CN-224205571-U - Wafer processing machine, wafer and storage box detection system

Abstract

The application provides a wafer processing machine, a wafer and a storage box detection system, and relates to the technical field of semiconductor manufacturing. The wafer processing device comprises a processing cavity, a storage box, a manipulator and a detection device, wherein the storage box is arranged in the processing cavity and used for storing a plurality of wafers, the manipulator is arranged in the processing cavity and used for clamping the wafers in the storage box, and the detection device is arranged on the manipulator and used for transmitting detection signals into the storage box when the manipulator moves to the storage box and used for detecting the thickness of each wafer. The wafer processing machine, the wafer and the storage box detection system provided by the application can detect the thickness of the wafer in real time in the process of moving the manipulator to the storage box, and find specific wafers with abnormal thickness in time, so that the difficulty of checking the wafers with abnormal thickness by the machine is reduced, and the production efficiency and the product quality of the machine are improved.

Inventors

• LI QI
• LIU HAO

Assignees

• 芯恩（青岛）集成电路有限公司

Dates

Publication Date

20260505

Application Date

20250422

Claims (10)

1. 1. The wafer processing machine is characterized by comprising: a processing cavity; the storage box is arranged in the processing cavity and is used for storing a plurality of wafers; the mechanical arm is positioned in the processing cavity and is used for clamping the wafers in the storage box; And the detection device is arranged on the manipulator, and when the manipulator moves to the storage box, the detection device emits detection signals into the storage box and is used for detecting the thickness of each wafer.
2. 2. The wafer processing tool according to claim 1, wherein the detecting means comprises: The signal emitter is arranged in the center of the manipulator, and when the manipulator moves to the storage box, the signal emitter emits a first detection light signal to a signal reflecting plate in the storage box; And the plurality of signal receivers are arranged on the manipulator at arc intervals and are positioned between the signal transmitter and the storage box, and are used for receiving the first detection light signals reflected by the signal reflecting plate to generate a plurality of thickness data, and when any one thickness data is different from thickness standard data preset in the signal receivers, a thickness abnormal signal is generated.
3. 3. The wafer processing tool according to claim 2, wherein the robot comprises a base, a first telescoping member, a second telescoping member, and a gripping member; the fixed end of the first telescopic piece is connected with the base, and the telescopic end of the first telescopic piece stretches along the direction perpendicular to the plane where the base is located; The fixed end of the second telescopic piece is connected with the telescopic end of the first telescopic piece, and the telescopic end of the second telescopic piece stretches towards the storage box and stretches along the direction parallel to the plane where the base is located; The clamping piece is connected to the telescopic end of the second telescopic piece, and the length direction of the manipulator is consistent with the telescopic direction of the second telescopic piece; the signal transmitter is arranged on the clamping piece and is close to the second telescopic piece, and the plurality of signal receivers are arranged on the clamping piece at arc intervals and are close to the signal transmitter.
4. 4. The wafer processing machine of claim 3, wherein the storage cassette comprises: A case having a side opening; The clamping grooves are arranged in the box body at intervals up and down and are used for placing wafers; The signal reflecting plate is arranged on the inner wall of the box body and is positioned on one surface opposite to the opening, and the signal reflecting plate is used for reflecting detection signals emitted by the signal emitter to the signal receiver; When the clamping piece moves to the opening of the box body, the signal emitter emits a second detection light signal to the signal reflecting plate; and the signal receivers are used for receiving the second detection light signals reflected by the signal reflecting plate, generating a plurality of height data, and generating a height abnormal signal when the height data are different from the height standard data preset in the signal receivers.
5. 5. The wafer processing tool according to claim 4, further comprising a control processor electrically connected to the robot, the signal transmitter, and the signal receiver, respectively, the control processor configured to control the operation of the first telescoping member and the second telescoping member; Receiving a thickness abnormality signal generated by the signal receiver, and identifying the wafer with abnormal thickness according to the thickness abnormality signal; and receiving the height abnormality signal generated by the signal receiver, and identifying the clamping groove with abnormal height according to the height abnormality signal.
6. 6. The wafer processing machine of claim 5, further comprising an alarm device electrically connected to the control processor and a signal receiver, the alarm device alerting when the signal receiver generates the thickness anomaly signal and/or the height anomaly signal.
7. 7. The wafer processing machine according to claim 6, wherein the alarm device comprises a buzzer, the buzzer is electrically connected with the control processor and the signal receiver, and the buzzer buzzes when the signal receiver generates the thickness abnormality signal and/or the height abnormality signal.
8. 8. The wafer processing machine of claim 7, wherein the alarm device further comprises an alarm light electrically connected to the control processor and a signal receiver, the alarm light flashing when the signal receiver generates the thickness anomaly signal and/or the height anomaly signal.
9. 9. The wafer processing machine of claim 8, wherein the alarm device further comprises a display electrically connected to the control processor and a signal receiver, the display displaying an alarm when the signal receiver generates the thickness anomaly signal and/or the height anomaly signal; When the control processor identifies the wafer with abnormal thickness, the display displays the number of layers of the corresponding wafer; When the control processor identifies the clamping groove with abnormal height, the display displays the layer number of the corresponding clamping groove.
10. 10. A wafer and cassette inspection system comprising a wafer processing tool according to any one of claims 1 to 5 for inspecting whether the wafer and the cassette are abnormal.

