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CN-224205310-U - Circuit board

CN224205310UCN 224205310 UCN224205310 UCN 224205310UCN-224205310-U

Abstract

The utility model belongs to the technical field of circuit board processing, and discloses a circuit board. The circuit board comprises two outer laminates and a plurality of core plates, all the core plates are clamped between the two outer laminates, prepregs are arranged between the two outer laminates and the plurality of core plates, the top side and the bottom side of each core plate are provided with hot melting modules, the hot melting modules close to one side of the outer laminates in the two core plates close to the two outer laminates are first hot melting modules, each first hot melting module comprises a plurality of bulges, the bulges are arranged at intervals in the corresponding core plates, each bulge extends along the thickness direction of the core plate, and the bulges are used for transmitting heat to the prepregs. According to the utility model, the hot melting module on one side of the outermost core plate, which is close to the outer layer plate, does not form a loop under the action of high-frequency electromagnetic wave current, so that the local deformation of the outermost core plate can be prevented, and the position of the hot melting module can be prevented from foaming when the outer layer plate is subjected to high-temperature film pasting during hot melting and after lamination.

Inventors

  • Du Chaofu
  • XIE MINGYUN
  • LI QINYUAN

Assignees

  • 广州广合科技股份有限公司

Dates

Publication Date
20260505
Application Date
20250528

Claims (10)

  1. 1. The utility model provides a circuit board, its characterized in that includes two outer plywood and a plurality of core (1), two the clamp is whole between the outer plywood core (1), in two outer plywood and a plurality of in core (1), all be equipped with the prepreg between the adjacent two, every the topside and the bottom side of core (1) all are equipped with the hot melt module, in two core (1) that are close to two outer plywood, two core (1) are close to the hot melt module of outer plywood one side is the first hot melt module, the first hot melt module includes a plurality of protruding (21), a plurality of protruding (21) interval sets up in corresponding core (1), every protruding (21) all are followed the thickness direction of core (1) is extended, a plurality of protruding (21) are used for to the prepreg transfer heat, a plurality of the clearance between protruding (21) is used for filling the hot melt adhesive after the prepreg melts.
  2. 2. Circuit board according to claim 1, characterized in that a plurality of said projections (21) are arranged in a matrix in the corresponding core board (1).
  3. 3. Circuit board according to claim 1, characterized in that the projections (21) are of cylindrical configuration.
  4. 4. The circuit board according to claim 1, wherein the first heat-fusible pattern block further comprises a first glue filling area (22) and a first glue blocking line (23), all the protrusions (21) are located in the first glue filling area (22), and the first glue blocking line (23) is disposed on one side of the first glue filling area (22) and away from the outer edge (10) of the corresponding core board (1).
  5. 5. Circuit board according to claim 1, characterized in that the heat-fusible modules at the top and bottom sides of the core plate (1) remote from the outer layer plate are each a second heat-fusible module, the second heat-fusible module comprising at least one heat transfer plate (31), the heat transfer plate (31) being arranged at the corresponding core plate (1), the heat transfer plate (31) being arranged for transferring heat to the prepreg, the gaps of the heat transfer plate (31) being arranged for filling the melted heat-fusible glue of the prepreg.
  6. 6. Circuit board according to claim 5, characterized in that, in the two core boards (1) close to the two outer layers, the heat-fusible modules of the side of the two core boards (1) remote from the outer layers are both the second heat-fusible modules.
  7. 7. Circuit board according to claim 6, characterized in that the heat transfer plate (31) is a solid plate or a mesh plate.
  8. 8. The circuit board of claim 7, wherein when said heat transfer plate (31) is a mesh plate, said second heat fusion module further comprises a second glue filling area (32), said second glue filling area (32) is surrounded outside said mesh plate, said first heat fusion module further comprises a first glue filling area (22), all of said protrusions (21) are located in said first glue filling area (22), and the coverage area of said first glue filling area (22) on the corresponding core plate (1) is smaller than the coverage area of said second glue filling area (32) on the corresponding core plate (1).
  9. 9. The circuit board according to claim 8, wherein when the heat transfer plate (31) is a mesh plate, the second heat fusion module further comprises a support member (34), the support member (34) being provided to the corresponding core plate (1), the support member (34) being located in the second glue filling area (32) and being spaced apart from the mesh plate, and/or, When the heat transfer plate (31) is a mesh plate, the second hot melting module further comprises a second glue blocking line (33), and the second glue blocking line (33) is arranged on one side of the second glue filling area (32) and far away from the outer edge (10) of the corresponding core plate (1).
  10. 10. A circuit board according to claim 1, characterized in that the material of the protrusions (21) is copper.

