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CN-224203802-U - High-efficient heat dissipation display screen

CN224203802UCN 224203802 UCN224203802 UCN 224203802UCN-224203802-U

Abstract

The utility model provides a high-efficiency heat-dissipation display screen, which relates to the technical field of display screens and comprises a shell, wherein a display screen and a heat-dissipation substrate are arranged in the shell, the heat-dissipation substrate is attached to the display screen to conduct heat dissipation operation on the display screen, a circuit board is arranged on one side, far away from the display screen, of the heat-dissipation substrate, a liquid cooling microcirculation structure, a heat-dissipation module and an air outlet component are arranged to cooperate with each other, so that heat generated by the display screen during operation can be rapidly and efficiently dissipated, the internal temperature of the display screen always controls the chip, the circuit board main body and the display screen to be in a safe temperature range of normal operation, the heat dissipation effect of the display screen is good, and even under the conditions of long-time high-load operation, such as continuous outdoor advertisement display, high-strength electronic competition and the like, the performance stability of the chip and the circuit board main body can be ensured, and the luminous efficiency, the color reduction and the like are not influenced.

Inventors

  • WU JIANBO

Assignees

  • 宁波市显石光电科技有限公司

Dates

Publication Date
20260505
Application Date
20250509

Claims (8)

  1. 1. A high efficiency heat dissipating display screen, comprising: The device comprises a shell (10), wherein a plurality of air inlets (101) are formed in the shell (10), and an air outlet is formed in the top of the shell (10); A display screen (11) provided inside the housing (10); The heat dissipation substrate (12) is arranged in the shell (10), and the heat dissipation substrate (12) is attached to the display screen (11) so as to conduct heat generated by the display screen (11) during operation; The circuit board (13) is arranged on one side of the heat dissipation substrate (12) far away from the display screen (11), and a plurality of heat dissipation modules (14) are arranged on the circuit board (13); The liquid cooling micro-circulation structure (20) is arranged in the shell (10), and the liquid cooling micro-circulation structure (20) is used for carrying out liquid cooling heat dissipation operation on the circuit board (13) and heating elements on the circuit board (13); The air outlet component is arranged on the top side of the shell (10) and corresponds to the air outlet, and the air outlet component and the air inlet (101) are used for carrying out air cooling and heat dissipation on the inside of the shell (10) and the liquid cooling microcirculation structure (20) so as to accelerate the heat dissipation speed of the circuit board (13).
  2. 2. The efficient heat dissipation display screen according to claim 1, wherein the heat dissipation substrate (12) comprises a copper plate (121), a boron nitride ceramic film (122) and graphene coatings (123), the number of the boron nitride ceramic films (122) is two, the two boron nitride ceramic films (122) are respectively connected with one side face of the copper plate (121), the number of the graphene coatings (123) is two, the graphene coatings (123) are connected with the boron nitride ceramic films (122), and the graphene coatings (123) are in one-to-one correspondence with the boron nitride ceramic films (122).
  3. 3. The efficient heat dissipation display screen as set forth in claim 2, wherein the circuit board (13) includes a circuit board main body (131) and a plurality of chips (132) disposed on the circuit board main body (131), a plurality of the chips (132) having gaps therebetween, the number of the chips (132) corresponding to the number of the heat dissipation modules (14), the chips (132) being located at one side of the heat dissipation modules (14), the chips (132) corresponding to the heat dissipation modules (14) one by one.
  4. 4. A high-efficient heat dissipation display screen according to claim 3, wherein the liquid cooling microcirculation structure (20) comprises a circulation pipeline (21), a miniature liquid pump (22) and a microchannel heat exchanger (23), the circulation pipeline (21) is arranged around the circuit board (13), the miniature liquid pump (22) is connected with one end of the circulation pipeline (21), the microchannel heat exchanger (23) is connected with the other end of the circulation pipeline (21), the miniature liquid pump (22) and the microchannel heat exchanger (23) are communicated through pipelines, a plurality of U-shaped channels (211) are formed on the circulation pipeline (21), the chip (132) is located inside the U-shaped channels (211), and the chip (132) corresponds to the U-shaped channels (211) one by one.
  5. 5. A high-efficiency heat dissipation display screen according to claim 3, wherein the air outlet component comprises an air duct (30) and guide vanes (31), the air duct (30) corresponds to the air outlet, the air duct (30) is in a tapered design, the guide vanes (31) are multiple in number, and the guide vanes (31) are all installed in the air duct (30).
  6. 6. A high efficiency heat dissipating display screen according to claim 3, wherein the inner wall of the air inlet (101) is provided with a dust screen (15).
  7. 7. A high efficiency heat dissipating display according to claim 5, wherein the heat dissipating module (14) is a phase change material of a paraffin-based composite material.
  8. 8. A high efficiency heat dissipating display screen in accordance with claim 5 wherein said housing (10) comprises a front shell (16) and a rear shell (17), said front shell (16) and rear shell (17) being interconnected.

