CN-224205477-U - Airtight water course cooling structure, power module and electronic equipment

CN224205477UCN 224205477 UCN224205477 UCN 224205477UCN-224205477-U

Abstract

The application discloses a closed water channel cooling structure which comprises a radiator main body and a water channel bottom plate, wherein the radiator main body is arranged on a power module, radiating pins are arranged on the radiator main body in a matrix mode, the water channel bottom plate is integrally formed in a stamping mode, a water inlet and a water outlet are formed in the water channel bottom plate on the front side and the rear side of each radiating pin, and the bottom end of each radiating pin is connected with the bottom surface of the water channel bottom plate. The integrated stamping airtight water channel can reduce the gap between two sides of the water channel and the radiating needle, the bottom end of the radiating needle is in contact connection with the bottom surface of the water channel bottom plate, the gap between the radiating needle and the water channel bottom plate is avoided, so that cooling liquid flows through the radiating surface more, the integrated stamping airtight water channel can reduce material consumption, a thinner stamping plate is used, the overall weight of cooling equipment is reduced, and the cost is reduced.

Inventors

ZHAO ZIHAO
LI DAOHUI
YANG QUANLIANG
WANG ZHE

Assignees

北京昕感科技(集团)有限责任公司

Dates

Publication Date: 20260505
Application Date: 20250520

Claims (10)

1. The utility model provides a airtight water course cooling structure, is including installing radiator main part and the water course bottom plate on the power module, be provided with the radiating needle of matrix arrangement on the radiator main part, its characterized in that, the water course bottom plate adopts stamping mode integrated into one piece, both sides around the radiating needle be provided with water inlet and delivery port on the water course bottom plate, the bottom of radiating needle with the bottom surface of water course bottom plate is connected.
2. The containment waterway cooling structure of claim 1, wherein the waterway floor is stamped from aluminum alloy, copper, stainless steel, or SPCC sheet material.
3. The containment flume cooling structure of claim 2 wherein the flume floor is stamped from sheet material having a thickness of 0.5mm to 3mm.
4. The closed waterway cooling structure of claim 3, wherein the waterway base plate is stamped to form a waterway groove, and the water inlet and the water outlet are disposed at front and rear ends of the waterway groove.
5. The containment waterway cooling structure of claim 3, wherein a top portion of the waterway floor is outwardly bent to form a securing portion, the securing portion being welded to the radiator body.
6. The closed waterway cooling structure of claim 4, wherein the heat dissipation pin bottom is welded to the bottom surface of the waterway groove by reflow soldering.
7. The containment waterway cooling structure of claim 1, wherein the heat dissipation pins are one of circular, oval, or polygonal in cross-section.
8. The closed waterway cooling structure of claim 1, wherein the radiating needle is a wave-shaped radiating strip, a trough of the radiating strip is connected with the bottom surface of the waterway bottom plate, and a crest of the radiating strip is fixedly connected with the radiator body.
9. A power module employing the closed waterway cooling structure of any one of claims 1 to 8.
10. An electronic device characterized by a power module fabricated using the closed waterway cooling structure of any one of claims 1 to 8.

Description

Airtight water course cooling structure, power module and electronic equipment Technical Field The application belongs to the field of power modules, and particularly relates to a closed water channel cooling structure, a power module and electronic equipment. Background In high power applications such as motor control, new energy automobiles, inverters, photovoltaic energy storage, etc., heat dissipation of power modules (e.g., IGBTs, siC MOSFETs) is critical. The water cooling heat dissipation becomes a main flow scheme of a high-power scene due to the high-efficiency and uniform cooling capacity. The existing water cooling structure of the power module comprises two types, namely an open water channel, namely a radiating surface or a radiating needle of the power module is exposed, the power module and a die-casting shell jointly form the water channel, and cooling water flows along the water channel to take away heat. Such die-cast housings are typically heavy and require clearance from the die-cast housing in order to prevent collisions with the heat-dissipating pins during assembly, including clearances on both sides of the heat-dissipating pins and clearances between the bottom of the heat-dissipating pins and the die-cast housing, and the draft angle formed by the die-casting process results in particularly large side clearances. When the cooling liquid flows, the cooling liquid easily flows through the gap due to the existence of the gap, reducing the cooling effect. And the other is a closed water channel, and the copper plates are used for soldering and connecting the radiator to form the closed water channel, so that the copper plates with thicker weight are needed due to process limitation, the weight is greatly increased, and the cost is higher. Therefore, a new water cooling structure is needed to solve the above problems. Disclosure of utility model In order to solve the defects in the prior art, the application provides a closed water channel cooling structure, a power module and electronic equipment, wherein a water channel bottom plate is obtained by using a stamping processing mode, and a water channel can be closer to a heat dissipation needle of a radiator, so that a gap is reduced, and a heat exchange effect is enhanced. But also can reduce the weight and the material use and reduce the cost. The technical effects to be achieved by the application are realized by the following scheme: According to a first aspect of the present application, there is provided a closed water channel cooling structure, including a radiator main body mounted on a power module and a water channel bottom plate, wherein heat dissipation needles arranged in a matrix are arranged on the radiator main body, the water channel bottom plate is integrally formed by stamping, water inlets and water outlets are arranged on the water channel bottom plate on the front side and the rear side of the heat dissipation needles, and the bottom ends of the heat dissipation needles are connected with the bottom surface of the water channel bottom plate. Preferably, the water channel bottom plate is stamped from aluminum alloy, copper, stainless steel or SPCC plates. Preferably, the waterway bottom plate is stamped from a sheet material having a thickness of 0.5mm to 3mm. Preferably, the water channel bottom plate is stamped to form a water channel groove, and the water inlet and the water outlet are arranged at the front end and the rear end of the water channel groove. Preferably, the top of the periphery of the water channel bottom plate is outwards bent to form a fixing part, and the fixing part is welded to the radiator main body. Preferably, the bottom of the radiating pin is welded to the bottom surface of the water channel groove in a reflow soldering mode. Preferably, the cross section of the heat dissipation needle is one of a circle, an ellipse or a polygon. Preferably, the radiating needle is a wave-shaped radiating strip, the trough of the radiating strip is connected with the bottom surface of the water channel bottom plate, and the crest of the radiating strip is fixedly connected with the radiator main body. According to a second aspect of the present application, there is provided a power module employing the above-described closed water channel cooling structure. According to a third aspect of the present application, there is provided an electronic device, which is a power module fabricated by using the above-mentioned closed water channel cooling structure. According to one embodiment of the application, the beneficial effects of adopting the closed water channel cooling structure are as follows: The gap between two sides of the water channel and the radiating needle can be reduced by using the integrated stamping airtight water channel, the bottom end of the radiating needle is in contact connection with the bottom surface of the water channel bottom plate, the gap between the radiating needle and the water