CN-224205473-U - Circuit board structure easy to radiate heat

CN224205473UCN 224205473 UCN224205473 UCN 224205473UCN-224205473-U

Abstract

The utility model discloses a circuit board structure easy to dissipate heat, which comprises a connecting circuit layer module and a heat dissipation circuit layer module, wherein the connecting circuit layer module is provided with a connecting metal layer and at least one dielectric layer which are overlapped, the connecting metal layer is opposite to a connecting surface of the at least one dielectric layer, the heat dissipation circuit layer module is provided with an upper heat dissipation metal layer and a middle heat dissipation layer unit which are overlapped, the upper heat dissipation metal layer is opposite to a surface of the middle heat dissipation layer unit and is connected with the at least one dielectric layer of the connecting circuit layer module, the middle heat dissipation layer unit is provided with a heat dissipation metal block, the heat dissipation metal block is exposed from the heat dissipation circuit layer module opposite to a heat dissipation surface of the upper heat dissipation metal layer, and the exposed heat dissipation surface enables the heat dissipation metal block to dissipate heat effectively.

Inventors

GUO YINGWEI
WANG WENHU

Assignees

咸瑞科技股份有限公司

Dates

Publication Date: 20260505
Application Date: 20250516
Priority Date: 20240709

Claims (9)

1. A circuit board structure with easy heat dissipation, comprising: A connecting circuit layer module having a connecting metal layer and at least one dielectric layer stacked on each other, wherein the connecting metal layer has a connecting surface facing away from the at least one dielectric layer; A heat dissipation circuit layer module having an upper heat dissipation metal layer and a middle heat dissipation layer unit stacked; The upper heat dissipation metal layer is provided with a surface, the surface is opposite to the middle heat dissipation layer unit, and the surface is connected with the at least one dielectric layer of the connecting circuit layer module; The middle heat dissipation layer unit is provided with a heat dissipation metal block, the heat dissipation metal block is provided with a heat dissipation surface, the heat dissipation surface faces away from the upper heat dissipation metal layer, and the heat dissipation surface is exposed from the heat dissipation circuit layer module.
2. The circuit board structure of claim 1, wherein the middle heat dissipation layer unit comprises a plurality of circuit board layers stacked together, wherein the plurality of circuit board layers have a hole formed by etching, and the heat dissipation metal block is disposed in the hole.
3. The circuit board structure of claim 2, wherein at least one heat dissipation hole is formed in the heat dissipation circuit layer module, the at least one heat dissipation hole penetrates through the upper heat dissipation metal layer and the plurality of circuit board layers, and the at least one heat dissipation hole is communicated with the hole and the connecting surface; Wherein, the at least one heat dissipation hole is respectively provided with an inner wall, and a metal film layer is plated between the heat dissipation metal block and the inner wall of the at least one heat dissipation hole.
4. The circuit board structure of claim 3, wherein the heat dissipating metal block and the metal film layer are made of the same metal material.
5. The circuit board structure of claim 4, wherein the heat dissipating metal block is a copper metal block and the metal film layer is a copper film layer.
6. The circuit board structure of claim 3, wherein the at least one heat dissipation hole is a plurality of heat dissipation holes, and the heat dissipation metal block is disposed between the plurality of heat dissipation holes.
7. The circuit board structure of claim 2, wherein said holes in said middle heat sink layer unit connect with said upper heat sink metal layer to form a hole bottom; wherein, a heat-dissipating glue is filled between the bottom surface of the hole and the heat-dissipating metal block.
8. The circuit board structure of claim 7, wherein the heat dissipation paste comprises a plurality of metal particles, and the plurality of metal particles and the heat dissipation metal block are made of the same metal.
9. The circuit board structure of claim 1, wherein at least one upper heat dissipation hole is formed in the connection circuit layer module, and the at least one upper heat dissipation hole penetrates through the stacked connection metal layer and the at least one dielectric layer.

