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CN-224205406-U - Electronic device packaging structure, electronic device assembly and cooking utensil

CN224205406UCN 224205406 UCN224205406 UCN 224205406UCN-224205406-U

Abstract

The utility model provides an electronic device packaging structure, an electronic device assembly and a cooking utensil, wherein the electronic device packaging structure comprises a shell body and a glue injection port, wherein the shell body is provided with an inner cavity, the glue injection port is arranged on the top surface of the shell body and communicated with the inner cavity, the glue injection port is used for the electronic device to pass through so as to mount the electronic device into the inner cavity, a space is reserved between the electronic device and the side wall of the shell body, a supporting convex part is arranged on the bottom wall of the shell body and used for supporting the electronic device, and a glue flowing groove is formed between the supporting convex part and the side wall of the shell body. The technical scheme of the utility model effectively solves the problem of poor waterproof performance of the electronic device in the related technology.

Inventors

  • LIN JUNPENG
  • WANG BIN
  • WANG BENXIN
  • WANG BANGHUA

Assignees

  • 浙江绍兴苏泊尔生活电器有限公司

Dates

Publication Date
20260505
Application Date
20250326

Claims (13)

  1. 1. An electronic device package, comprising: A housing body (10) having an inner cavity (11); A glue injection port (20) arranged on the top surface of the shell body (10) and communicated with the inner cavity (11), wherein the glue injection port (20) is used for enabling an electronic device (1) to pass through so as to install the electronic device (1) into the inner cavity (11), and a space is reserved between the electronic device (1) and the side wall of the shell body (10); And a supporting convex part (30) which is arranged on the bottom wall of the shell body (10) and is used for supporting the electronic device (1), wherein a glue flowing groove (40) is formed between the supporting convex part (30) and the side wall of the inner cavity (11).
  2. 2. The electronic device package according to claim 1, wherein the glue flow groove (40) is provided along a circumferential direction of the case body (10).
  3. 3. The electronic device package according to claim 1, wherein the glue flow groove (40) has a depth of between 0.8mm and 1.5mm and/or the glue flow groove (40) has a width of between 0.8mm and 1.5 mm.
  4. 4. The electronic device packaging structure according to claim 1, wherein the supporting protrusion (30) is an annular supporting rib (31), the annular supporting rib (31) is disposed on the bottom wall of the case body (10), the annular supporting rib (31) is located below the electronic device (1) and is in abutting fit with the electronic device (1), and the glue flowing groove (40) is formed among the side wall of the case body (10), the annular supporting rib (31) and the bottom wall of the case body (10).
  5. 5. The electronic device package according to claim 4, wherein the annular supporting ribs (31) have a height of between 1mm and 1.5 mm.
  6. 6. The electronic device package according to claim 1, further comprising a guiding structure (50), the guiding structure (50) being arranged on an inner side wall of the housing body (10).
  7. 7. The electronic device packaging structure according to claim 6, wherein the guiding structure (50) comprises a plurality of guiding ribs (51), the plurality of guiding ribs (51) are arranged at intervals along the circumferential direction of the shell body (10), guiding inclined planes (511) are arranged on each guiding rib (51), and the distance between the guiding inclined planes (511) and the side wall of the shell body (10) is gradually increased in the direction from the glue injection port (20) to the bottom wall of the shell body (10).
  8. 8. The electronic device package according to any one of claims 1 to 7, further comprising a wire fixing portion (60), the wire fixing portion (60) being provided at an upper portion of the case body (10), the wire fixing portion (60) being higher than the case body (10).
  9. 9. The electronic device package according to any one of claims 1 to 7, further comprising a stopper (70), the stopper (70) being provided on a side wall of the case body (10) and being located inside the inner cavity (11).
  10. 10. The electronic device package structure according to claim 9, further comprising an abutting portion (80), the abutting portion (80) being provided on a bottom wall of the case body (10) and being provided in correspondence with the stopper (70), the electronic device (1) being insertable between the abutting portion (80) and the stopper (70).
  11. 11. An electronic device assembly, characterized in that the electronic device assembly comprises an electronic device package structure and an electronic device (1) mounted within the electronic device package structure, the electronic device package structure being an electronic device package structure according to any one of claims 1 to 10.
  12. 12. The electronic component assembly according to claim 11, wherein the electronic component (1) protrudes from the support protrusion (30) towards the side wall of the housing body (10).
  13. 13. A cooking appliance characterized in that it comprises an electronic component, which is an electronic component according to claim 11 or 12.

