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CN-224205306-U - Heat dissipation structure of multi-layer circuit board

CN224205306UCN 224205306 UCN224205306 UCN 224205306UCN-224205306-U

Abstract

The utility model discloses a heat radiation structure of a multilayer circuit board, which comprises a first copper foil, a first insulating heat conduction layer and a second copper foil, wherein the first insulating heat conduction layer is provided with a mounting hole, a heat radiation copper block is embedded in the mounting hole, the first copper foil is pressed on the upper surface of the first insulating heat conduction layer and is attached to the heat radiation copper block, the second copper foil is pressed on the lower surface of the first insulating heat conduction layer and is attached to the heat radiation copper block, heat received by a third copper foil positioned on a surface layer can be transferred to the heat radiation copper block through a first electroplated layer, and then the heat is transferred to a fourth copper foil at the bottommost layer through a second electroplated layer and is radiated, so that the heat radiation effect of the multilayer circuit board can be greatly improved.

Inventors

  • CHEN GUOXING
  • Dai Fuqun

Assignees

  • 皆利士多层线路版(中山)有限公司

Dates

Publication Date
20260505
Application Date
20250515

Claims (10)

  1. 1. Multilayer circuit board heat radiation structure, its characterized in that includes: The inner core board (100) comprises a first copper foil (110), a first insulating heat conducting layer (120) and a second copper foil (130), wherein a mounting hole (121) is formed in the first insulating heat conducting layer (120), a heat dissipation copper block (122) is embedded in the mounting hole (121), the first copper foil (110) is pressed on the upper surface of the first insulating heat conducting layer (120) and is attached to the heat dissipation copper block (122), and the second copper foil (130) is pressed on the lower surface of the first insulating heat conducting layer (120) and is attached to the heat dissipation copper block (122); The third copper foil (150) is connected to the upper surface of the first copper foil (110) through the second insulating heat conducting layer (140), the second insulating heat conducting layer (140) is provided with a first groove (141) extending downwards to the first copper foil (110), a first electroplated layer (142) is arranged in the first groove (141), and the first electroplated layer (142) is connected between the first copper foil (110) and the third copper foil (150); Fourth copper foil (170), connect in through third insulating heat conduction layer (160) the lower surface of second copper foil (130), third insulating heat conduction layer (160) are seted up upwards extend to second recess (161) of second copper foil (130), be provided with second electroplated layer (162) in second recess (161), second electroplated layer (162) connect in between second copper foil (130) and fourth copper foil (170).
  2. 2. The heat dissipation structure of a multilayer circuit board according to claim 1, wherein the first groove (141) is opened on the upper surface of the third copper foil (150) and extends downward to the first copper foil (110), and the first plating layer (142) extends upward from the first copper foil (110) to be flush with the upper surface of the third copper foil (150); The second groove (161) is formed in the upper surface of the fourth copper foil (170) and extends upwards to the second copper foil (130), and the second electroplated layer (162) extends downwards from the second copper foil (130) to be flush with the lower surface of the fourth copper foil (170).
  3. 3. The multilayer wiring board heat dissipation structure according to claim 1 or 2, characterized in that the first groove (141) is located above the heat dissipation copper block (122), and the second groove (161) is located below the heat dissipation copper block (122).
  4. 4. The multi-layered circuit board heat dissipation structure according to claim 1, further comprising a metal substrate (190), wherein the metal substrate (190) is connected to a lower surface of the fourth copper foil (170) through a fourth insulating and heat conducting layer (180).
  5. 5. The multi-layered circuit board heat dissipating structure of claim 4, wherein the metal substrate (190) is a copper substrate.
  6. 6. The multilayer circuit board heat dissipating structure of claim 5, wherein the thickness of the metal substrate (190) is 1mm, the first copper foil (110) and the second copper foil (130) are 1oz copper foils, and the third copper foil (150) and the fourth copper foil (170) are Hoz copper foils.
  7. 7. The multi-layer circuit board heat dissipating structure of claim 4, wherein the first insulating and heat conducting layer (120), the second insulating and heat conducting layer (140), the third insulating and heat conducting layer (160), and the fourth insulating and heat conducting layer (180) are all high heat conducting PP layers.
  8. 8. The multilayer circuit board heat dissipating structure of claim 7, wherein the thickness of the first insulating and heat conducting layer (120) is 0.2mm, and the thickness of the second insulating and heat conducting layer (140), the third insulating and heat conducting layer (160), and the fourth insulating and heat conducting layer (180) are all 0.1mm.
  9. 9. The multi-layer circuit board heat dissipation structure according to claim 1, wherein the inner core board (100) and/or the second insulating and heat conducting layer (140) and/or the third insulating and heat conducting layer (160) are/is provided with a heat dissipation buried hole, and the heat dissipation buried hole is located between the third copper foil (150) and the fourth copper foil (170).
  10. 10. The multilayer circuit board heat dissipating structure of claim 9, wherein the heat dissipating buried via extends downward from the second insulating heat conducting layer (140) to the third insulating heat conducting layer (160), the inner wall of the heat dissipating buried via is provided with a copper layer extending upward to the upper end of the heat dissipating buried via and connected to the lower surface of the third copper foil (150), and the copper layer extends downward to the lower end of the heat dissipating buried via and connected to the upper surface of the fourth copper foil (170).

