Search

CN-224205106-U - High reliability exchange machine

CN224205106UCN 224205106 UCN224205106 UCN 224205106UCN-224205106-U

Abstract

The utility model discloses a high-reliability switch which comprises a switch module, a flexible connector and a port board, wherein the switch module comprises a switch chip, a first PHY chip, a debugging interface and a network interface, the first PHY chip is in communication connection with the switch chip, the debugging interface is connected with the first PHY chip through a serial communication bus and is used for configuring a physical layer address and a communication protocol parameter of the first PHY chip, the network interface is in communication connection with the switch chip and is used for realizing communication of data link layers of different switch modules, and the flexible connector is used for enabling the switch module to be in communication connection with the port board based on the network interface. Compared with the prior art, the utility model can reduce the hardware replacement cost and support the diversified scenes such as the custom port function, the data center and the like. Secondly, the difficult problem of heat dissipation of the switch is fundamentally solved. Further, since heat dissipation processing is not required, the size of the switch is reduced, and the wiring complexity is reduced.

Inventors

  • YAN XIAOFAN

Assignees

  • 苏州衡擎科讯技术有限公司

Dates

Publication Date
20260505
Application Date
20250421

Claims (10)

  1. 1. A high reliability switch, comprising: The switch module comprises a switch chip, a first PHY chip, a debugging interface and a network interface; the system comprises a first PHY chip, a first network interface, a second PHY chip, a first switch chip, a second switch chip, a first network interface and a second switch chip, wherein the first PHY chip is in communication connection with the switch chip; And a flexible connector for communicatively connecting a plurality of the switch modules based on a network interface.
  2. 2. The high reliability switch of claim 1, wherein the flexible connector comprises: the first connection end group is connected with at least one network interface of the switch module; The second connection end group is connected with an interface used for communicating with the switch module on the port board; And the flexible substrate is connected with the first connecting end group and the second connecting end group with a preset bending curvature to form a signal transmission channel.
  3. 3. The high reliability switch of claim 1, wherein the switch further comprises a rectangular connector and an indicator light for indicating a status of a network interface: One end of the rectangular connector is connected with the switch module, and the other end of the rectangular connector is connected with the indicator lamp.
  4. 4. The high reliability switch of claim 1, wherein the flexible connector is embedded with a graphene-based thermally conductive layer or a liquid metal filled structure; The heat conduction layer comprises graphene sheets stacked between layers and an interface reinforcing phase; the liquid metal comprises a gallium-based liquid metal alloy.
  5. 5. The high reliability switch of claim 1, wherein the switch module further comprises a memory unit; The storage unit is in communication connection with the exchange chip and comprises a dynamic memory for caching forwarding data, a static register for storing configuration parameters and a flash memory chip for firmware storage.
  6. 6. The high reliability switch of claim 1, wherein the switch chip is coupled to a second PHY chip, the second PHY chip being coupled to the network interface, wherein the switch chip and the second PHY chip communicate via a high speed serial bus using a bus standard of QSGMII.
  7. 7. The high reliability switch of claim 6, wherein a third PHY chip is connected to the switch chip, the third PHY chip is connected to the network interface, and a bus standard adopted between the switch chip and the third PHY chip is 10G BASE-R or USXGMII.
  8. 8. The high reliability switch of claim 7, wherein the switch module further comprises a first network transformer and a second network transformer; The input end of the first network transformer is connected with the second PHY chip, the output end of the first network transformer is connected with the network interface, and the bus standard adopted by the first network transformer and the network interface piece is 1000BASE-T; The input end of the second network transformer is connected with the third PHY chip, the output end of the second network transformer is connected with the network interface, and the bus standard adopted by the second network transformer and the network interface is 10G BASE-T.
  9. 9. The high reliability switch of claim 1, wherein the switch further comprises a power module, the power module comprising a DC input and a DC output, each of the DC outputs being coupled in series with a DC/DC voltage regulator for outputting a power supply voltage of a different voltage value.
  10. 10. The high reliability switch of claim 1, wherein the switch module is configured with a temperature sensor for detecting module temperature.

Description

High reliability exchange machine Technical Field The utility model belongs to the technical field of network communication equipment, and particularly relates to a high-reliability switch. Background A Switch (Switch) means a "Switch" is a network device used for electrical (optical) signal forwarding. It can provide an unshared signal path for any two network nodes accessing the switch. The method is a technology for transmitting information to a corresponding route meeting the requirements by using a manual or automatic equipment method according to the requirement of information transmission at two ends of communication. The conventional ethernet switch modules have the following problems that firstly, rigid connectors are generally adopted between the conventional ethernet switch modules for signal transmission and power supply, which often leads to complex wiring and large volume of the switch, and the high-density integration requirement is difficult to meet. Secondly, the interface type of the traditional switch is fixed by hardware, and a user cannot flexibly and dynamically adjust the interface type, so that the hardware needs to be replaced when adapting to different network environments, the cost is high, the maintenance is complex, and the interface type is difficult to adapt to diversified application scenes. In addition, the high-density integrated electronic component generates a large amount of heat during operation, and the traditional heat dissipation design, such as a single fan or a heat dissipation fin, is difficult to meet the requirement of long-time stable operation, and cannot radically reduce the heat dissipation strength of the board interface, so that the equipment performance is easy to be reduced or the equipment is easy to break down in a high-temperature environment. Accordingly, in view of the above-described problems, it is necessary to provide a high-reliability switch. The information disclosed in this background section is only for enhancement of understanding of the general background of the utility model and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person of ordinary skill in the art. Disclosure of utility model The utility model aims to provide a high-reliability switch which can simplify the wiring structure of the switch, reduce the size of a module and solve the problems of heat dissipation and insufficient flexibility of the switch. In order to achieve the above object, a specific embodiment of the present utility model provides the following technical solution: The present invention provides a high reliability switch comprising: The switch module comprises a switch chip, a first PHY chip, a debugging interface and a network interface; the system comprises a first PHY chip, a first network interface, a second PHY chip, a first switch chip, a second switch chip, a first network interface and a second switch chip, wherein the first PHY chip is in communication connection with the switch chip; And a flexible connector for communicatively connecting a plurality of the switch modules based on a network interface. In one or more embodiments of the present utility model, the flexible connector includes: the first connection end group is connected with at least one network interface of the switch module; The second connection end group is connected with an interface used for communicating with the switch module on the port board; And the flexible substrate is connected with the first connecting end group and the second connecting end group with a preset bending curvature to form a signal transmission channel. In one or more embodiments of the present utility model, the switch further comprises a rectangular connector and an indicator light for indicating a status of the network interface: One end of the rectangular connector is connected with the switch module, and the other end of the rectangular connector is connected with the indicator lamp. In one or more embodiments of the utility model, the flexible connector is embedded with a graphene-based thermally conductive layer or a liquid metal filled structure; The heat conduction layer comprises graphene sheets stacked between layers and an interface reinforcing phase; the liquid metal comprises a gallium-based liquid metal alloy. In one or more embodiments of the present utility model, the switch module further includes a storage unit; The storage unit is in communication connection with the exchange chip and comprises a dynamic memory for caching forwarding data, a static register for storing configuration parameters and a flash memory chip for firmware storage. In one or more embodiments of the present utility model, a second PHY chip is connected to the switch chip, and the second PHY chip is connected to the network interface, where the switch chip and the second PHY chip communicate through a high-speed serial bus, and a bus sta