Description

Electronic device packaging structure, electronic device assembly and cooking utensil Technical Field The utility model relates to the technical field of small household appliances, in particular to an electronic device packaging structure, an electronic device assembly and a cooking utensil. Background At present, in order to ensure the waterproof performance of an electronic device, the electronic device is generally required to be packaged. The electronic device is put into the shell, and then the shell is encapsulated by glue filling. In the related art, when the electronic device is encapsulated by glue filling, glue is filled between the upper surface of the electronic device and the side wall of the shell above the upper surface of the electronic device, so that water is easy to enter below the electronic device from the gap between the shell and the glue, and the welding spots below the electronic device are affected, namely, the water is easy to enter below the electronic device by the mode, so that the waterproof performance of the electronic device is affected. Disclosure of utility model The utility model mainly aims to provide an electronic device packaging structure, an electronic device assembly and a cooking utensil, so as to solve the problem of poor waterproof performance of electronic devices in the related art. In order to achieve the above object, according to one aspect of the present utility model, there is provided an electronic device package structure including a case body having an inner cavity, a glue injection port provided on a top surface of the case body and communicating with the inner cavity, the glue injection port allowing the electronic device to pass therethrough for mounting the electronic device into the inner cavity, the electronic device having a space between the electronic device and a side wall of the case body, and a support protrusion provided on a bottom wall of the case body for supporting the electronic device, the support protrusion and the side wall of the inner cavity forming a glue flow groove therebetween. By applying the technical scheme of the utility model, the shell body is provided with an inner cavity, and the glue injection port is arranged on the top surface of the shell body and is communicated with the inner cavity. The electronic device can be mounted to the interior of the internal cavity through the glue injection port. The electronic device and the side wall of the inner cavity are provided with a space, the bottom wall of the inner cavity is provided with a supporting convex part, the supporting convex part can support the electronic device, and a glue flowing groove is formed between the supporting convex part and the side wall of the inner cavity. Through the arrangement, after the electronic device is filled into the inner cavity through the glue injection port, the supporting convex part can support the electronic device. When glue is injected through the glue injection port, the glue can flow to the edge of the electronic device through the upper surface of the electronic device, and as the space is arranged between the electronic device and the side wall of the inner cavity, the glue can flow down through the space and enter the glue flow groove, and after the glue is filled in the glue flow groove, the glue can overflow and wrap the edge of the electronic device. Namely, the glue body can wrap the upper surface and the edge of the electronic device, so that the waterproof performance of the electronic device can be effectively improved. Therefore, the technical scheme of the utility model effectively solves the problem of poor waterproof performance of the electronic device in the related technology. Further, the gumming groove is arranged along the circumferential direction of the shell body. The arrangement can ensure that all edges of the electronic device can be wrapped by the colloid. Further, the depth of the gumming groove is between 0.8mm and 1.5mm, and/or the width of the gumming groove is between 0.8mm and 1.5 mm. The size setting can ensure that enough colloid is contained in the gumming groove, so that the colloid can wrap the edge of the electronic device better. Further, the supporting convex part is an annular supporting rib, the annular supporting rib is arranged on the bottom wall of the shell body, the annular supporting rib is located below the electronic device and is in butt fit with the electronic device, and the gummosis groove is formed among the side wall of the shell body, the annular supporting rib and the bottom wall of the shell body. The annular supporting rib is simple in structure and convenient to set, welding spots on the electronic device can be protected by the annular supporting rib, contact between the colloid and the welding spots on the electronic device is avoided, and therefore the welding spots can be prevented from being damaged. Further, the height of the annular supporting ribs is betwe