Description

Heat dissipation structure of multi-layer circuit board Technical Field The utility model relates to the technical field of circuit boards, in particular to a heat dissipation structure of a multilayer circuit board. Background A circuit board is a key component of an electronic device, which carries various electronic components and is responsible for delivering electrical signals and power. Since the electronic components generate heat during operation, the heat dissipation structure is critical to ensure proper operation of the circuit board. The existing heat dissipation structure is provided with a plurality of heat dissipation through holes on the circuit board, but the increase of the number of the heat dissipation through holes can lead to the increase of the size of the circuit board, and along with the increase of the functions of the existing electronic products, the wiring density is also higher and higher, and a place is difficult to find out and is specially used for arranging the heat dissipation through holes. Disclosure of utility model The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the utility model provides the multi-layer circuit board heat dissipation structure which can achieve a better heat dissipation effect and does not influence the layout of the circuit on the surface of the circuit board. The multi-layer circuit board heat radiation structure comprises an inner core board, a third copper foil, a first electroplating layer, a fourth copper foil and a second electroplating layer, wherein the inner core board comprises a first copper foil, a first insulating heat conduction layer and a second copper foil, the first insulating heat conduction layer is provided with a mounting hole, a heat radiation copper block is embedded in the mounting hole, the first copper foil is pressed on the upper surface of the first insulating heat conduction layer and is attached to the heat radiation copper block, the second copper foil is pressed on the lower surface of the first insulating heat conduction layer and is attached to the heat radiation copper block, the third copper foil is connected to the upper surface of the first copper foil through the second insulating heat conduction layer, the second insulating heat conduction layer is provided with a first groove which extends downwards to the first copper foil, a first electroplating layer is arranged in the first groove, the first electroplating layer is connected between the first copper foil and the third copper foil, the third insulating heat conduction layer is connected to the lower surface of the second copper foil, the second copper foil is provided with a second groove which extends upwards to the second copper foil, and the second electroplating layer is arranged in the second groove, and the fourth copper foil is connected between the second electroplating layer and the fourth copper foil. The multi-layer circuit board heat dissipation structure provided by the embodiment of the utility model has at least the following beneficial effects: In the heat dissipation structure of the multilayer circuit board provided by the embodiment of the utility model, the multilayer circuit board comprises the third copper foil, the second insulating heat conduction layer, the first copper foil, the first insulating heat conduction layer, the second copper foil, the third insulating heat conduction layer and the fourth copper foil which are sequentially arranged from top to bottom, wherein the mounting holes are formed in the first insulating heat conduction layer, the heat dissipation copper block is pressed into the mounting holes, and the first copper foil and the second copper foil can be pressed on the upper surface and the lower surface of the first insulating heat conduction layer and are contacted with the heat dissipation copper block in the subsequent pressing plate process, so that in the using process of the multilayer circuit board, the electronic component is arranged on the third copper foil on the outermost layer, heat generated by the electronic component can be transferred to the third copper foil and transferred to the heat dissipation copper block through the first electroplated layer, and then transferred to the fourth copper foil on the bottommost layer through the second electroplated layer and the heat is dissipated, thereby greatly improving the heat dissipation effect of the multilayer circuit board. According to some embodiments of the utility model, the first groove is formed on the upper surface of the third copper foil and extends downwards to the first copper foil, the first electroplated layer extends upwards from the first copper foil to be flush with the upper surface of the third copper foil, the second groove is formed on the upper surface of the fourth copper foil and extends upwards to the second copper foil, and the second electroplated layer ex