CN-224205409-U - Anti-interference laminated module combined structure

CN224205409UCN 224205409 UCN224205409 UCN 224205409UCN-224205409-U

Abstract

The utility model provides an anti-interference laminated module combination structure which comprises at least two radio frequency processing modules, wherein each radio frequency processing module comprises an anti-interference shell and a PCBA board, the PCBA board is arranged in the shell, a connecting part is arranged on the shell, a connecting terminal is arranged on the PCBA board, an anti-interference connecting interface corresponding to the connecting terminal is arranged on the shell, the connecting terminal stretches into the connecting interface, when any at least two radio frequency processing modules are laminated and connected, the shells of the adjacent two radio frequency processing modules are connected through the connecting part, the connecting terminal and the connecting interface between the adjacent two radio frequency processing modules are respectively butted, and the butted two connecting interfaces are used for anti-interference sealing the two connecting terminals butted in the shell. In the utility model, the radio frequency processing modules can be randomly stacked and combined at will, and the modules are electrically connected only by butt joint of the connecting terminals on the PCBA board, so that no additional fixing piece and data communication line are needed, and the defect of the current module mounting structure on the market can be effectively overcome.

Inventors

WANG TAO
WANG CHUNJING

Assignees

上海特金信息科技有限公司

Dates

Publication Date: 20260505
Application Date: 20250529

Claims (10)

1. The anti-interference laminated module combination structure is characterized by comprising at least two radio frequency processing modules, wherein each radio frequency processing module comprises an anti-interference shell and a PCBA board, each PCBA board is arranged in each shell, each shell is provided with a connecting part, each PCBA board is provided with a connecting terminal, each shell is provided with an anti-interference connecting interface corresponding to each connecting terminal, each connecting terminal stretches into each connecting interface, when any at least two radio frequency processing modules are laminated and connected, the shells of the adjacent two radio frequency processing modules are connected through the connecting parts, the connecting terminals and the connecting interfaces between the adjacent two radio frequency processing modules are respectively in butt joint, and the two connecting interfaces in butt joint are used for anti-interference sealing of the two connecting terminals in butt joint.
2. The anti-interference laminated module combination structure according to claim 1, wherein the connection portion is provided with a connection hole, and the connection portion of the laminated radio frequency processing module is fastened and connected through the connection hole by a fastener.
3. The anti-interference laminated module combination structure according to claim 1, wherein the connection interface is a hollow boss structure, and the butt end of the connection terminal extends from the connection interface to the outside of the connection interface or is located in the connection interface; and in the two abutted connection terminals, the abutted end of one connection terminal extends out of the corresponding connection interface to the other connection interface to be abutted with the other connection terminal.
4. The anti-interference laminated module combination structure according to claim 3, wherein a heat dissipation groove is formed in at least one laminated surface of the housing, the connection interface is located in the heat dissipation groove, and a butt end surface of the connection interface protrudes out of a bottom surface of the heat dissipation groove and is flush with the laminated surface of the housing.
5. The laminated module assembly structure according to any one of claims 1 to 4, comprising at least three radio frequency processing modules, wherein at least two connection terminals are provided on the PCBA board of the radio frequency processing module located in the middle layer, the two connection terminals are respectively located on the upper and lower surfaces of the PCBA board, and the upper and lower surfaces of the housing of the radio frequency processing module are respectively provided with upper and lower connection interfaces corresponding to the upper and lower connection terminals.
6. The laminated module assembly according to any one of claims 1 to 4, wherein at least one connection terminal is provided on an upper surface of the PCBA board of the radio frequency processing module located at the lowermost layer, and the connection interface corresponding to the connection terminal is provided on an upper surface of the housing of the radio frequency processing module.
7. The laminated module assembly according to any one of claims 1 to 4, wherein at least one connection terminal is provided on a lower surface of the PCBA board of the radio frequency processing module located at an uppermost layer, and the connection interface corresponding to the connection terminal is provided on a lower surface of the housing of the radio frequency processing module.
8. The tamper resistant stacked module combination of claim 1, wherein the PCBA board is mounted entirely within the housing or partially within the housing, and wherein the tamper-susceptible portion of the PCBA board is located within the housing.
9. The tamper resistant stacked module combination of claim 1, wherein said connection interface is integrally formed with said housing and is formed of a tamper resistant material.
10. The laminated module assembly according to claim 1, wherein the two connection terminals are mated in a plugging manner.