Description

Wafer processing machine, wafer and storage box detection system Technical Field The application relates to the technical field of semiconductor manufacturing, in particular to a wafer processing machine, a wafer and a storage box detection system. Background In semiconductor manufacturing processes, the transport and storage of wafers is primarily dependent on wafer cassettes. Wafer cassettes are used to safely transport wafers between different process tools while reducing the risk of contamination of the wafers. When the wafer is placed into the machine, the receiving manipulator can confirm the position of the wafer in the wafer storage box, and the abnormality can be identified by the manipulator due to the difference of the internal structures of the wafer storage box and the difference of the thickness of the wafer. The mechanical arm in the existing machine can only identify the abnormality, and cannot judge specific abnormal points and abnormal information, so that the abnormality of the machine is checked more complex, and the productivity of the machine for processing wafers is reduced. Disclosure of utility model The application mainly provides a wafer processing machine, a wafer and a storage box detection system, which are used for solving the technical problems that the inspection machine is complicated in abnormality and the productivity of the machine for processing wafers is reduced in the background art. The technical scheme adopted for solving the technical problems is as follows: The application provides a wafer processing machine station which comprises a processing cavity, a storage box, a manipulator and a detection device, wherein the storage box is arranged in the processing cavity and used for storing a plurality of wafers, the manipulator is arranged in the processing cavity and used for clamping the wafers in the storage box, and the detection device is arranged on the manipulator and used for emitting detection signals into the storage box when the manipulator moves to the storage box and used for detecting the thickness of each wafer. Optionally, the detection device comprises a signal emitter and a plurality of signal receivers, wherein the signal emitter is arranged in the center of the manipulator, when the manipulator moves to the storage box, the signal emitter emits a first detection light signal to a signal reflecting plate in the storage box, the plurality of signal receivers are arranged on the manipulator at intervals of an arc and are positioned between the signal emitter and the storage box and are used for receiving the first detection light signal reflected by the signal reflecting plate to generate a plurality of thickness data, and when any one thickness data is different from thickness standard data preset in the signal receiver, a thickness abnormal signal is generated. The manipulator comprises a base, a first telescopic piece, a second telescopic piece and a clamping piece, wherein the fixed end of the first telescopic piece is connected with the base, the telescopic end of the first telescopic piece stretches along the direction perpendicular to the plane where the base is located, the fixed end of the second telescopic piece is connected with the telescopic end of the first telescopic piece, the telescopic end of the second telescopic piece stretches towards the storage box and stretches along the direction parallel to the plane where the base is located, the clamping piece is connected with the telescopic end of the second telescopic piece, the length direction of the manipulator is consistent with the telescopic direction of the second telescopic piece, the signal transmitter is arranged on the clamping piece and is close to the second telescopic piece, and a plurality of signal receivers are arranged on the clamping piece at arc intervals and are close to the signal transmitter. The storage box comprises a box body with an opening at one side, a plurality of clamping grooves which are arranged in the box body at intervals up and down and used for placing wafers, a signal reflecting plate which is arranged on the inner wall of the box body and located on the surface opposite to the opening and used for reflecting detection signals emitted by the signal emitters to signal receivers, when the clamping piece moves to the opening of the box body, the signal emitters emit second detection light signals to the signal reflecting plate, and a plurality of signal receivers receive the second detection light signals reflected by the signal reflecting plate and generate a plurality of height data. Optionally, the wafer processing machine further comprises a control processor, wherein the control processor is electrically connected with the manipulator, the signal transmitter and the signal receiver respectively, and is used for controlling the first telescopic piece and the second telescopic piece to operate, receiving a thickness abnormal signal generated by the