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CN-224205556-U - Correlation formula opto-coupler packaging hardware with integrated heat radiation structure

CN224205556UCN 224205556 UCN224205556 UCN 224205556UCN-224205556-U

Abstract

The utility model relates to the technical field of correlation type optocoupler packaging, and discloses a correlation type optocoupler packaging device with an integrated heat dissipation structure, the LED mounting plate comprises an upper cover, a lower cover, an infrared emitting diode and a photoelectric transistor, wherein positioning grooves are formed in two sides of the bottom end of the upper cover and two sides of the top end of the lower cover, and the infrared emitting diode is fixedly connected to the middle of the upper surface of the lower mounting plate. According to the utility model, the lower mounting plate and the upper mounting plate can be limited by the inverted concave limiting strips, the pins are positioned by the positioning grooves, so that the relative positions of the infrared emission diode and the photoelectric transistor can be accurately adjusted, the LED and the photoelectric transistor are convenient and quick, paraffin grooves are formed in the top end of the upper cover and the bottom end of the lower cover, paraffin in the paraffin grooves absorbs heat and melts when the temperature of the infrared emission diode and the photoelectric transistor rises, the infrared emission diode and the photoelectric transistor can be cooled, and the melted paraffin can be cooled by the cooling fins.

Inventors

  • Zhang Kuanbing
  • WU YONGQIANG
  • SUN JIANPENG
  • ZHANG YE
  • ZHANG GUOWEN

Assignees

  • 江苏荣一半导体有限公司

Dates

Publication Date
20260505
Application Date
20250613

Claims (6)

  1. 1. The utility model provides an correlation formula opto-coupler packaging hardware with integrated heat radiation structure, includes upper cover (1), lower cover (11), infrared emission diode (15) and phototransistor (16), its characterized in that, constant head tank (12) have all been seted up to both sides of upper cover (1) bottom and the both sides on lower cover (11) top, infrared emission diode (15) fixed connection is in the middle part of lower mounting panel (13) upper surface, the middle part of phototransistor (16) fixed connection at upper mounting panel (14) bottom, the bottom integrated into one piece sealing strip (2) of upper cover (1), seal groove (21) have been seted up on the top of lower cover (11), sealing strip (2) peg graft with seal groove (21), just sealing strip (2) cooperate with the size of seal groove (21), still include the positioning mechanism that is used for infrared emission diode (15) and phototransistor (16) location to and be used for the heat dissipation mechanism of infrared emission diode (15) and phototransistor (16).
  2. 2. The correlation optical coupler packaging device with the integrated heat dissipation structure as set forth in claim 1, wherein the positioning mechanism comprises two groups of limiting strips (18), the two groups of limiting strips (18) are respectively arranged on the top end inner wall of the upper cover (1) and the bottom end inner wall of the lower cover (11), and one ends, far away from the pins (17), of the lower mounting plate (13) and the upper mounting plate (14) are respectively spliced with the two groups of limiting strips (18).
  3. 3. The correlation optical coupler packaging device with the integrated heat dissipation structure as set forth in claim 2, wherein the limit strips (18) are in an inverted concave shape, and the limit strips (18) are matched with the dimensions of the lower mounting plate (13) and the upper mounting plate (14).
  4. 4. The correlation optical coupler packaging device with integrated heat dissipation structure as set forth in claim 3, wherein the heat dissipation mechanism comprises a paraffin groove (22), and the paraffin groove (22) is formed in the top end of the upper cover (1) and the bottom end of the lower cover (11).
  5. 5. The correlation optical coupler package with integrated heat dissipation structure as set forth in claim 4, wherein the upper surface of the upper cover (1) and the lower surface of the lower cover (11) are equally spaced apart from each other by a heat dissipation fin (23), and one end of the heat dissipation fin (23) is disposed inside the paraffin groove (22).
  6. 6. The correlation optical coupler packaging device with the integrated heat dissipation structure as set forth in claim 1, wherein pins (17) are integrally formed at one ends of the lower mounting plate (13) and the upper mounting plate (14) close to the positioning groove (12), the pins (17) are movably connected with the positioning groove (12), and the pins (17) are matched with the positioning groove (12) in size.