Description

High-efficient heat dissipation display screen Technical Field The utility model relates to the technical field of display screens, in particular to a high-efficiency heat-dissipation display screen. Background Along with the continuous development of display technology, miniLED display screens are widely used in a plurality of fields, such as outdoor advertisement, high-end electronic competition, vehicle-mounted display, virtual Reality (VR)/Augmented Reality (AR) and the like, due to the advantages of high brightness, high contrast, high pixel density and the like. However, miniLED displays have a significant problem in operation, namely severe chip heating. Because of the high power density characteristics of MiniLED chips, a large amount of heat is generated when a large number of chips are operated for a long time, and if heat is not effectively dissipated at all, a series of adverse effects can be caused. On the one hand, the high temperature can lead to the performance degradation of MiniLED chips, such as the reduction of luminous efficiency and color drift, which directly affect the display effect of a display screen, and on the other hand, the continuous high temperature can also shorten the service life of the chips, increase the maintenance cost and the replacement frequency of products, which is extremely unfavorable for commercial operation and high-end equipment application. The existing heat dissipation measures, such as traditional air cooling heat dissipation, often have the problems of low heat dissipation efficiency, high noise and the like, and the pure passive heat dissipation modes, such as heat dissipation by a heat dissipation plate, are difficult to meet the heat dissipation requirement under high-load operation. Therefore, there is a need for a display screen that can achieve efficient heat dissipation to solve these problems. Disclosure of utility model The utility model aims to provide a high-efficiency heat-dissipation display screen and aims to solve the problems in the prior art. In order to achieve the above object, an embodiment of an aspect of the present utility model provides a high-efficiency heat dissipation display screen, including: the shell is provided with a plurality of air inlets, and the top of the shell is provided with an air outlet; A display screen disposed inside the housing; the heat dissipation substrate is arranged in the shell and is attached to the display screen to conduct heat generated by the display screen during operation; the circuit board is arranged on one side of the heat dissipation substrate far away from the display screen, and a plurality of heat dissipation modules are arranged on the circuit board; the liquid cooling micro-circulation structure is arranged in the shell and is used for carrying out liquid cooling heat dissipation operation on the circuit board and the heating element on the circuit board; The air outlet component is arranged on the top side of the shell and corresponds to the air outlet in position, and the air outlet component and the air inlet are used for carrying out air cooling and heat dissipation on the inside of the shell and the liquid cooling microcirculation structure so as to accelerate the heat dissipation speed of the circuit board. Preferably, the heat dissipation substrate comprises a copper plate, two boron nitride ceramic films and two graphene coatings, wherein the two boron nitride ceramic films are respectively connected with one side face of the copper plate, the two graphene coatings are respectively connected with the boron nitride ceramic films, and the graphene coatings are in one-to-one correspondence with the boron nitride ceramic films. Preferably, the circuit board comprises a circuit board main body and a plurality of chips arranged on the circuit board main body, gaps are reserved among the chips, the number of the chips corresponds to the number of the heat dissipation modules, the chips are located on one side of the heat dissipation modules, and the chips correspond to the heat dissipation modules one by one. Preferably, the liquid cooling microcirculation structure comprises a circulation pipeline, a miniature liquid pump and a microchannel heat exchanger, wherein the circulation pipeline is arranged around the circuit board, the miniature liquid pump is connected with one end of the circulation pipeline, the microchannel heat exchanger is connected with the other end of the circulation pipeline, the miniature liquid pump and the microchannel heat exchanger are communicated through pipelines, a plurality of U-shaped channels are formed in the circulation pipeline, the chips are located in the U-shaped channels, and the chips correspond to the U-shaped channels one by one. Preferably, the air outlet component comprises an air duct and guide vanes, the air duct corresponds to the air outlet, the air duct is in a tapered design, the number of the guide vanes is multiple, and the guide va