CN-224205307-U - Mining circuit board with embedded heat radiation structure

Abstract

The utility model relates to the technical field of circuit boards, in particular to a mining circuit board with a buried radiating structure, which comprises a circuit board main body, wherein a circuit board radiating mechanism is arranged in the circuit board main body, the circuit board radiating mechanism comprises a weather-proof layer fixedly connected to the top wall of the circuit board main body, the bottom end of the weather-proof layer is fixedly connected with an anti-corrosion layer, the bottom end of the anti-corrosion layer is fixedly connected with a waterproof layer, the bottom end of the waterproof layer is fixedly connected with a substrate, a glue overflow groove is arranged below the substrate, a radiating copper block is arranged in the glue overflow groove, and the glue overflow groove below the substrate is arranged at the bottom of the circuit board main body. According to the utility model, through the matching of the circuit board main body and the circuit board heat dissipation mechanism and through the mechanical interlocking structure of the glue overflow groove, the side groove and the extrusion block, the problems of copper block lamination deformation and glue overflow pollution are synchronously solved, and the curved surface lamination support is formed through the arc-shaped groove and the arc-shaped block, so that the bending strength of the heat dissipation copper block is improved.

Inventors

• CHEN ZHENGYI

Assignees

• 苏州标品杰电子科技有限公司

Dates

Publication Date

20260505

Application Date

20250521

Claims (7)

1. 1. The mining circuit board with the embedded type heat dissipation structure comprises a circuit board main body (1) and is characterized in that a circuit board heat dissipation mechanism (2) is arranged in the circuit board main body (1), the circuit board heat dissipation mechanism (2) comprises a weather-proof layer (201) fixedly connected to the top wall of the circuit board main body (1), an anti-corrosion layer (202) is fixedly connected to the bottom end of the weather-proof layer (201), a waterproof layer (203) is fixedly connected to the bottom end of the anti-corrosion layer (202), a substrate (204) is fixedly connected to the bottom end of the waterproof layer (203), a heat dissipation copper block (205) is arranged below the substrate (204) in the inner part of the glue overflow groove (210), the bottom of the substrate (204) is provided with a plurality of groups of side grooves (206) which are respectively arranged on two sides of the heat dissipation copper block (205), and the inside of the side grooves (206) is fixedly connected to the inner side wall of the circuit board main body (1) through a squeezing block (207).
2. 2. The mining circuit board with embedded heat dissipation structure as set forth in claim 1, wherein an arc block (208) is fixedly connected to the bottom wall of the circuit board main body (1), an arc groove (209) is formed in the bottom of the heat dissipation copper block (205), and the arc block (208) corresponds to the arc groove (209).
3. 3. The mining circuit board with the embedded heat dissipation structure of claim 1, wherein four groups of guide rods (3) are fixedly connected to the bottom end of the circuit board main body (1), and an inserting sheet type heat dissipation frame (9) is arranged below the circuit board main body (1).
4. 4. The mining circuit board with the embedded heat dissipation structure of claim 3, wherein the top end of the inserted sheet type heat dissipation frame (9) is fixedly connected with an heightening frame (8), and the top end of the inserted sheet type heat dissipation frame (9) is fixedly connected with a heat conduction pad (7).
5. 5. The mining circuit board with the embedded heat dissipation structure of claim 4, wherein a first clamping groove (5) is formed in the outer sides of two ends of the heightening frame (8), a folding ear buckle (4) is arranged above the first clamping groove (5), and the folding ear buckle (4) is fixedly connected to the bottom end of the circuit board main body (1).
6. 6. The mining circuit board with the embedded heat dissipation structure as set forth in claim 5, wherein a second clamping groove (10) is formed in the inner side of the folding ear buckle (4), and the second clamping groove (10) and the first clamping groove (5) are mutually clamped.
7. 7. The mining circuit board with the embedded heat dissipation structure as set forth in claim 4, wherein guide grooves (6) are formed in the tops of the heightening frames (8) and the inserting sheet type heat dissipation frames (9), and the guide grooves (6) are clamped with the guide rods (3).

