad, of the flexible connection structure is provided with a binding pin, at least part of the binding pin exceeds the edge of the display panel, and the part, exceeding the edge of the display panel, of the binding pin is a first pin part; And one end of the conductive lead is connected with the binding pad, the conductive lead extends along the edge of the display panel, and the other end of the conductive lead is connected with the first pin part.
2. 2. The display module of claim 1, wherein the flexible connection structure is disposed on a side of the back film away from the display layer, the flexible connection structure comprises a film substrate disposed on a non-display side of the display panel, the bonding pins are disposed on a side of the film substrate adjacent to the display panel, the first pin portion is exposed at an edge of the back film, and the conductive leads extend onto the first pin portion along an edge of the display layer and an edge of the display layer.
3. 3. The display module of claim 1, wherein the flexible connection structure further comprises a film substrate disposed on a non-display side of the display panel, the bonding pins are disposed on a side of the film substrate away from the display panel, the first pin portion is exposed at an edge of the film substrate, and the conductive leads extend onto the first pin portion along the edge of the display layer, and the edge of the film substrate.
4. 4. The display module of claim 1, wherein the display layer comprises: A substrate base; the first grid electrode layer is arranged on one side of the substrate base plate; the source-drain conducting layer is arranged on one side of the first grid electrode layer, which is far away from the substrate base plate; The pixel electrode layer is arranged on one side of the source-drain conducting layer, which is far away from the substrate base plate; The bonding pad comprises at least two pad layers, the pad layer farthest from the substrate and the pixel electrode layer are arranged in the same layer and are made of the same material, and the rest pad layers and one or more layers of the first grid layer and the source drain conductive layer are arranged in the same layer and are made of the same material.
5. 5. The display module of claim 4, wherein the display layer further comprises a light shielding layer and an active layer, the active layer is disposed on a side of the first gate layer close to or far from the substrate, the light shielding layer is disposed on a side of the active layer close to the substrate, and the rest of the pad layer is disposed with one or more layers of the light shielding layer, the first gate layer and the source drain conductive layer.
6. 6. The display module of claim 4, wherein any two adjacent pad layers are retracted relative to the pad layer that is located farther from the substrate than the pad layer that is located closer to the substrate, and exposed areas are formed on the pad layers other than the pad layer that is located farthest from the substrate, and the conductive leads cover edges of the pad layers and the exposed areas.
7. 7. The display module of claim 6, wherein the bonding pad layer farthest from the display panel is a first bonding pad layer, the first bonding pad layer comprises at least two indium tin oxide layers and a metal layer, one metal layer is sandwiched between every two indium tin oxide layers, one layer of the first bonding pad layer farthest from the substrate is the indium tin oxide layer, and the conductive lead is overlapped on the indium tin oxide layer.
8. 8. The display module of claim 1, wherein the display panel further comprises an optical film and a cover plate, the optical film is disposed on a side of the bonding pad away from the display layer, the cover plate is disposed on a side of the optical film away from the display layer, the optical film and the cover plate are retracted relative to an edge of the display layer to expose at least a portion of the bonding pad, and the conductive leads are overlapped on the exposed portion of the bonding pad.
9. 9. The display module of claim 8, further comprising a cover layer covering an edge of the cover plate, an edge of the optical film, and the conductive leads.
10. 10. The display module of claim 9, wherein the conductive leads are retracted relative to edges of the first lead portions in a direction toward the display panel to expose portions of the first lead portions, and wherein the cover layer wraps over the ends of the conductive leads and the exposed portions of the first lead portions.
11. 11. The display module of claim 1, wherein the number of binding pads is plural, the binding pins are plural, the binding pins and the binding pads form plural pairs, each binding pad and the orthographic projection of each binding pin on the display panel are at least partially overlapped, and each binding pad and each binding pin are connected by one conductive lead.
12. 12. The display module of claim 1, wherein the width of the conductive leads is less than or equal to the width of the bonding pads and the width of the bonding pins.
13. 13. The display module of claim 6, wherein the conductive leads include first lead segments that cover surfaces of the bonding pads and the display layer, the first lead segments including a plurality of segments of first sub-lead segments, the first sub-lead segments on different ones of the exposed areas having equal widths, and adjacent ones of the first sub-lead segments on different ones of the exposed areas having equal distances between first directions.
