CN-224205553-U - LED packaging structure and lamp bead

CN224205553UCN 224205553 UCN224205553 UCN 224205553UCN-224205553-U

Abstract

The application provides an LED packaging structure and a lamp bead, which comprises a bowl and cup support, wherein a light-emitting chip, a reflecting part and at least two fluorescent layers are arranged in the bowl and cup support, the light-emitting chip is positioned on the bottom wall of the bowl and cup support, the at least two fluorescent layers are sequentially covered on one side of the light-emitting chip far away from the bowl and cup support, the excitation wavelength is sequentially decreased along the direction far away from the light-emitting chip, the reflecting part is at least arranged on the inner side wall of the bowl and cup support, and the reflectivity of the reflecting part is larger than that of the bowl and cup support. Therefore, the high reflectivity of the reflecting part can reduce the absorption of the bowl and cup support to light, reduce light-emitting loss, further improve the light efficiency, and further improve the light efficiency of the LED product by sequentially exciting the fluorescent layers.

Inventors

YANG ZIHUA
MIN XIU
Zhai Weixiong
WANG DAN
LI CHENYU
DING PENG

Assignees

鸿利智汇集团股份有限公司

Dates

Publication Date: 20260505
Application Date: 20250428

Claims (11)

1. The LED packaging structure is characterized by comprising a bowl and cup support (1), wherein a light-emitting chip (2), a reflecting part (5) and at least two fluorescent layers are arranged in the bowl and cup support (1), the light-emitting chip (2) is located on the bottom wall of the bowl and cup support (1), the at least two fluorescent layers are sequentially covered on one side, far away from the bowl and cup support (1), of the light-emitting chip (2), the excitation wavelength is sequentially decreased along the direction far away from the light-emitting chip (2), the reflecting part (5) is at least arranged on the inner side wall of the bowl and cup support (1), and the reflectivity of the reflecting part (5) is larger than that of the bowl and cup support (1).
2. The LED package structure according to claim 1, characterized in that the bottom wall of the bowl-cup holder (1) is provided with a blocking portion (6), the blocking portion (6) is circumferentially arranged at the periphery of the light emitting chip (2), and the reflecting portion (5) is located between the blocking portion (6) and the inner side wall of the bowl-cup holder (1).
3. The LED package structure according to claim 2, characterized in that the height of the blocking portion (6) is set to 0.04-0.08 mm.
4. The LED package structure according to claim 2, characterized in that the side of the reflecting portion (5) facing away from the bottom wall of the bowl cup holder (1) forms an angle of 110-160 degrees with the bottom wall of the bowl cup holder (1).
5. The LED package structure according to claim 2, wherein the light emitting chip (2) is electrically connected to the bowl cup holder (1) by a bonding wire (7), and one of the fluorescent layers close to the light emitting chip (2) covers the bottom wall of the bowl cup holder (1) and the bonding wire (7).
6. The LED package structure according to claim 1, wherein the reflecting portion (5) is disposed at a bottom wall and an inner side wall of the bowl cup holder (1), and the reflecting portion (5) surrounds the periphery of the light emitting chip (2).
7. The LED package structure according to claim 6, wherein one of the fluorescent layers near the light emitting chip (2) covers a part of the reflecting portion (5) and is wrapped around the outer periphery of the light emitting chip (2); Or one fluorescent layer close to the light-emitting chip (2) is attached to one side of the light-emitting chip (2) far away from the bowl cup bracket (1).
8. The LED package structure according to claim 1, characterized in that the reflective portion (5) is provided as white glue.
9. The LED package structure according to claim 1, wherein the at least two phosphor layers comprise a red phosphor layer (3) and a green phosphor layer (4), the green phosphor layer (4) is covered on a side of the red phosphor layer (3) remote from the light emitting chip (2), and an excitation wavelength of the red phosphor layer (3) is larger than an excitation wavelength of the green phosphor layer (4).
10. The LED package structure according to claim 9, characterized in that the thickness of the red fluorescent layer (3) is 150-400 micrometers.
11. A lamp bead comprising the LED package structure of any one of claims 1-10.

