CN-224205489-U - Combined stamping radiating fin

Abstract

The utility model provides a combined type stamping radiating fin, which comprises a circuit board body and a plurality of chips arranged above the body, wherein the radiating fin comprises a radiating panel and a plurality of support columns arranged on the radiating panel and abutted against the circuit board body, the radiating panel is provided with a plurality of stamping parts contacted with the chips, the stamping parts extend towards one side close to the circuit board body, any extension part is provided with a radiating plate, the radiating plate comprises a positioning plate contacted with the upper end surface of the stamping parts and a plurality of extension plates extending towards one side opposite to the stamping parts, and the extension plates are arranged along the length direction of the positioning plate.

Inventors

• XIE HONG
• XU YUANXIANG
• ZHOU WENBO
• XIAO KUN
• Zhu Chengben

Assignees

• 温州合盛电子有限公司

Dates

Publication Date

20260505

Application Date

20250527

Claims (5)

1. 1. The combined type stamping radiating fin is characterized in that the radiating fin comprises a radiating panel (2) and a plurality of support columns (3) which are arranged on the radiating panel (2) and are in butt joint with the circuit board body (1), a plurality of stamping parts (4) which are in contact with the chips are arranged on the radiating panel (2), the stamping parts (4) extend towards one side close to the circuit board body (1), a radiating plate (5) is arranged on any extending part, the radiating plate (5) comprises a positioning plate (51) which is in contact with the upper end face of the stamping parts (4) and a plurality of extending plates (52) which extend towards one side of the back stamping parts (4), and the extending plates (52) are arranged along the length direction of the positioning plate (51).
2. 2. The combined stamping radiating fin as claimed in claim 1, wherein a positioning structure (6) is arranged between the circuit board body (1) and the radiating panel (2).
3. 3. The combination type stamping heat sink as claimed in claim 2, wherein the positioning structure (6) comprises a positioning post (61) arranged on one side of the circuit board body (1) or the heat dissipation panel (2) and a positioning groove (62) arranged on the other side and matched with the positioning post (61).
4. 4. A combined stamping radiating fin as claimed in claim 3, wherein an extension block (7) is arranged at the positioning groove (62), an L-shaped structure is formed between the extension block (7) and the positioning groove (62), the positioning column (61) comprises an extension column (63) which can be matched with the positioning groove (62), and a plugboard (64) which can be spliced with the extension block (7) is arranged at the extension column (63).
5. 5. A combined stamping heat sink as claimed in any one of claims 1-4, characterized in that the support columns (3) are arranged on the upper end face and/or the lower end face of the heat dissipation panel (2), and the upper end face and the lower end face of the heat dissipation panel (2) can be provided with PCB boards.

Description

Combined stamping radiating fin Technical Field The utility model relates to the technical field of heat dissipation of PCB boards, in particular to a combined stamping heat sink. Background The PCB board is used for providing mechanical support and electric connection for electronic components, stable transmission and function integration of circuit signals are realized, in the use process, the PCB board is required to utilize the radiating fin to radiate heat and disperse heat generated during the operation of the electronic components, performance reduction or damage caused by overhigh temperature is prevented, stable and reliable operation of a circuit is ensured, in the prior art, the utility model patent with the publication number CN218830767U discloses a PCB board radiating structure, the PCB board radiating structure comprises a circuit board and a cover body arranged on the circuit board, the cover body is used for assisting the radiating board to radiate heat, but in the actual use process, the power of components on the PCB board is different, the heat generated by the components with larger power is also more, the traditional punching radiating board has poor radiating effect, and the PCB board is easy to damage due to overhigh temperature. Disclosure of utility model Therefore, the utility model aims to overcome the defect that the radiating fin cannot meet the requirement of components with larger power in the prior art, so that the PCB is damaged, and further provides the combined stamping radiating fin with good radiating effect. Therefore, the utility model provides a combined type stamping radiating fin, which comprises a circuit board body and a plurality of chips arranged above the body, wherein the radiating fin comprises a radiating panel and a plurality of support columns arranged on the radiating panel and abutted against the circuit board body, the radiating panel is provided with a plurality of stamping parts contacted with the chips, the stamping parts extend towards one side close to the circuit board body, any extension part is provided with a radiating plate, the radiating plate comprises a positioning plate contacted with the upper end face of the stamping parts and a plurality of extension plates extending towards one side opposite to the stamping parts, and the extension plates are arranged along the length direction of the positioning plate. Further, a positioning structure is arranged between the circuit board body and the heat dissipation panel. The positioning structure comprises a positioning column arranged on one side of the circuit board body or the heat dissipation panel and a positioning groove arranged on the other side and matched with the positioning column. Further, an extending block is arranged at the positioning groove, an L-shaped structure is formed between the extending block and the positioning groove, the positioning column comprises an extending column which can be matched with the positioning groove, and a plugboard which can be spliced with the extending block is arranged at the extending column. Further, the support columns are arranged on the upper end face and/or the lower end face of the heat dissipation panel, and the PCB can be mounted on the upper end face and the lower end face of the heat dissipation panel. The technical scheme of the utility model has the following advantages: 1. According to the combined type stamping radiating fin provided by the utility model, the supporting columns are arranged on the radiating panel and are abutted against the radiating panel, so that a radiating space for radiating outwards is reserved between the circuit board body and the radiating panel, a radiating effect is ensured, the stamping part is arranged on the radiating panel, heat conducting glue is smeared between the stamping part and a chip for conducting heat, but the power of different components on the circuit board body is different, so that the generated heat is also different, for a plurality of elements with larger power, the generated heat is also more, the radiating speed of the radiating panel is limited, when the generated heat is not radiated, the circuit board body is easily damaged due to overhigh temperature, and compared with the prior art, the radiating plate is arranged on the basis of the stamping part, the radiating plate can be arranged at the upper position with the highest generated heat, so that the radiating effect can be accurately increased, and after the generated heat on the circuit board body is conducted to the radiating panel, the heat on the circuit board body can be conducted to the extending plate for radiating, so that the radiating effect can be effectively improved under the premise of controlling the radiating cost. Drawings In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodime