CN-224205432-U - Circuit board heat radiation structure and heat pump water heater

Abstract

The application discloses a circuit board heat radiation structure and a heat pump water heater, which relate to the technical field of heat pump water heaters, wherein the circuit board heat radiation structure comprises a circuit board assembly, a heat exchanger assembly and a heat pipe, the first end of the heat pipe is connected with the circuit board assembly, so that the first end of the heat pipe can absorb heat of the circuit board assembly, the second end of the heat pipe is connected with the heat exchanger assembly, the second end of the heat pipe can transfer heat to the heat exchanger component, the heat exchanger component can be communicated with cooling water, after heat exchange is carried out with the cooling water, the cooling water can take away heat, heat dissipation to the circuit board component is achieved, and when the circuit board component cannot be directly connected with the heat exchanger component, the circuit board component can be connected with the heat exchanger component through the heat pipe and form heat conduction contact, so that the heat exchanger component can dissipate heat to the circuit board component.

Inventors

• LUO JINLIUSHENG
• LI YANG
• LI HONGWEI
• HUANG LIANGWEI
• LI LIANGTAN
• HUANG JUNGE
• CHEN XULANG

Assignees

• 广东美的暖通设备有限公司
• 合肥美的暖通设备有限公司

Dates

Publication Date

20260505

Application Date

20250124

Claims (11)

1. 1. A circuit board heat dissipation structure, comprising: A circuit board assembly; The heat exchanger assembly is used for communicating cooling water and comprises a heat exchanger main body and a pipeline structure communicated with the heat exchanger main body, wherein the pipeline structure is used for communicating with the cooling water; the first end of the heat pipe is connected with the circuit board assembly to absorb heat of the circuit board assembly, the second end of the heat pipe is connected with the heat exchanger main body to transfer heat to the heat exchanger main body, the heat exchanger main body is used for heating cooling water, and the first end and the second end of the heat pipe are opposite ends.
2. 2. The circuit board heat dissipation structure of claim 1, wherein the heat pipe comprises a first pipe section, a connecting pipe section and a second pipe section connected in sequence, the first pipe section has a first end of the heat pipe, the first pipe section is disposed at an angle with the connecting pipe section, the second pipe section has a second end of the heat pipe, and the second pipe section is disposed at an angle with the connecting pipe section.
3. 3. The circuit board heat dissipating structure of claim 1, wherein said heat exchanger assembly is at least partially made of a metallic material, and wherein said second end of said heat pipe is connected to and in heat conductive contact with said metallic portion of said heat exchanger assembly.
4. 4. The circuit board heat dissipating structure of claim 1, wherein the heat exchanger assembly has a mating hole, and the second end of the heat pipe is mated to the mating hole and contacts the cooling water.
5. 5. The circuit board heat dissipating structure of claim 4, wherein said circuit board heat dissipating structure comprises: The sealing piece is arranged between the heat pipe and the heat exchanger component and surrounds the periphery of the plug hole so as to seal a gap between the heat pipe and the heat exchanger component.
6. 6. The circuit board heat dissipating structure of claim 1, wherein the second end of the heat pipe is screwed to the heat exchanger assembly and a heat conductive adhesive is provided at the screwed connection.
7. 7. The circuit board heat dissipating structure of claim 1, wherein the second end of the heat pipe is in interference fit connection with the heat exchanger assembly and a heat conductive glue is provided at the interference fit.
8. 8. The circuit board heat dissipating structure of claim 1, wherein said circuit board assembly comprises a printed circuit board and a heat generating component disposed on said printed circuit board, said first end of said heat pipe being connected to and in thermally conductive contact with said heat generating component.
9. 9. The circuit board heat dissipating structure of claim 8, wherein said circuit board assembly comprises a plurality of said heat generating components, said circuit board heat dissipating structure comprising a plurality of said heat pipes, a first end of one of said heat pipes being connected to and in thermally conductive contact with a corresponding one of said heat generating components.
10. 10. The circuit board heat dissipating structure of claim 1, comprising a thermally conductive member disposed in said heat exchanger assembly, said second end of said heat pipe being connected to said thermally conductive member.
11. 11. A heat pump water heater, comprising: A case; a compressor assembly disposed within the housing; the fan assembly is arranged in the box body; The circuit board heat radiation structure according to any one of claims 1 to 10, wherein the heat exchanger assembly is disposed in the case, and the heat exchanger assembly is connected to the compressor assembly, and the circuit board assembly is connected to the heat exchanger assembly through the heat pipe and exchanges heat.

