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CN-224205457-U - Cooling device of test board and test board

CN224205457UCN 224205457 UCN224205457 UCN 224205457UCN-224205457-U

Abstract

The application relates to a cooling device of a test board and the test board, wherein the test board is provided with a test area and a controller installation area, the cooling device comprises an insulating heat-conducting silica gel pad, a heat-radiating metal layer, a first cooling pipeline, a second cooling pipeline and a cooling pump, the insulating heat-conducting silica gel pad is arranged on the controller, the heat-radiating metal layer is arranged on the insulating heat-conducting silica gel pad, one end of the first cooling pipeline is arranged on the heat-radiating metal layer, the other end of the first cooling pipeline is connected with the cooling pump, the first cooling pipeline is used for providing cooling liquid for the heat-radiating metal layer under the action of the cooling pump, one end of the second cooling pipeline is arranged on the heat-radiating metal layer, the other end of the second cooling pipeline is connected with the cooling pump, and the second cooling pipeline is used for recycling the cooling liquid from the heat-radiating metal layer to the cooling pump. The application can independently perform high-efficiency thermal isolation and heat dissipation control on the controller area on the premise of maintaining the high-temperature test environment of the tested module, and ensures that the temperature of the controller is always in a safe range.

Inventors

  • Ou Yiqin

Assignees

  • 深圳市江波龙电子股份有限公司

Dates

Publication Date
20260505
Application Date
20250430

Claims (10)

  1. 1. The utility model provides a cooling device of test board, the test board is provided with test area and controller installation area, test area is used for placing the module that is surveyed, the controller is installed to the controller installation area, a serial communication port, cooling device includes insulating heat conduction silica gel pad, heat dissipation metal level, first cooling pipeline, second cooling pipeline and cooling pump, insulating heat conduction silica gel pad set up in on the controller, the heat dissipation metal level set up in on the insulating heat conduction silica gel pad, the one end of first cooling pipeline set up in the heat dissipation metal level, the other end of first cooling pipeline with the cooling pump is connected, first cooling pipeline is used for providing the coolant liquid to the heat dissipation metal level under the effect of cooling pump, the one end of second cooling pipeline set up in the heat dissipation metal level, the other end of second cooling pipeline with the cooling pump is connected, the second cooling pipeline is used for with the coolant liquid is followed the heat dissipation metal level is retrieved to the cooling pump.
  2. 2. The cooling device of the test board according to claim 1, wherein the insulating and heat conducting silicone pad is disposed over the controller and the test board in a manner to encase the controller.
  3. 3. The cooling device of the test board according to claim 1, wherein the heat dissipation metal layer is disposed over the insulating thermal conductive silicone pad and the test board in a manner to cover the insulating thermal conductive silicone pad.
  4. 4. The cooling device of the test board according to claim 1, wherein the heat dissipation metal layer has a cavity, one end of the first cooling pipeline near the heat dissipation metal layer is communicated with the cavity, and one end of the second cooling pipeline near the heat dissipation metal layer is communicated with the cavity.
  5. 5. The cooling device of the test plate of claim 4, wherein a bottom area of the chamber is greater than or equal to an upper surface area of the insulating thermal conductive silicone pad.
  6. 6. The cooling device of the test plate of claim 4, wherein the chamber is arranged in a curved or serpentine shape to form a plurality of U-shaped bending sections.
  7. 7. The cooling device of the test board according to claim 1, wherein the first cooling pipeline and the second cooling pipeline are both disposed on the upper surface of the heat dissipation metal layer, the first cooling pipeline and the second cooling pipeline are mutually communicated, and a portion of the first cooling pipeline disposed on the heat dissipation metal layer and a portion of the second cooling pipeline disposed on the heat dissipation metal layer are arranged in a curved or serpentine shape to form a plurality of U-shaped bending sections.
  8. 8. The cooling device of the test board according to claim 1, wherein the lengths of the first cooling line and the second cooling line are each greater than or equal to 30CM.
  9. 9. The cooling device of claim 1, wherein the heat-dissipating metal layer is one of silver, tungsten, platinum, aluminum, copper, or a related alloy, and the cooling liquid comprises one of a water-based cooling liquid, a dielectric cooling liquid, an organic cooling liquid, or a phase-change cooling liquid.
  10. 10. A test board for test development of embedded multimedia cards and general flash memories, characterized by comprising a test motherboard and a cooling device according to any of claims 1 to 9, the test motherboard being provided with a test area for placing an embedded multimedia card or general flash memory and a controller mounting area for mounting a controller, the test board having a test temperature of more than 85 ℃.

