CN-224205573-U - Chip loading device

CN224205573UCN 224205573 UCN224205573 UCN 224205573UCN-224205573-U

Abstract

The application relates to a chip loading device which comprises a first driving mechanism, a second driving mechanism, a third driving mechanism and an adsorption mechanism, wherein the first driving mechanism is in driving connection with the second driving mechanism, the second driving mechanism is in driving connection with the third driving mechanism, the third driving mechanism is in driving connection with the adsorption mechanism, the first driving mechanism is used for driving the second driving mechanism, the third driving mechanism and the adsorption mechanism to move along a first direction, the second driving mechanism is used for driving the third driving mechanism and the adsorption mechanism to move along a second direction, and the third driving mechanism is used for driving the adsorption mechanism to move along a third direction. The chip loading device can respectively and independently control the movements of the adsorption mechanism in three directions, can realize the accurate position adjustment of the adsorption mechanism in three-position space, and can improve the movement precision of the adsorption mechanism. Because the motions in each direction are mutually independent, the motions in different directions are convenient to combine, various complex adsorption paths are realized, and the adsorption mechanism can be convenient for adsorbing chips and loading the chips.

Inventors

ZHENG JIARUI
HU HAN

Assignees

深圳市联得半导体技术有限公司

Dates

Publication Date: 20260505
Application Date: 20250425

Claims (10)

1. A chip loading device is characterized by comprising a first driving mechanism, a second driving mechanism, a third driving mechanism and an adsorption mechanism, wherein the first driving mechanism is in driving connection with the second driving mechanism, the second driving mechanism is in driving connection with the third driving mechanism, the third driving mechanism is in driving connection with the adsorption mechanism, the first driving mechanism is used for driving the second driving mechanism, the third driving mechanism and the adsorption mechanism to move along a first direction, the second driving mechanism is used for driving the third driving mechanism and the adsorption mechanism to move along a second direction, the third driving mechanism is used for driving the adsorption mechanism to move along a third direction, and the first direction, the second direction and the third direction are intersected in pairs, and the first direction, the second direction and the third direction are not coplanar.
2. The die attach apparatus of claim 1 wherein the suction mechanism comprises a rotary drive assembly and a suction assembly, the rotary drive assembly coupled to the third drive mechanism, the suction assembly rotatably coupled to the third drive mechanism, the rotary drive assembly drivingly coupled to the suction assembly to rotate the suction assembly about the third direction.
3. The die attach apparatus of claim 2 wherein said suction mechanism further comprises a bumper attached to an outside of said suction assembly, said bumper extending in said third direction.
4. The die bonding apparatus according to claim 2, wherein the rotary driving assembly comprises a rotary driver and a transmission member, the suction assembly comprises a suction nozzle and a rotation shaft, the rotary driver is fixedly arranged on the third driving mechanism, the rotary driver is in driving connection with the transmission member, the transmission member is in driving connection with the rotation shaft, the rotation shaft is in rotatable connection with the third driving mechanism, and the rotation shaft is connected with the suction nozzle.
5. The die mounting apparatus according to claim 4, wherein the transmission member includes a timing belt, a first timing pulley and a second timing pulley, the first timing pulley is connected to an output end of the rotary driver, the rotary driver drives the first timing pulley to rotate, the second timing pulley is connected to one end of the rotation shaft in the third direction, the other end of the rotation shaft in the third direction is connected to the suction nozzle, and the timing belt is wound around both the first timing pulley and the second timing pulley.
6. The die attach apparatus of claim 2 wherein said suction mechanism further comprises a Z-drive and a transfer assembly, said Z-drive being coupled to said third drive and being drivingly coupled to said transfer assembly, said suction assembly being rotatably coupled to said transfer assembly.
7. The die mounting apparatus of claim 1 wherein the first drive mechanism includes an X-direction drive, an X-direction screw, and an X-direction slide, the X-direction drive being drivingly coupled to the X-direction screw, the X-direction screw being drivingly coupled to the X-direction slide, the X-direction slide being coupled to the second drive mechanism.
8. The die bonding device according to claim 1, further comprising two bases and two X-direction sliding assemblies, wherein the two bases are arranged at intervals along the second direction, the X-direction sliding assemblies are respectively and correspondingly connected to the bases, and the first driving mechanism is respectively connected to the X-direction sliding assemblies along two sides of the second direction.
9. The die attach apparatus of claim 1 wherein the second drive mechanism comprises a Y-motor module, the first drive mechanism is drivingly connected to a base of the Y-motor module, and a slide of the Y-motor module is drivingly connected to the third drive mechanism.
10. The die attach apparatus of claim 1 wherein the third drive mechanism comprises a Z-motor module, the second drive mechanism is drivingly connected to the base of the Z-motor module, and the slide of the Z-motor module is drivingly connected to the suction mechanism.