Description

Anti-interference laminated module combined structure Technical Field The utility model relates to the technical field of radio frequency processing modules, in particular to an anti-interference laminated module combination structure. Background Unmanned aerial vehicle detection equipment on the market at present, especially the detection equipment that utilizes radio frequency spectrum detection technical scheme, the equipment is inside to relate to various radio frequency processing module combinations, structural installation and data communication between each module relate to various fixed bolster and the data transmission winding displacement that the structure is complicated, simultaneously in order to solve the inside EMC electromagnetic compatibility problem of equipment, the inside easily disturbed part of equipment needs to be the shielding structure such as various shielding covers, the connection winding displacement needs to be the measure of shielding layer, various electromagnetic interference prevention such as magnetic bead, the installation is complicated, it is high to the requirement of equipment technology and material manufacturing, simultaneously inconvenient derivative extension of equipment, when the inside module combination of equipment changes, need do corresponding module mounting again. Therefore, how to solve the problem of anti-electromagnetic interference of the modules, meanwhile, each module can be randomly stacked and combined at will, and additional fixing pieces and data communication wires are not needed between the modules, so that the technical problem of the technology is needed in the field. Disclosure of utility model In order to solve the problems, the utility model provides an anti-interference laminated module combination structure, which comprises at least two radio frequency processing modules, wherein each radio frequency processing module comprises an anti-interference shell and a PCBA board, the PCBA board is arranged in the shell, a connecting part is arranged on the shell, a connecting terminal is arranged on the PCBA board, an anti-interference connecting interface corresponding to the connecting terminal is arranged on the shell, the connecting terminal stretches into the connecting interface, when any at least two radio frequency processing modules are laminated and connected, the shells of the two adjacent radio frequency processing modules are connected through the connecting part, the connecting terminal and the connecting interface between the two adjacent radio frequency processing modules are respectively butted, and the butted two connecting interfaces seal the two connecting terminals in the butted two connecting interfaces in an anti-interference way. Optionally, the connecting portion is provided with a connecting hole, and the connecting portion of the stacked radio frequency processing module passes through the connecting hole through a fastener to be fastened and connected. Optionally, the connection interface is a hollow boss structure, and the butt end of the connection terminal extends from the connection interface to the outside of the connection interface or is located in the connection interface; and in the two abutted connection terminals, the abutted end of one connection terminal extends out of the corresponding connection interface to the other connection interface to be abutted with the other connection terminal. Optionally, a heat dissipation groove is formed on at least one lamination surface of the shell, the connection interface is located in the heat dissipation groove, and the butt end surface of the connection interface protrudes out of the bottom surface of the heat dissipation groove and is flush with the lamination surface of the shell. Optionally, the anti-interference stacked module combined structure comprises at least three radio frequency processing modules, at least two connecting terminals are arranged on the PCBA board of the radio frequency processing module at the middle layer, the two connecting terminals are respectively arranged on the upper surface and the lower surface of the PCBA board, and the upper surface and the lower surface of the shell of the radio frequency processing module are respectively provided with an upper connecting interface and a lower connecting interface which correspond to the upper connecting terminal and the lower connecting terminal. Optionally, at least one connection terminal is disposed on the upper surface of the PCBA board of the radio frequency processing module located at the lowest layer, and the connection interface corresponding to the connection terminal is disposed on the upper surface of the housing of the radio frequency processing module. Optionally, at least one connection terminal is disposed on the lower surface of the PCBA board of the radio frequency processing module located at the uppermost layer, and the connection interface corresponding to the connect