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CN-224205319-U - Force calculation card BGA chip circuit board bonding pad structure

CN224205319UCN 224205319 UCN224205319 UCN 224205319UCN-224205319-U

Abstract

The utility model relates to a circuit board bonding PAD structure of a power card BGA chip, which comprises a substrate, wherein four corners of one surface of the substrate are respectively provided with a copper layer and an insulating layer, a plurality of fixed PADs which are symmetrically arranged in an array are arranged on the copper layer, each fixed PAD comprises a main body part and a plurality of protruding parts, each protruding part is connected or disconnected with the copper layer, if the protruding part is disconnected with the copper layer, the insulating layer is completely arranged on the periphery of the fixed PAD in a surrounding mode, and if the protruding part is connected with the copper layer, an opening is formed in the position, corresponding to the protruding part, of the insulating layer. The utility model has the advantages of improving heat dissipation efficiency, avoiding stress concentration and improving the combination stability of the chip and the circuit board.

Inventors

  • LIU YANHUA
  • HUANG HAIQING
  • WANG HUI
  • YAN DELIN
  • CHEN TAO
  • ZHAO QIXIANG

Assignees

  • 胜宏科技（惠州）股份有限公司

Dates

Publication Date
20260505
Application Date
20250528

Claims (10)

  1. 1. The utility model provides a power card BGA chip circuit board PAD structure, its characterized in that includes the base plate, four bights of base plate one side all are equipped with copper layer and insulating layer, be equipped with the fixed PAD that a plurality of symmetry array was arranged on the copper layer, fixed PAD includes main part and a plurality of bellying, the bellying with copper layer links to each other or breaks off, if the bellying with copper layer breaks off, the insulating layer encloses completely and establishes fixed PAD's periphery, if the bellying with copper layer links to each other, the insulating layer corresponds the position of bellying is equipped with the opening.
  2. 2. The power card BGA chip board PAD structure of claim 1, wherein the number of fixed PADs at each corner is between 5-9.
  3. 3. The circuit board bonding pad structure of the power card BGA chip of claim 1, wherein the main body part is round, the number of the protruding parts is four, and the four protruding parts are connected with the copper layer.
  4. 4. The circuit board bonding pad structure of a power card BGA chip of claim 1, wherein the width of the protruding portion is between 5mil and 7 mil.
  5. 5. The power card BGA chip circuit board bonding pad structure according to claim 1, wherein the main body part is circular, two protruding parts are arranged, and the two protruding parts are distributed horizontally or vertically and are connected with the copper layer.
  6. 6. The circuit board bonding pad structure of the power card BGA chip of claim 1, wherein the main body part is circular, two protruding parts are arranged, and the two protruding parts are obliquely distributed at an angle of 45 degrees and are connected with the copper layer.
  7. 7. The circuit board bonding pad structure of the power card BGA chip of claim 1, wherein the main body part is circular, two protruding parts are arranged, and the two protruding parts are obliquely distributed at an angle of 45 degrees and disconnected with the copper layer.
  8. 8. The power card BGA chip circuit board pad structure of claim 1, wherein the main body portion is circular, two of the protruding portions are vertically distributed and disconnected from the copper layer.
  9. 9. The circuit board bonding PAD structure of the power card BGA chip of claim 1, wherein a layer of blind holes or stacked holes are arranged on the substrate, and the blind holes or the stacked holes are positioned in the middle of the fixed PAD.
  10. 10. The power card BGA chip circuit board pad structure of claim 9, wherein the blind holes are filled with electroplated copper or resin.

Description

Force calculation card BGA chip circuit board bonding pad structure Technical Field The utility model relates to the technical field of circuit boards, in particular to a circuit board bonding pad structure of a BGA chip of a computer vertical card. Background With the advent of the AI age, AI standing cards needed to use kilowatt high-power, high-frequency and high-reliability chips, and found that the high-power, high-frequency and high-reliability chips and circuit boards, namely PCBs, have too large stress differences to cause cracks at the bottoms of PCBs during production and detection, mainly because the four-corner fixed PADs on the circuit boards of the existing BGA chips are mainly based on conventional chips, the conventional chips have only a few watts in power, have low frequency and are generally reliable, and therefore, the design of the four-corner fixed PADs on the conventional circuit boards can not meet the requirements of product development. Disclosure of utility model The utility model aims to provide a pad structure of a BGA chip circuit board of a power card, which can improve heat dissipation efficiency, avoid stress concentration and improve the combination stability of the chip and the circuit board. The utility model provides a power card BGA chip circuit board PAD structure, includes the base plate, four bights of base plate one side all are equipped with copper layer and insulating layer, be equipped with the fixed PAD that a plurality of symmetry array was arranged on the copper layer, fixed PAD includes main part and a plurality of bellying, the bellying with the copper layer links to each other or breaks off, if the bellying with the copper layer breaks off, the insulating layer encloses completely and establishes fixed PAD's periphery, if the bellying with the copper layer links to each other, the insulating layer corresponds the position of bellying is equipped with the opening. In the scheme, the outer circumferences of the fixed PADs and the insulating layer are copper layers, so that the residual copper rate of the area of the BGA chip of the power card is increased, the local temperature difference between the chip and the PCB is effectively reduced, the thermal stress caused by mismatching of thermal expansion coefficients is reduced, the fixed PADs are symmetrically distributed, the mechanical load of the chip to the substrate is evenly dispersed, the stress difference between the BGA chip of the power card and the area of the substrate is reduced, the substrate is prevented from cracking due to stress concentration, the bulge on the fixed PADs can increase the binding force between the chip and the substrate, the instant temperature rise during the operation of the high-power chip can lead the copper layer to be rapidly expanded, the tensile stress of the bulge due to the thermal expansion difference can be reduced due to disconnection, the insulating layer is completely arranged on the outer circumference of the fixed PAD, the electrical isolation reliability can be ensured due to the fact that the opening is arranged at the bulge position, the insulating layer is connected with the copper layer, the bulge is equivalent to increasing the heat dissipation channel in the vertical direction for the chip heat, and the heat can be rapidly conducted to the inside the substrate or the heat dissipation part through the copper layer. Further, the number of the fixed PADs at each corner is 5-9. In the scheme, the 5-9 bonding pads are symmetrically arranged in an array manner, so that acting forces in the horizontal direction and the vertical direction of a plane can be increased, the connection stability between the chip and the substrate is improved, the even dispersion in the longitudinal direction and the transverse direction can be ensured, the mechanical load of the chip on the substrate can be ensured, and the substrate cracking caused by stress concentration can be avoided. Further, the main body part is circular, four protruding parts are arranged, and the four protruding parts are connected with the copper layer. In the scheme, compared with the traditional square or polygonal bonding PAD, the fixed PAD with the round structure has no sharp corner, can avoid microcrack expansion caused by stress concentration, improve the durability of the bonding PAD under thermal cycle and mechanical vibration, ensure that four protruding parts are symmetrically distributed (crisscross layout) by 90 degrees, ensure that at least two protruding parts bear load when the fixed PAD is stressed in any direction, avoid single-point failure, and enable the four protruding parts to be directly connected with a copper layer to form a plurality of parallel thermal channels, thereby obviously reducing thermal resistance. Further, the width of the protruding portion is 5 mil-7 mil. In the scheme, the design of the width of the protruding part of 5 ml-7 mil (0.127 mm-0.178 mm) can provide an e