Description

Circuit board heat radiation structure and heat pump water heater Technical Field The application relates to the technical field of heat pump water heaters, in particular to a circuit board heat dissipation structure and a heat pump water heater. Background At present, a heat pump water heater uses a small amount of electric energy as power, uses a refrigerant as a carrier, continuously absorbs lower-temperature heat energy in an environmental heat source (such as water and air), converts the lower-temperature heat energy into higher-temperature heat energy, and releases the higher-temperature heat energy into water to be heated. The heat pump water heater generally comprises a circuit board assembly, the start-stop and heat exchange work of the heat pump water heater are controlled through the circuit board assembly, the circuit board assembly comprises a plurality of heating devices such as a capacitor, an inductor and a resistor, and when the circuit board assembly works, the heating devices can generate larger heat, and if heat is not dissipated in time, the temperature of the heating devices is too high and the heating devices are damaged. In the related art, a radiator is arranged on a circuit board, the radiator comprises a radiating base and radiating fins, the radiating base is fixed on the circuit board and connected with the radiating fins, and heat is radiated through the radiating fins. However, the radiator occupies a large space, and when the installation space is limited, the radiator cannot be directly connected with the circuit board, and the radiator has a complex structure. Disclosure of utility model The embodiment of the application provides a circuit board heat radiation structure and a heat pump water heater, which can solve the technical problem that the heat radiation structure is inconvenient to directly arrange on a circuit board when the installation space is limited. In a first aspect, an embodiment of the present application provides a heat dissipation structure of a circuit board, including: A circuit board assembly; The heat exchanger assembly is used for communicating cooling water; The first end of the heat pipe is connected with the circuit board assembly and used for absorbing heat of the circuit board assembly, the second end of the heat pipe is connected with the heat exchanger assembly and used for transferring heat to the heat exchanger assembly, and the first end and the second end of the heat pipe are opposite ends. In some embodiments, the heat pipe comprises a first pipe section, a connecting pipe section and a second pipe section which are sequentially connected, wherein the first pipe section is provided with a first end of the heat pipe, the first pipe section and the connecting pipe section form an included angle, the second pipe section is provided with a second end of the heat pipe, and the second pipe section and the connecting pipe section form an included angle. In some of these embodiments, the heat exchanger assembly is at least partially made of a metallic material, and the second end of the heat pipe is connected to and in heat conductive contact with the metallic portion of the heat exchanger assembly. In some embodiments, the heat exchanger assembly has a plug hole, and the second end of the heat pipe is inserted into the plug hole and contacts the cooling water. In some of these embodiments, the circuit board heat dissipation structure comprises: The sealing piece is arranged between the heat pipe and the heat exchanger component and surrounds the periphery of the plug hole so as to seal a gap between the heat pipe and the heat exchanger component. In some embodiments, the second end of the heat pipe is screwed with the heat exchanger component, and a heat-conducting glue is arranged at the screwed connection. In some embodiments, the second end of the heat pipe is in interference fit connection with the heat exchanger assembly, and a heat conducting glue is provided at the interference fit. In some embodiments, the circuit board assembly includes a printed circuit board and a heat generating component disposed on the printed circuit board, the first end of the heat pipe being connected to and in thermally conductive contact with the heat generating component. In some embodiments, the circuit board assembly includes a plurality of the heat generating components, the circuit board heat dissipation structure includes a plurality of the heat pipes, and a first end of one of the heat pipes is connected to and in thermally conductive contact with a corresponding one of the heat generating components. In some embodiments, the circuit board heat dissipation structure includes a heat conduction member disposed on the heat exchanger assembly, and the second end of the heat pipe is connected to the heat conduction member. In a second aspect, an embodiment of the present application provides a heat pump water heater, including: A case; a compressor assembly