Description

Mining circuit board with embedded heat radiation structure Technical Field The utility model relates to the technical field of circuit boards, in particular to a mining circuit board with a buried radiating structure. Background A multilayer printed circuit board, also known as a multilayer wiring board or PCB, is a printed board having more than two layers. The device consists of a plurality of layers of connecting wires on an insulating substrate and bonding pads for assembling and welding electronic elements, and has the function of conducting each layer of circuits and the function of mutual insulation. Through searching, the patent document with the bulletin number of CN 218959192U proposes a heat dissipation structure of a circuit board in a shell, and the novel heat dissipation structure of the circuit board in the shell comprises a concave heat dissipation bottom shell and the circuit board, wherein a plurality of heating electronic elements are arranged on the circuit board. The circuit board is embedded with heat conducting fins which are tightly attached to the heating electronic components in a one-to-one correspondence manner, the heat conducting fins are positioned at the bottoms of the heating electronic components, and two ends of the heat conducting fins penetrate through the circuit board and are tightly attached to the concave heat dissipation bottom shell. The side wall of the concave radiating bottom shell is provided with a plurality of strip-shaped through holes, the top end of the concave radiating bottom shell is provided with a radiating top plate, the radiating top plate is provided with a radiating fan electrically connected with the circuit board, and the radiating fan is positioned right above the circuit board. The heat-dissipation device has the beneficial effects that the bottom of the heating electronic element can be directly conducted to the concave heat-dissipation bottom shell, heat is conducted to the shell of the frequency converter through the concave heat-dissipation bottom shell, and in addition, the side wall and the top of the heating electronic element are subjected to heat dissipation by adopting the heat-dissipation fan, so that the omnibearing heat dissipation of the heating electronic element is realized, and the heat dissipation efficiency is greatly improved. Above-mentioned technical scheme is in the use, when the circuit board is in environment such as mine, needs to bury the embedded copper block to the inside of circuit board, and the in-process copper block of pressfitting is liable to take place deformation and the copper block with bury easy emergence of glue between the copper chamber, and then influence the normal use of circuit board. Therefore, it is necessary to invent a mining circuit board with a buried heat dissipation structure to solve the above problems. Disclosure of utility model The utility model aims to provide a mining circuit board with a buried radiating structure, which solves the problems that a copper block is easy to deform and glue overflow is easy to occur between the copper block and a buried copper cavity in the pressing process in the prior art by matching a circuit board main body with the circuit board radiating mechanism, so that the normal use of the circuit board is affected. In order to achieve the above purpose, the mining circuit board with the embedded type heat dissipation structure comprises a circuit board main body, wherein a circuit board heat dissipation mechanism is arranged in the circuit board main body, the circuit board heat dissipation mechanism comprises a weather-proof layer fixedly connected to the top wall of the circuit board main body, an anti-corrosion layer is fixedly connected to the bottom end of the weather-proof layer, a waterproof layer is fixedly connected to the bottom end of the anti-corrosion layer, a substrate is fixedly connected to the bottom end of the waterproof layer, a glue overflow groove is arranged below the substrate, a heat dissipation copper block is arranged in the glue overflow groove, the glue overflow groove below the substrate is arranged at the bottom of the circuit board main body, a plurality of groups of side grooves are formed in two sides of the heat dissipation copper block, an extrusion block is clamped in the side grooves and fixedly connected to the inner side wall of the circuit board main body, and deformation of the heat dissipation copper block is prevented through cooperation of the side grooves and the extrusion block when glue overflow grooves are prevented. Preferably, the bottom wall fixedly connected with arc piece of circuit board main part, the arc wall has been seted up to the bottom of heat dissipation copper billet, the arc piece is corresponding with the arc wall, utilizes the cooperation of arc piece and arc wall to further prevent the heat dissipation copper billet to warp. Preferably, the bottom fixedly connected with four guide bars of c