Description

Correlation formula opto-coupler packaging hardware with integrated heat radiation structure Technical Field The utility model relates to the technical field of correlation type optocouplers, in particular to a correlation type optocoupler packaging device with an integrated heat dissipation structure. Background With the rapid development of electronic technology, the correlation optical coupler is used as a key photoelectric isolation device and plays an indispensable role in various electronic devices. The optical signal is transmitted between the infrared emitting diode and the photoelectric transistor, so that the isolation of the electrical signal is realized, the propagation of electrical noise and interference is effectively prevented, and the stability and the safety of the system are improved. The inventor finds that at least the following problems in the prior art are not solved, and the conventional opposite-emitting optical coupler packaging mode often depends on manual assembly, so that accurate alignment of internal elements of each optical coupler is difficult to ensure. The small deviation among the components can lead to the obvious reduction of the optical coupling efficiency, thereby affecting the performance and the stability of the whole optical coupler, in addition, in the existing correlation optical coupler packaging design, the heat dissipation performance is often ignored, the heat generated by the infrared emitting diode and the phototransistor during the working process can be rapidly increased if the heat cannot be effectively emitted in time. The high-temperature environment not only can influence the photoelectric conversion efficiency of the optocoupler and reduce the response speed of the optocoupler, but also can accelerate the aging process of the element and shorten the service life of the element. Therefore, we propose a correlation type optocoupler package device with an integrated heat dissipation structure, which can solve the above-mentioned problems. Disclosure of utility model The utility model aims to provide a correlation type optocoupler packaging device with an integrated heat dissipation structure, which solves the problems in the background technology. In order to achieve the above purpose, the utility model provides the technical scheme that the opposite-type optocoupler packaging device with the integrated radiating structure comprises an upper cover, a lower cover, infrared emitting diodes and a phototransistor, wherein positioning grooves are formed in two sides of the bottom end of the upper cover and two sides of the top end of the lower cover, the infrared emitting diodes are fixedly connected to the middle part of the upper surface of a lower mounting plate, the phototransistor is fixedly connected to the middle part of the bottom side of the upper mounting plate, a sealing strip is integrally formed at the bottom end of the upper cover, a sealing groove is formed in the top end of the lower cover, the sealing strip is inserted into the sealing groove, the sealing strip is matched with the sealing groove in size, and the opposite-type optocoupler packaging device further comprises a positioning mechanism for positioning the infrared emitting diodes and the phototransistor, and a radiating mechanism for radiating the infrared emitting diodes and the phototransistor. As an alternative of the technical scheme of the application, the positioning mechanism comprises two groups of limiting strips, the two groups of limiting strips are respectively arranged on the top end inner wall of the upper cover and the bottom end inner wall of the lower cover, and one ends of the lower mounting plate and the upper mounting plate, which are far away from the pins, are respectively spliced with the two groups of limiting strips. As an alternative of the technical scheme of the application, the limit strip is in an inverted concave shape, and the limit strip is matched with the sizes of the lower mounting plate and the upper mounting plate. As an alternative of the technical scheme of the application, the heat dissipation mechanism comprises a paraffin groove, and the paraffin groove is arranged in the top end of the upper cover and the bottom end of the lower cover. As an alternative of the technical scheme of the application, the upper surface of the upper cover and the lower surface of the lower cover are equally spaced with radiating fins, and one end of each radiating fin is arranged at the inner side of the paraffin groove. As an alternative of the technical scheme of the application, pins are uniformly and integrally formed at one ends of the lower mounting plate and the upper mounting plate, which are close to the positioning groove, the pins are movably connected with the positioning groove, and the pins are matched with the positioning groove in size. Compared with the prior art, the utility model has the beneficial effects that the sealing groove and the seal