CN-224205576-U - Silicon chip separation device and silicon chip extraction equipment

Abstract

The utility model is applicable to the technical field of photovoltaic manufacture, and provides a silicon wafer separating device and silicon wafer extracting equipment, wherein the silicon wafer separating device comprises a placing groove and a water spray head; the placing groove comprises a bottom plate, a left side plate, a right side plate and a back plate, wherein the left side plate, the back plate and the right side plate are sequentially connected to form a U shape and are arranged on the bottom plate, and at least two water flow grooves extending along the vertical direction are respectively arranged on the left side plate and the right side plate; the sprinkler bead sets up in the outside of left side board and right side board respectively, corresponds the setting with the rivers groove for to the inside water spray of standing groove. The water sprayed out of the water spraying head uniformly acts on the two sides of the silicon wafer through the water flow grooves, and the uniform water flow distribution ensures that the acting force on each part of the silicon wafer in the separation process is relatively balanced, so that the silicon wafer is prevented from being damaged due to overlarge local stress.

Inventors

• LUO YUANPENG
• ZHANG ZHENLEI
• CHEN YIJUN
• YANG ZUXING
• ZHANG JUNKAI
• WANG YONGQIAN
• CHEN GANG

Assignees

• 天津爱旭太阳能科技有限公司
• 广东爱旭科技有限公司
• 浙江爱旭太阳能科技有限公司
• 珠海富山爱旭太阳能科技有限公司
• 滁州爱旭太阳能科技有限公司

Dates

Publication Date

20260505

Application Date

20250430

Claims (9)

1. 1. The silicon wafer separating device is characterized by comprising a placing groove and a water spraying head; The placing groove comprises a bottom plate, a left side plate, a right side plate and a back plate, wherein the left side plate, the back plate and the right side plate are sequentially connected and enclosed into a U shape and are arranged on the bottom plate, and at least two water flow grooves extending along the vertical direction are respectively arranged on the left side plate and the right side plate; The water spraying heads are respectively arranged on the outer sides of the left side plate and the right side plate, are correspondingly arranged with the water flow grooves and are used for spraying water into the placing grooves.
2. 2. The silicon wafer separator according to claim 1, wherein three water grooves extending in the vertical direction are provided on the left side plate and the right side plate, respectively.
3. 3. The wafer separator of claim 1 wherein the distances between the three water flow channels are equal.
4. 4. The wafer separator of claim 1 wherein at least two water spray holes are provided in said water spray head, said water spray holes corresponding in number and location to said water flow slots.
5. 5. The silicon wafer separator according to claim 4, wherein the water jet hole has a diameter of 5mm to 10mm.
6. 6. The wafer separator of claim 1 wherein the water jet pressure of the water jet head is 0.05mpa to 0.1mp.
7. 7. The wafer separator of claim 1 further comprising a lift table, said placement slot being disposed on said lift table.
8. 8. The wafer separator of claim 1 further comprising a water immersion tank, said placement tank being disposed within the water immersion tank.
9. 9. A silicon wafer extraction apparatus comprising a pick-up device and a silicon wafer separation device according to any one of claims 1 to 8.

Description

Silicon chip separation device and silicon chip extraction equipment Technical Field The utility model belongs to the technical field of photovoltaic manufacturing, and particularly relates to a silicon wafer separating device and silicon wafer extracting equipment. Background In the production and processing process of silicon wafers, the situation that a plurality of silicon wafers are adhered to each other often occurs. The traditional silicon wafer separation method may damage the silicon wafer, for example, when mechanical force separation is adopted, the silicon wafer is easy to generate defects such as cracks, scratches and the like, and the quality and performance of the silicon wafer are affected. Moreover, if the stress of the silicon wafer is uneven in the separation process, the silicon wafer can be broken, so that the material waste and the cost increase are caused. Therefore, a separation device capable of uniformly applying force without damaging the silicon wafer is required. Disclosure of utility model The utility model provides a silicon wafer separating device and silicon wafer extracting equipment, and aims to solve the problem that silicon wafers are easy to crack and damage in the silicon wafer separating process. The utility model is realized in such a way that the silicon wafer separating device comprises a placing groove and a water spray head; The placing groove comprises a bottom plate, a left side plate, a right side plate and a back plate, wherein the left side plate, the back plate and the right side plate are sequentially connected and enclosed into a U shape and are arranged on the bottom plate, and at least two water flow grooves extending along the vertical direction are respectively arranged on the left side plate and the right side plate; The water spraying heads are respectively arranged on the outer sides of the left side plate and the right side plate, are correspondingly arranged with the water flow grooves and are used for spraying water into the placing grooves. Optionally, three water flow grooves extending along the vertical direction are respectively arranged on the left side plate and the right side plate. Optionally, the distances among the three water flow grooves are equal. Optionally, at least two water spraying holes are formed in the water spraying head, and the number and the positions of the water spraying holes correspond to those of the water flow grooves. Optionally, the aperture of the water spraying hole is 5 mm-10 mm. Optionally, the water spraying pressure of the water spraying head is 0.05 MPa-0.1 MP. Optionally, the device further comprises a lifting table, and the placing groove is arranged on the lifting table. Optionally, the device further comprises a water soaking tank, wherein the placing tank is placed in the water soaking tank. The utility model also provides silicon wafer extraction equipment which comprises a pick-up device and the silicon wafer separation device. The utility model has the beneficial effects that as the placing groove is arranged for placing the silicon wafer, the left side plate and the right side plate of the placing groove are provided with at least two water flow grooves, and the water spraying heads are respectively arranged on the outer sides of the left side plate and the right side plate and correspond to the water flow grooves for spraying water into the placing groove. The water sprayed out of the water spraying head uniformly acts on the two sides of the silicon wafer through the water flow grooves, and the uniform water flow distribution ensures that the acting force on each part of the silicon wafer in the separation process is relatively balanced, so that the silicon wafer is prevented from being damaged due to overlarge local stress. Drawings Fig. 1 is a schematic structural diagram of a silicon wafer separating device provided by the utility model. Reference numerals illustrate: 100. The silicon wafer separating device comprises 110, a placing groove, 111, a bottom plate, 112, a left side plate, 113, a right side plate, 114, a back plate, 115, a water flow groove, 120 and a water spray head. Detailed Description The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. Examples of the embodiments are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model. Furthermore, it should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the present utility model. In the description of the present utility mo