Description

Circuit board structure easy to radiate heat Technical Field The present utility model relates to a circuit board structure, and more particularly to a circuit board structure with heat dissipation. Background In order to maintain the quality of the electrical signals transmitted by a circuit and to extend the life of the electronic components in the circuit, waste heat generated during operation of a circuit board needs to be efficiently discharged, thereby reducing the temperature of the circuit board and reducing the effect of thermal noise (thermal noise) on the electrical signals. Referring to fig. 3, a conventional circuit board heat dissipation structure 100 is formed by combining an upper circuit layer module 110, a middle circuit layer module 120 and a lower circuit layer module 130, wherein the middle circuit layer module 120 is laminated between the upper circuit layer module 110 and the lower circuit layer module 130. The upper circuit layer module 110 has an upper metal layer 111 and at least one dielectric layer 112 stacked on top of each other, and a surface 113 of the upper metal layer 111 opposite to the at least one dielectric layer 112 is configured to receive a heat generated by a heat source. For example, an electronic device 140 is disposed on the surface 113, and the electronic device 140 is energized to generate waste heat, so that the surface 113 receives the heat to be exhausted for the conventional circuit board heat dissipating structure 100. The middle circuit layer module 120 has a middle upper metal layer 121, a middle layer unit 122 and a middle lower metal layer 123 stacked. The middle layer unit 122 is stacked between the middle upper metal layer 121 and the middle lower metal layer 123, and a surface of the middle upper metal layer 121 opposite to the middle layer unit 122 is connected to the at least one dielectric layer 112 of the upper circuit layer module 110. The lower circuit layer module 130 has at least one dielectric layer 131 and a lower metal layer 132 stacked. The at least one dielectric layer 131 is connected to the middle lower metal layer 123 of the middle circuit layer module 120 opposite to a surface of the lower metal layer 132. In order to keep the operating temperature of the electronic device 140 disposed on the surface 113 moderate, the conventional circuit board heat dissipation structure 100 is further provided with a heat dissipation metal block 150 in the middle layer unit 122 of the middle circuit layer module 120. In detail, the heat dissipation metal block 150 is pressed between the middle upper metal layer 121 and the middle lower metal layer 123 of the middle circuit layer module 120 by a pressing manner. In addition, the conventional circuit board heat dissipation structure 100 is also provided with at least one heat dissipation hole, such as an upper heat dissipation hole 161, a middle heat dissipation hole 162, a lower heat dissipation hole 163 and a penetrating heat dissipation hole 164. The upper heat dissipation hole 161 penetrates through the upper metal layer 111 and the at least one dielectric layer 112 of the upper circuit layer module 110, and communicates with the upper metal layer 111, the at least one dielectric layer 112 and the middle upper metal layer 121 of the middle circuit layer module 120. The middle heat dissipation hole 162 penetrates through the middle upper metal layer 121, the middle layer unit 122 and the middle lower metal layer 123 of the middle circuit layer module 120, and communicates with the at least one dielectric layer 112, the middle upper metal layer 121, the middle layer unit 122, the middle lower metal layer 123 and the at least one dielectric layer 131. And, a side surface of the heat dissipation metal block 150 is exposed in the middle heat dissipation hole 162. The lower heat dissipation hole 163 penetrates through the at least one dielectric layer 131 and the lower metal layer 132 of the lower circuit layer module 130, and communicates with the middle lower metal layer 123, the at least one dielectric layer 131 and the lower metal layer 132 of the middle circuit layer module 120. The through heat dissipation hole 164 penetrates and communicates the upper circuit layer module 110, the middle circuit layer module 120 and the lower circuit layer module 130, which are stacked, and the other side of the heat dissipation metal block 150 is exposed in the through heat dissipation hole 164. Therefore, the conventional circuit board heat dissipation structure 100 is beneficial for the electronic component 140 to conduct heat to the heat dissipation metal block 150, and then the heat dissipation metal block 150 is conducted to the middle heat dissipation hole 162 and the through heat dissipation hole 164 through the middle and upper metal layer 121. The middle heat dissipation holes 162 conduct heat to the middle lower metal layer 123 again. However, the middle lower metal layer 123 gathers heat directly or