14. 14. The display module of claim 3, wherein the flexible connection structure is a flip-chip film, the flexible connection structure further comprises a driving chip, the bonding pins are arranged at one end of the film substrate close to the bonding pads, the driving chip is bonded at one end of the film substrate far away from the bonding pads, the driving chip is bonded at one side of the film substrate close to the display panel, or the driving chip is bonded at one side of the film substrate far away from the display panel.
15. 15. The display module of claim 1, wherein the dimension of the bonding pad along the first direction is 5-20um, the distance between two adjacent bonding pads along the first direction is 20-50um, the length of the exposed portion of the bonding pad along the second direction is 30-100um, and the length of the first lead portion along the second direction is 10-100um.
16. 16. A display device comprising the display module of any one of claims 1 to 15.

Description

Display module and display device Technical Field The utility model relates to the technical field of display, in particular to a display module and a display device. Background Currently, with the continuous development of display technology, the screen occupation ratio of a screen is higher and higher, and the frames of a display panel and a display module are continuously compressed. After the binding is completed, the binding part or the flexible connection structure is reversely folded to the back surface of the display panel, but the sum of the width of the wiring area and the width of the radius of the bending area is larger, so that the lower frame of the display module cannot be reduced. It should be noted that the information of the present utility model in the above background section is only for enhancing the understanding of the background of the present utility model and thus may include information that does not form the prior art that is already known to those of ordinary skill in the art. Disclosure of utility model The utility model aims to solve the problem that the frame of a display module cannot be narrowed due to the fact that the sum of the width of a wiring area and the width of the radius of a bending area is large, and provides the display module and a display device. According to one aspect of the utility model, a display module is provided, the display module comprises a display panel, a flexible connection structure and a conductive lead, the display panel comprises a display layer and a back film, a binding pad is arranged on the display side of the display layer, the back film is arranged on one side of the display layer far away from the binding pad, the display side of the display layer is provided with a first binding area, the first binding area is provided with the binding pad, the flexible connection structure is arranged on the non-display side of the display panel, one end of the flexible connection structure, which is close to the binding pad, is provided with a binding pin, at least part of the binding pin exceeds the edge of the display panel, the part of the binding pin exceeding the edge of the display panel is a first lead part, one end of the conductive lead is connected with the binding pad, the conductive lead extends along the edge of the display panel, and the other end of the conductive lead is connected with the first lead part. In one embodiment of the utility model, the flexible connection structure is arranged on one side of the back film far away from the display layer, the flexible connection structure comprises a film substrate, the film substrate is arranged on the non-display side of the display panel, the binding pins are arranged on one side of the film substrate close to the display panel, the first pin part is exposed out of the edge of the back film, and the conductive leads extend onto the first pin part along the edge of the display layer and the edge of the display layer. In an embodiment of the utility model, the flexible connection structure further includes a film substrate, the film substrate is disposed on a non-display side of the display panel, the bonding pins are disposed on a side of the film substrate away from the display panel, the first pin portion is exposed at an edge of the film substrate, and the conductive leads extend onto the first pin portion along the edge of the display layer, and the edge of the film substrate. In one embodiment of the utility model, the display layer comprises a substrate, a first grid electrode layer, a source drain conducting layer and a pixel electrode layer, wherein the first grid electrode layer is arranged on one side of the substrate, the source drain conducting layer is arranged on one side of the first grid electrode layer far away from the substrate, the pixel electrode layer is arranged on one side of the source drain conducting layer far away from the substrate, the bonding pad comprises at least two pad layers, the pad layer furthest from the substrate is arranged with the same layer as the pixel electrode layer, and the rest pad layers are arranged with one or more layers of the first grid electrode layer and the source drain conducting layer. In one embodiment of the present utility model, the display layer further includes a light shielding layer and an active layer, the active layer is disposed on a side of the first gate layer close to or far from the substrate, the light shielding layer is disposed on a side of the active layer close to the substrate, and the rest of the pad layers are disposed with one or more of the light shielding layer, the first gate layer, and the source drain conductive layer. In one embodiment of the utility model, any two adjacent bonding pad layers are retracted relative to the bonding pad layer which is far away from the substrate and is relatively close to the substrate, exposed areas are formed on the bonding pad layers except the bonding pad layer