Description

Cooling device of test board and test board Technical Field The application relates to the technical field of reliability test, in particular to a cooling device of a test board and the test board. Background In the high temperature reliability test of embedded modules (e.g., eMMC/UFS), development of board test tools requires long-term high temperature environments (e.g., 85 ℃ and above) to verify device performance. However, the controller (such as a CPU) on the test motherboard is limited by the working temperature range from 0 ℃ to 70 ℃ in the specification, and when the whole fixture operates in a high-temperature environment, the CPU not only needs to bear the heat conducted by the ambient temperature, but also generates additional temperature rise due to the operation of the CPU, so that the internal temperature of the CPU rapidly exceeds a threshold value and fails. Once the CPU stops working, the test signal of the tested module (e.g., eMMC/UFS) connected with the CPU will be interrupted, so that the high temperature test target cannot be completed. The heat dissipation scheme of the existing test fixture generally adopts passive heat dissipation (such as a metal heat sink) or single-path active heat dissipation (such as a fan or simple liquid cooling). However, on the premise of maintaining the high-temperature testing environment of the tested module, the heat dissipation efficiency of the CPU in the high-environment temperature and high-load CPU scenes is insufficient, the heat exchange area of the single-pipeline liquid cooling is limited, and the heat accumulated by the CPU is difficult to transfer rapidly. Disclosure of utility model In view of the above, it is necessary to provide a cooling device for a test board and a test board, which can independently perform efficient thermal isolation and heat dissipation control on a controller area on the premise of maintaining a high-temperature test environment of a tested module, so as to ensure that the temperature of the controller is always within a safe range. The application firstly provides a cooling device of a test board, the test board is provided with a test area and a controller installation area, the test area is used for placing a tested module, the controller installation area is provided with a controller, the cooling device comprises an insulating heat-conducting silica gel pad, a heat-radiating metal layer, a first cooling pipeline, a second cooling pipeline and a cooling pump, the insulating heat-conducting silica gel pad is arranged on the controller, the heat-radiating metal layer is arranged on the insulating heat-conducting silica gel pad, one end of the first cooling pipeline is arranged on the heat-radiating metal layer, the other end of the first cooling pipeline is connected with the cooling pump, the first cooling pipeline is used for providing cooling liquid for the heat-radiating metal layer under the action of the cooling pump, one end of the second cooling pipeline is arranged on the heat-radiating metal layer, the other end of the second cooling pipeline is connected with the cooling pump, and the second cooling pipeline is used for recycling the cooling liquid from the heat-radiating metal layer to the cooling pump. In the cooling device, firstly, the controller heat is led out to the heat dissipation metal layer efficiently through the low thermal resistance interface material (namely the insulating heat conduction silica gel pad), and meanwhile, the test board is divided into the test area and the controller installation area, so that the thermal coupling between the heat dissipation structure and other parts of the test board can be reduced, and the test temperature field of the tested module is reduced. Secondly, through setting up insulating heat conduction silica gel pad on the controller with direct contact heat conduction to strengthen heat diffusion ability through the heat dissipation metal level, first cooling pipeline and second cooling pipeline form the circulation cooling liquid flow under the effect of cooling pump simultaneously, realize the initiative heat dissipation to the heat dissipation metal level, can control the controller temperature and not overrun from this, can overcome the problem that the controller can't normally work because of self temperature rise under high temperature test environment (like 85 ℃). That is, the application can independently perform high-efficiency thermal isolation and heat dissipation control on the controller area on the premise of maintaining the high-temperature test environment of the tested module, and ensure that the temperature of the controller is always in a safe range. In some embodiments, an insulating, thermally conductive silicone pad is disposed over the controller and the test board in a manner that wraps around the controller. In some embodiments, the heat dissipation metal layer is disposed over the insulating thermal conductive silicone pad and