Description

LED packaging structure and lamp bead Technical Field The application relates to the technical field of LED products, in particular to an LED packaging structure and a lamp bead. Background In the packaging process of the LED lamp beads, an LED chip is covered in the bowl cup in a dispensing mode, and when the LED lamp beads are used, part of light emitted by the LED chip is emitted to the bottom wall of the bowl cup firstly, reflected to the side wall of the bowl cup and finally reflected out of the bowl cup. Because the material reflectivity of bowl cup is low, the absorption to light is higher, and the luminous loss of LED is great after the reflection many times, leads to luminous efficacy to hang down. Disclosure of utility model In view of this, the application provides an LED packaging structure and a lamp bead, which can reduce the absorption of light by a bowl cup, reduce the light loss and improve the light efficiency. In order to achieve the above purpose, the present application provides the following technical solutions: The LED packaging structure comprises a bowl and cup support, wherein a light emitting chip, a reflecting part and at least two fluorescent layers are arranged in the bowl and cup support, the light emitting chip is located on the bottom wall of the bowl and cup support, the at least two fluorescent layers are sequentially covered on one side, far away from the bowl and cup support, of the light emitting chip, the excitation wavelength is sequentially decreased in the direction far away from the light emitting chip, the reflecting part is at least arranged on the inner side wall of the bowl and cup support, and the reflectivity of the reflecting part is larger than that of the bowl and cup support. Optionally, the bottom wall of the bowl cup support is provided with a blocking portion, the blocking portion is circumferentially arranged on the periphery of the light emitting chip, and the reflecting portion is located between the blocking portion and the inner side wall of the bowl cup support. Optionally, the height of the blocking portion is set to 0.04-0.08 mm. Optionally, an included angle formed by the side surface of the reflecting part far away from the bottom wall of the bowl and cup support and the bottom wall of the bowl and cup support is 110-160 degrees. Optionally, the light emitting chip (2) is electrically connected with the bowl cup support (1) through a bonding wire (7), and one fluorescent layer close to the light emitting chip (2) covers the bottom wall of the bowl cup support (1) and the bonding wire (7). Optionally, the reflecting part is arranged on the bottom wall and the inner side wall of the bowl cup bracket, and the reflecting part surrounds the periphery of the light emitting chip. Optionally, a part of the reflecting part is covered by the fluorescent layer close to the light-emitting chip, and the fluorescent layer is wrapped on the periphery of the light-emitting chip; Or one fluorescent layer close to the light-emitting chip is attached to one side of the light-emitting chip far away from the bowl cup bracket. Optionally, the reflecting portion is provided as white glue. Optionally, the at least two fluorescent layers include a red fluorescent layer and a green fluorescent layer, the green fluorescent layer covers one side of the red fluorescent layer far away from the light emitting chip, and an excitation wavelength of the red fluorescent layer is greater than an excitation wavelength of the green fluorescent layer. Optionally, the thickness of the red fluorescent layer is 150-400 micrometers. A lamp bead comprising the LED package structure of any one of the above. According to the LED packaging structure and the lamp bead, the reflecting part covers the inner side wall of the bowl and cup support, and the light emitted by the light emitting chip can be reflected to the outer side of the bowl and cup support through the high reflectivity of the reflecting part, so that the light output quantity can be increased, the light absorption of the bowl and cup support can be reduced, the light output loss is reduced, and the light efficiency is further improved. And the excitation wavelength of the fluorescent layers is gradually decreased along the direction away from the light-emitting chip, the light emitted by the fluorescent powder with high excitation wavelength excited by the chip cannot be absorbed by the fluorescent powder with low excitation wavelength, so that the fluorescent layers are sequentially excited without secondary absorption of the fluorescent powder, and the light efficiency of the LED product is further improved. Drawings In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following descr