Description

Chip loading device Technical Field The application relates to the technical field of semiconductor equipment, in particular to a chip mounting device. Background The chip mounter is also called a die bonder, a chip mounter, a die bonder, a chip mounter and the like, and has the functions of mainly being used for picking up semiconductor chips from a wafer, fixing the semiconductor chips on carriers such as a lead frame, a substrate and the like in a dispensing mode and the like, so that the chip mounter is the most common chip mounting equipment and is widely applied to various integrated circuit packages. The most important module in the die bonder is the die bonder, which is the key part of the apparatus, and is used for picking up and placing the chips. The existing chip loading device is single in movement mode, complex chip loading paths are difficult to realize, and meanwhile, the existing chip loading device is not high enough in positioning accuracy, and chip loading quality and chip loading consistency are affected. The information disclosed in this background section is only for enhancement of understanding of the general background of the utility model and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person of ordinary skill in the art. Disclosure of utility model Based on this, it is necessary to provide a die-loading device aiming at the problems that the current die-loading device has a single motion mode, is difficult to realize a complex die-loading path, and has insufficient positioning precision and influences die-loading quality and die-loading consistency. The utility model provides a chip loading device, includes first actuating mechanism, second actuating mechanism, third actuating mechanism and adsorption mechanism, first actuating mechanism drive connect in second actuating mechanism, second actuating mechanism drive connect in third actuating mechanism, third actuating mechanism drive connect in adsorption mechanism, first actuating mechanism is used for driving second actuating mechanism with third actuating mechanism and adsorption mechanism moves along first direction, second actuating mechanism is used for driving third actuating mechanism with adsorption mechanism moves along the second direction, third actuating mechanism is used for driving adsorption mechanism moves along the third direction. In one embodiment, the adsorption mechanism comprises a rotary driving assembly and an adsorption assembly, the rotary driving assembly is connected with the third driving mechanism, the adsorption assembly is rotatably connected with the third driving mechanism, and the rotary driving assembly is connected with the adsorption assembly in a driving manner so that the adsorption assembly rotates around the third direction. In one embodiment, the suction mechanism further comprises a bump guard connected to the outside of the suction assembly, the bump guard extending in the third direction. In one embodiment, the rotary driving assembly comprises a rotary driver and a transmission member, the adsorption assembly comprises a suction nozzle and a rotating shaft, the rotary driver is fixedly arranged on the third driving mechanism, the rotary driver is in driving connection with the transmission member, the transmission member is in transmission connection with the rotating shaft, the rotating shaft is in rotatable connection with the third driving mechanism, and the rotating shaft is connected with the suction nozzle. In one embodiment, the transmission member includes a synchronous belt, a first synchronous pulley and a second synchronous pulley, the first synchronous pulley is connected to an output end of the rotary driver, the rotary driver drives the first synchronous pulley to rotate, the second synchronous pulley is connected to one end of the rotating shaft along the third direction, the other end of the rotating shaft along the third direction is connected to the suction nozzle, and the synchronous belt is wound on the first synchronous pulley and the second synchronous pulley simultaneously. In one embodiment, the adsorption mechanism further comprises a Z-direction driver and a switching assembly, wherein the Z-direction driver is connected with the third driving mechanism and is in driving connection with the switching assembly, and the adsorption assembly is rotatably connected with the switching assembly. In one embodiment, the first driving mechanism comprises an X-direction driver, an X-direction screw rod and an X-direction sliding seat, wherein the X-direction driver is in driving connection with the X-direction screw rod, the X-direction screw rod is in transmission connection with the X-direction sliding seat, and the X-direction sliding seat is connected with the second driving mechanism. In one embodiment, the die-bonding device further includes two bases and two X-direction sliding a