Description

Circuit board Technical Field The utility model relates to the technical field of circuit board processing, in particular to a circuit board. Background In the circuit board manufacturing process, the prepreg is required to be melted by adopting the thermal melting mold block so as to bond the core plate, the core plate and the outer layer plate together, in addition, in the circuit board manufacturing process, according to the change of a product structure, the requirements on impedance are more and more stringent, the thickness of the outermost layer is more and more thinner, the prepreg is also more and more thinner, most of prepregs selected for the outermost layer are single or flat cloth, and the glue content of the prepregs is less. On the basis of low glue content of the prepreg of the outermost layer, most of the heat-fusible pattern blocks on the core plate of the outermost layer are all copper sheets, when in hot melting, the heat-fusible pattern blocks of the core plate of the outermost layer form a loop under the action of high-frequency electromagnetic wave current, heat instantly, the heat-fusible pattern blocks of the core plate of the outermost layer are heated at a local high temperature, so that the core plate of the outermost layer is easy to locally deform and uneven, the flatness of the core plate of the outermost layer cannot be ensured, the heat-fusible pattern blocks are easy to foam, the conditions of pressure loss and hollowness are easy to occur during pressing, and then a circuit board is scrapped when the core plate and the outer layer are pressed. In addition, when the outer layer plate is subjected to high-temperature film pasting after lamination, the position of the heat fusion die block on the outermost layer core plate is easy to foam due to the fact that the temperature of the heat fusion die block on the outermost layer core plate is higher, and the conditions of pressure loss and cavities occur. Disclosure of utility model The utility model aims to provide a circuit board, wherein a hot melting module on one side of an outermost core board, which is close to an outer layer board, cannot form a loop under the action of high-frequency electromagnetic wave current, so that the position of the hot melting module on the outermost core board, which is close to one side of the outer layer board, can be prevented from being high-temperature, the outermost core board can be deformed locally, and the conditions of pressure loss and cavities at the position of a hot melting module can be avoided. To achieve the purpose, the utility model adopts the following technical scheme: The circuit board comprises two outer laminates and a plurality of core boards, wherein all the core boards are clamped between the two outer laminates, prepregs are arranged between the two outer laminates and the plurality of core boards, the top side and the bottom side of each core board are respectively provided with a hot melt module, the two core boards close to the two outer laminates are respectively a first hot melt module, each first hot melt module comprises a plurality of bulges, the bulges are arranged at the corresponding core boards at intervals, each bulge extends along the thickness direction of the core board, the bulges are used for transmitting heat to the prepregs, and gaps between the bulges are used for filling the hot melt adhesive after the prepregs are melted. In some possible embodiments, a plurality of the protrusions are arranged in a matrix in the corresponding core plate. In some possible embodiments, the protrusions are cylindrical structures. In some possible embodiments, the first heat-melting die block further includes a first glue filling area and a first glue-blocking line, all the protrusions are located in the first glue filling area, and the first glue-blocking line is disposed on one side of the first glue filling area and is disposed away from the outer edge of the corresponding core board. In some possible embodiments, the hot melt modules at the top and bottom sides of the core plate far from the outer layer plate are both second hot melt modules, the second hot melt modules include at least one heat transfer plate, the heat transfer plate is disposed on the corresponding core plate, the heat transfer plate is used for transferring heat to the prepreg, and the gaps of the heat transfer plate are used for filling the hot melt adhesive after the prepreg is melted. In some possible embodiments, among the two core plates near the two outer laminate plates, the heat-fusion modules on the sides of the two core plates away from the outer laminate plates are both the second heat-fusion modules. In some possible embodiments, the heat transfer plates are solid plates or mesh plates. In some possible embodiments, when the heat transfer plate is a mesh plate, the second thermal melting module further includes a second glue filling area, the second glue filling area is surroun