CN-224205567-U - Frame oxidation equipment is got rid of to semiconductor package neutralization liquid

Abstract

The utility model discloses a semiconductor packaging neutralization liquid removing frame oxidation device, and belongs to the technical field of semiconductor packaging. The equipment comprises a cleaning box which is divided into a neutralization liquid bin and a pure water cleaning bin by a partition plate. The bottom of the neutralization liquid bin is provided with a heating coil, and the side wall of the neutralization liquid bin is provided with a temperature sensor, so that the temperature can be accurately controlled at 70-80 ℃. The motor at the top of the partition plate drives the rotating arm, the cylinder below the rotating arm and the cleaning frame, so that the frame parts are converted between two bins. The side wall of the pure water washing bin is provided with a plurality of cleaning spray heads. The control panel of the side wall of the cleaning box can comprehensively control the operation of all components, such as controlling the power of the heating coil according to the temperature, setting the parameters of a motor, a cylinder, a spray head and a hot air blower, and timing the soaking time. The equipment effectively solves the problems of poor cleaning effect, low efficiency, inaccurate control, low automation degree and the like of the traditional method, improves the processing quality and the production efficiency of the semiconductor packaging frame, and ensures the performance and the stability of products.

Inventors

• Luan Xinpeng
• WANG QI

Assignees

• 山东盛芯电子科技有限公司

Dates

Publication Date

20260505

Application Date

20250303

Claims (4)

1. 1. The utility model provides a frame oxidation equipment is got rid of to neutralization liquid in semiconductor encapsulation, includes washs case (1), its characterized in that, washs case (1) center and is equipped with baffle (2), it is two neutralization liquid storehouse (3) and pure water wash storehouse (4) that the size is the same to wash case (1) through baffle (2), neutralization liquid storehouse (3) bottom is equipped with heating coil (13), neutralization liquid storehouse (3) lateral wall still is equipped with temperature sensor (14), baffle (2) top is equipped with motor (5), motor (5) top axle head coaxial is equipped with pivot (6), pivot (6) top is equipped with swinging boom (7), swinging boom (7) tip top is vertical to be equipped with cylinder (8), cylinder (8) bottom is equipped with and is used for placing frame part's washing frame (9), pure water storehouse (4) lateral wall all is equipped with washing shower nozzle (12) of a plurality of quantity.
2. 2. A semiconductor package neutralization solution removal frame oxidation apparatus as claimed in claim 1, wherein the side wall of the purge bin (1) is provided with a control panel (11).
3. 3. The semiconductor package neutralization liquid removal frame oxidation apparatus as claimed in claim 2, wherein a hot air blower (10) is further provided at one side of the cleaning frame (9).
4. 4. The semiconductor package neutralization liquid removal frame oxidation apparatus as set forth in claim 3, wherein the control panel (11) is used for receiving temperature data of the temperature sensor (14) and controlling heating power of the heating coil (13) according to a preset temperature range of 70-80 ℃, and is also used for setting and controlling rotation speed and angle of the motor (5), lifting stroke and speed of the air cylinder (8), water spraying pressure and time of the cleaning spray head (12) and working time and wind speed of the hot air blower (10), and has a soaking time timing function, and when the preset soaking time is 3-5 minutes, the air cylinder (8) is controlled to rise.

Description

Frame oxidation equipment is got rid of to semiconductor package neutralization liquid Technical Field The utility model relates to the technical field of semiconductor processing, in particular to a frame oxidation device for removing neutralizing liquid in semiconductor packaging. Background In the semiconductor packaging process, the frame is used as a key component, and the performance and quality of the frame play a decisive role in the overall performance of the semiconductor device. However, oxidation is very likely to occur after the frame is contacted with the neutralizing liquid in the packaging process, which seriously affects the conductivity, mechanical strength and compatibility with other components of the frame. At present, in the step of removing frame oxidation, the traditional method mainly has the following problems: The cleaning effect is poor, part of conventional cleaning equipment only adopts a single water washing mode, and the neutralizing liquid residue and the stubborn oxide layer cannot be thoroughly removed, so that impurities still exist on the surface of the frame, the quality and the stability of semiconductor packaging are affected, and the yield of products is reduced. The treatment efficiency is low, and some traditional devices lack reasonable planning and cooperation in the processes of cleaning, drying and the like, and all links are relatively independent, so that the whole treatment process consumes longer time. This not only reduces the production efficiency, but also increases the production cost, and it is difficult to meet the requirement of mass production. The traditional equipment has insufficient precision in controlling key parameters such as temperature, time, liquid flow and the like. For example, inaccurate temperature control when removing the oxide layer may result in incomplete or excessive oxide layer removal, affecting the performance of the frame. Improper control of the time can also result in less than optimal cleaning or drying. The automation degree is not high, and a large number of existing devices need to be manually operated, and the operations from the placement of parts, the switching of each flow to the adjustment of parameters and the like are finished manually. This not only increases labor costs, but also makes it difficult to ensure consistency of product quality due to the variability of manual operations. In view of the above, it is an urgent need to develop a device that can effectively remove oxidation of a frame, improve cleaning efficiency and quality, realize precise control, and have a high degree of automation. The utility model provides a semiconductor packaging neutralization liquid removing frame oxidation device which is designed for solving the problems and aims to improve the whole level of frame treatment in the semiconductor packaging process. Disclosure of utility model The utility model aims to solve the defects in the prior art and provides a semiconductor packaging neutralization liquid removal frame oxidation device. In order to achieve the above purpose, the present utility model adopts the following technical scheme: Integral structure of equipment The utility model provides a frame oxidation equipment is got rid of to semiconductor encapsulation neutralization liquid, includes washs the case, washs the case center and is equipped with the baffle, separates into two neutralization liquid warehouses and pure water washing warehouses that the size is the same through the baffle with washing the case. Neutralizing liquid bin related structure The bottom of the neutralization liquid bin is provided with a heating coil for heating the neutralization liquid, the side wall of the neutralization liquid bin is also provided with a temperature sensor which can monitor the temperature of the neutralization liquid in real time and feed back the temperature data to the control panel so as to realize the accurate control of the temperature of the neutralization liquid, and the neutralization liquid is kept in a proper reaction temperature range of 70-80 ℃. Rotary and lifting structure A motor is arranged at the top of the partition board, a rotating shaft is coaxially arranged at the shaft end of the top of the motor, the top of the rotating shaft is provided with a rotating arm. The top of the rotating arm end part is vertically provided with an air cylinder, and the bottom end of the air cylinder is provided with a cleaning frame for placing frame parts. The motor drives the rotating shaft and the rotating arm to rotate, the cleaning frame can be converted between the neutralization liquid bin and the pure water washing bin, and the air cylinder can control the lifting of the cleaning frame, so that the operation that the cleaning frame is immersed in the liquid bin or lifted from the liquid bin is realized. Pure water cleaning structure The side wall of the pure water washing bin is provided with a plurality of cleaning s