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CN-224203902-U - Chip resistor with heat radiation fins

CN224203902UCN 224203902 UCN224203902 UCN 224203902UCN-224203902-U

Abstract

The utility model relates to the technical field of electronic elements and discloses a chip resistor with radiating fins. The radiating fins are made of high heat conduction materials, and the mechanical connection structure ensures that the resistor body is in close contact with the radiating fins and is firmly connected, so that heat generated during the operation of the resistor is quickly conducted to the radiating fins and dissipated to the surrounding environment, the reliability and stability of the chip resistor are improved, the service life is prolonged, and the resistor is suitable for various electronic equipment with requirements on resistor heat dissipation.

Inventors

  • LI JIN
  • ZHANG JIANTAO
  • CHEN ZHIGAO

Assignees

  • 浙江玖维电子科技有限公司

Dates

Publication Date
20260505
Application Date
20250605

Claims (7)

  1. 1. A chip resistor with heat fins, comprising: A resistor body (1); the radiating fins are made of high-heat-conductivity materials; The mechanical connection structure is used for connecting the resistor body (1) with the radiating fins, so that heat generated by the resistor body (1) can be conducted to the radiating fins, and comprises a connecting groove (6) formed in the resistor body (1) and a connecting protrusion (5) arranged on the radiating fins and matched with the connecting groove (6), wherein the connecting protrusion (5) is embedded into the connecting groove (6) to realize connection of the resistor body (1) with the radiating fins, and interference fit is formed between the connecting protrusion (5) and the connecting groove (6).
  2. 2. The chip resistor with heat radiation fins according to claim 1, wherein the heat radiation fins comprise a substrate (4) and a plurality of fins (2) arranged on the substrate (4), the fins (2) are parallel to each other and are arranged at intervals, and the substrate (4) and the resistor body (1) are connected through the mechanical connection structure.
  3. 3. The chip resistor with heat dissipation fins according to claim 2, wherein the shape of the fins (2) is one of wavy, rectangular parallelepiped, trapezoid or triangle.
  4. 4. The chip resistor with heat sink of claim 1 wherein the high thermal conductivity material is one of copper, aluminum or aluminum alloy and is surface plated with tin or silver.
  5. 5. The chip resistor with the heat radiation fins according to claim 1, wherein the surface of the resistor body (1) connected with the heat radiation fins is provided with a heat conducting coating.
  6. 6. The chip resistor with the heat radiation fins of claim 1, wherein the connecting grooves (6) are dovetail grooves, and the connecting protrusions (5) are dovetail protrusions matched with the dovetail grooves.
  7. 7. The chip resistor with the heat radiation fins according to claim 1, wherein the mechanical connection structure further comprises fixing holes (7) arranged on the resistor body (1) and the heat radiation fins, and the resistor body (1) and the heat radiation fins are fixedly connected through fixing pieces penetrating through the fixing holes (7), wherein the fixing pieces are bolt and nut combinations or rivets.

Description

Chip resistor with heat radiation fins Technical Field The utility model relates to the technical field of electronic elements, in particular to a chip resistor with radiating fins. Background The chip resistor is a common electronic element in electronic equipment and plays roles in limiting current, dividing voltage and the like in a circuit. Along with miniaturization and high performance development of electronic equipment, the power requirement on the chip resistor is higher and higher, and the chip resistor can generate heat in the working process, if the heat cannot be timely emitted, the temperature of the resistor can be increased, the performance and the reliability of the resistor are further affected, the resistor is possibly damaged even, and the service life of the electronic equipment is shortened. At present, some methods for improving the heat dissipation performance of the chip resistor are to coat a heat dissipation material on the surface of the resistor or add a sensor to cooperate with a heat dissipation device to dissipate heat. However, the heat dissipation effect of the coating heat dissipation material is limited, and the heat dissipation performance may be reduced over time, and the addition of the sensor and other structures not only increases the cost and complexity of the chip resistor, but also may occupy more circuit board space, which is not beneficial to the miniaturized design of the electronic device. Therefore, there is a need for a chip resistor that achieves efficient heat dissipation by a simple mechanical structure without increasing complex components. Disclosure of utility model The present utility model is directed to a chip resistor with heat dissipation fins, so as to solve the problems set forth in the background art. In order to achieve the above purpose, the utility model provides a chip resistor with heat radiation fins, comprising: a resistor body; the radiating fins are made of high-heat-conductivity materials; The mechanical connection structure is used for connecting the resistor body with the radiating fins, so that heat generated by the resistor body can be conducted to the radiating fins, and comprises a connecting groove formed in the resistor body and a connecting protrusion arranged on the radiating fins and matched with the connecting groove, the connecting protrusion is embedded into the connecting groove to realize connection of the resistor body with the radiating fins, and interference fit is formed between the connecting protrusion and the connecting groove. Preferably, the heat dissipation fin comprises a substrate and a plurality of fins arranged on the substrate, the fins are parallel to each other and are arranged at intervals, and the substrate is connected with the resistor body through the mechanical connection structure. Preferably, the shape of the fin is one of a wave shape, a cuboid, a trapezoid or a triangle. Preferably, the high thermal conductivity material is one of copper, aluminum or aluminum alloy, and the surface is tin-plated or silver-plated. Preferably, a heat conducting coating is arranged on the surface of the resistor body connected with the radiating fins. Preferably, the connecting groove is a dovetail groove, and the connecting protrusion is a dovetail protrusion matched with the dovetail groove. Preferably, the mechanical connection structure further comprises a fixing hole arranged on the resistor body and the radiating fins, the resistor body is fixedly connected with the radiating fins through a fixing piece penetrating through the fixing hole, and the fixing piece is a bolt and nut combination or a rivet. Compared with the prior art, the utility model has the beneficial effects that the radiating fins are connected with the resistor body through the mechanical structure, the complex structures such as a sensor and the like are not required to be added, the cost and the complexity are reduced, and meanwhile, the space of the circuit board is not occupied too much, thereby being beneficial to the miniaturization design of electronic equipment. The heat radiating fins are made of high heat conducting materials and are connected with the resistor body through tight mechanical connection, heat generated by the resistor body can be conducted and radiated out rapidly, the working temperature of the resistor is effectively reduced, the reliability and stability of the chip resistor are improved, and the service life of the chip resistor is prolonged. The heat dissipation fin structure is designed by various mechanical connection modes and heat dissipation fins, so that the heat dissipation fin structure can adapt to different application scenes and requirements, and has good universality and practicability. Drawings FIG. 1 is a schematic diagram of the structure of the present utility model; FIG. 2 is a split view of the present utility model; fig. 3 is a split view of the present utility model. In the figure, 1, a re