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CN-224205452-U - Heat exchange device assembly

CN224205452UCN 224205452 UCN224205452 UCN 224205452UCN-224205452-U

Abstract

The utility model provides a heat exchange device assembly, which at least has a condenser structure, and comprises a cover plate with a plurality of first cylinders and a bottom plate with a plurality of second cylinders. The cover plate covers the bottom plate to define a sealing chamber, and the end surfaces of the first cylinders respectively correspond to the end surfaces of the second cylinders. Therefore, the condenser can be suitable for special environments (such as extremely low temperature) through the design of the utility model, and the condition of damaging the structure of the condenser caused by expansion due to the change of the volume of steam is avoided.

Inventors

  • LIU HANMIN
  • ZHOU XIAOXIANG

Assignees

  • 深圳兴奇宏科技有限公司

Dates

Publication Date
20260505
Application Date
20250425

Claims (7)

  1. 1. A heat exchange device assembly having at least one condenser structure, the condenser structure comprising: A cover plate having a plurality of first columns disposed on an inner side surface thereof; a bottom plate having a plurality of second columns disposed on an inner side surface of the bottom plate, wherein: The cover plate corresponds to the bottom plate to cover and define a sealing chamber, and the end surfaces of the plurality of first cylinders respectively correspond to the end surfaces of the plurality of second cylinders.
  2. 2. The heat exchange device assembly of claim 1, wherein the end surfaces of the first plurality of columns are respectively in concave-convex correspondence with the end surfaces of the second plurality of columns.
  3. 3. The heat exchange device assembly of claim 2, wherein the end surfaces of the first plurality of columns and the second plurality of columns are curved, rectangular or wedge-shaped and correspond to each other.
  4. 4. The heat exchange device assembly of claim 2 wherein said sealed chamber has a condensing side corresponding to an inside surface of said cover plate and a reflow side corresponding to an inside surface of said base plate.
  5. 5. The heat exchange device assembly of claim 4 wherein the end surfaces of the first plurality of cylinders form concave surfaces and the end surfaces of the second plurality of cylinders form convex surfaces corresponding to the concave surfaces.
  6. 6. The heat exchange device assembly of claim 1, wherein the end surfaces of the first plurality of cylinders are respectively engaged with the end surfaces of the second plurality of cylinders.
  7. 7. The heat exchange device assembly of claim 1 wherein the condenser structure communicates with an evaporator via a feed line and a return line.

Description

Heat exchange device assembly Technical Field The present utility model relates to heat exchange devices, and more particularly, to a heat exchange device assembly suitable for use in a particular environment. Background Miniaturization and high integration of electronic devices (e.g., base stations) have resulted in significant increases in internal chip heat flux density. Therefore, heat exchange devices using phase change (e.g., two-phase flow) are widely favored because of their fast heat dissipation and high efficiency. Conventional heat exchange device assemblies typically include a condenser structure 9, as shown in fig. 1, having a sealed chamber 92 defined by a cover plate 911 and a base plate 912 that are closed together, for example, by a working fluid circulating therein, and a plurality of support posts 93 are provided to provide the structural strength support required for the cover plate 911 and base plate 912. When the condenser arrangement 9 is provided in a heat exchanger assembly (not shown), it may be connected to an evaporator in contact with a heat source, such as an electronic device, by a feed line for conducting steam and a return line for conducting condensed working fluid. As such, the inside surface of the cover plate 911 or base plate 912 will correspond to a return side or a condensing side of the working fluid, respectively. The plurality of support columns 93 are typically bonded to the inner side surface of one of the cover plate 911 or the bottom plate 912, with their end faces extending and engaging (contacting) the other inner side surface to form a gap, or vice versa. Alternatively, the plurality of support columns 93 may be disposed between the two sides separately, and a gap may be formed between the support columns and the inner side surfaces of the cover plate 911 or the base plate 912, respectively. At this time, no matter whether the slit is formed near the return side or the condensation side, the working fluid passes through and enters the slit between the end surfaces and the inner side surfaces of the plurality of support columns 93 during the circulation in the sealed chamber 92. In a special environment (e.g., very low temperature), if solidification (e.g., water ice formation) occurs due to the very low temperature, the working fluid will accumulate between the gaps and change in volume, which not only weakens the structural strength of the plurality of support columns 93, but also causes swelling of the cover plate 911 or the bottom plate 912, and even causes system failure. For example, when the vapor of the working fluid passes through the condensation side at an extremely low temperature, the working fluid may be solidified in the gap on the condensation side by the low temperature, or the working fluid accumulated on the reflux side may be solidified in the gap on the reflux side by the extremely low temperature. Therefore, when the electronic device is required to be used in a special environment (e.g., very low temperature), the conventional heat exchange device assembly has good heat conduction, but is limited by the characteristics of the working fluid (e.g., water) and the condenser structure 9, and thus icing bulge is easy to occur. Accordingly, it is an urgent need to solve the above-mentioned problems and disadvantages, and to provide an improved method for the present invention. Disclosure of utility model Therefore, in order to effectively solve the above-mentioned problems, an object of the present utility model is to provide a heat exchange device assembly suitable for a specific environment. In order to achieve the above-mentioned object, the present utility model provides a heat exchange device assembly, which at least has a condenser structure, wherein the condenser structure comprises a cover plate and a bottom plate. The cover plate is provided with a plurality of first columns arranged on the inner side surface of the cover plate, the bottom plate is provided with a plurality of second columns arranged on the inner side surface of the bottom plate, wherein the cover plate corresponds to the bottom plate to cover and define a sealing cavity, and the end surfaces of the plurality of first columns respectively correspond to the end surfaces of the plurality of second columns. Wherein, the end surfaces of the plurality of first columns are respectively in concave-convex correspondence with the end surfaces of the plurality of second columns. Wherein, the end surfaces of the first columns and the second columns are arc-shaped, rectangular or wedge-shaped and correspond to each other. The sealing chamber has a condensing side corresponding to the inner side surface of the cover plate and a reflux side corresponding to the inner side surface of the bottom plate. The end surfaces of the first cylinders form concave surfaces, and the end surfaces of the second cylinders form convex surfaces corresponding to the concave surfaces. Wherein, the en