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CN-224205577-U - Supporting device for semiconductor cleaning equipment and semiconductor cleaning equipment

CN224205577UCN 224205577 UCN224205577 UCN 224205577UCN-224205577-U

Abstract

The utility model provides a supporting device for semiconductor cleaning equipment and the semiconductor cleaning equipment, comprising a tray body and a supporting piece, wherein the supporting piece is arranged on the tray body and is used for supporting a wafer; the tray body is provided with a notch for allowing fingers of the manipulator to pass through the notch in the process of picking or placing the sheets by the manipulator. According to the supporting device for the semiconductor cleaning equipment, the notch for avoiding the fingers of the manipulator is arranged at the outer edge of the tray body for supporting the wafer, and allows the fingers of the manipulator to pass through the notch in the process of picking or placing the wafer by the manipulator, so that the problem of interference between the manipulator and the tray body in the process of picking or placing the wafer is effectively avoided. Compared with the wafer supporting device in the prior art, the wafer cleaning device has the advantages that on one hand, the structure of the supporting device is simplified, on the other hand, the step of taking the wafer is simplified, the process beat is improved, and further the wafer cleaning efficiency is improved.

Inventors

  • ZHAO XU
  • Hao Yansong
  • GUO SHENGYANG

Assignees

  • 沈阳芯源微电子设备股份有限公司

Dates

Publication Date
20260505
Application Date
20250507

Claims (10)

  1. 1. A support device for a semiconductor cleaning apparatus, comprising: The tray body is provided with a plurality of grooves, The support piece is arranged on the tray body and used for supporting the wafer; the tray body is provided with a notch for allowing fingers of the manipulator to pass through the notch in the process of picking or placing the sheets by the manipulator.
  2. 2. The support device for semiconductor cleaning apparatus according to claim 1, wherein the notch is provided at an outer edge of the tray body and penetrates the tray body.
  3. 3. The support device for a semiconductor cleaning apparatus according to claim 2, wherein the tray is provided with a plurality of the notches spaced apart along an outer edge of the tray.
  4. 4. The support device for a semiconductor cleaning apparatus according to claim 1, wherein a protection space for accommodating a protection gas is formed between the tray body and the wafer; An air inlet is formed in one surface of the tray body opposite to the wafer, and the air inlet is communicated with an external air source; And an air outlet channel is formed between the outer edge of the tray body and the outer edge of the wafer.
  5. 5. The support device for a semiconductor cleaning apparatus according to claim 4, wherein the gas inlet is provided with a gas flow divider; The gas splitter comprises an air inlet and a flow limiting part, wherein the flow limiting part is arranged in the center of the air inlet, and limits the air flow of the air inlet by blocking part of the air flow.
  6. 6. The support device for a semiconductor cleaning apparatus according to claim 5, wherein the flow restrictor divides the air inlet aperture into a first air inlet aperture and a second air inlet aperture, both of which are arc-shaped structures.
  7. 7. The support device for a semiconductor cleaning apparatus according to claim 1, wherein a plurality of the support members are provided on the tray body, the plurality of the support members being spaced apart along an edge of the tray body.
  8. 8. The support device for a semiconductor cleaning apparatus according to claim 4, wherein the tray comprises: the first tray body is used for isolating liquid splashing in the cleaning process; the support piece is arranged on the first tray body; The second tray body is arranged above the first tray body and used for forming the protection space with the non-cleaning surface of the wafer; The connecting part is arranged between the first disc body and the second disc body and is used for connecting the first disc body and the second disc body; The air inlet is arranged on one surface of the second disc body opposite to the wafer.
  9. 9. The support device for a semiconductor cleaning apparatus according to claim 8, wherein the first tray, the second tray, and the connection portion are integrally formed.
  10. 10. A semiconductor cleaning apparatus comprising the support device of any one of claims 1 to 9.

Description

Supporting device for semiconductor cleaning equipment and semiconductor cleaning equipment Technical Field The present utility model relates to the field of semiconductor devices, and more particularly, to a supporting device for a semiconductor cleaning device and a semiconductor cleaning device. Background In the process of manufacturing a semiconductor device, when a wafer is cleaned, if the protection of the non-cleaning surface is insufficient, the cleaning liquid on the cleaning surface flows back to the non-cleaning surface of the wafer during the cleaning process, which causes contamination of the non-cleaning surface of the wafer, and if the contamination is serious, the subsequent process is seriously affected. Protection of the non-cleaning side of the wafer is therefore important. In the prior art, a wafer to be cleaned is firstly placed on a supporting device horizontally through a manipulator in the wafer cleaning process, then the cleaning surface of the wafer is cleaned, and in the cleaning process, liquid or gas is used for protecting the non-cleaning surface of the wafer. In the case of using a non-cleaning surface of a gas-shielded wafer, since the gas has the characteristics of being easily diffused and easily leaked, a common treatment scheme is to reduce the distance between the wafer and the support plate, so that a smaller space is formed between the wafer and the support plate to facilitate gas filling. However, there is a problem in that there is no space for the robot to take out the wafer due to the small space between the wafer and the support plate. In order to solve the problem, an auxiliary mechanism is required to be arranged below the supporting device to support the wafer, and a space for taking the wafer is created, so that the structure of the supporting device for the wafer is more complex, the supporting action of the auxiliary mechanism can prolong the duration of the wafer cleaning process, and further the process beat is reduced, so that the cleaning efficiency is reduced. Disclosure of utility model In view of the above-mentioned drawbacks of the prior art, an object of the present utility model is to provide a supporting device for a semiconductor cleaning apparatus and a semiconductor cleaning apparatus, which can achieve rapid wafer pick-up and wafer drop-off while effectively protecting a non-cleaning surface during wafer cleaning. To achieve the above object, a first aspect of the present utility model provides a support device for a semiconductor cleaning apparatus, comprising: The tray body is provided with a plurality of grooves, The support piece is arranged on the tray body and used for supporting the wafer; the tray body is provided with a notch for allowing fingers of the manipulator to pass through the notch in the process of picking or placing the sheets by the manipulator. Preferably, the notch is disposed at an outer edge of the tray body and penetrates through the tray body. Preferably, the tray body is provided with a plurality of notches, and the notches are arranged at intervals along the outer edge of the tray body. Preferably, a protection space is formed between the tray body and the wafer, the protection space is used for containing protection gas, an air inlet is formed in one surface of the tray body opposite to the wafer, the air inlet is communicated with an external air source, and an air outlet channel is formed between the outer edge of the tray body and the outer edge of the wafer. Preferably, the air inlet is provided with an air splitter, the air splitter comprises an air inlet hole and a flow limiting part, and the flow limiting part is arranged in the center of the air inlet hole and limits the air flow of the air inlet by blocking part of the air flow. Preferably, the air inlet is divided into a first air inlet and a second air inlet by the flow limiting part, and the first air inlet and the second air inlet are of arc structures. Preferably, the tray body is provided with a plurality of supporting pieces, and the plurality of supporting pieces are arranged at intervals along the edge of the tray body. Preferably, the tray body includes: the first tray body is used for isolating liquid splashing in the cleaning process; the support piece is arranged on the first tray body; The second tray body is arranged above the first tray body and used for forming the protection space with the non-cleaning surface of the wafer; The connecting part is arranged between the first disc body and the second disc body and is used for connecting the first disc body and the second disc body; The air inlet is arranged on one surface of the second disc body opposite to the wafer. Preferably, the first disc body, the second disc body and the connecting portion are integrally formed. A second aspect of the utility model provides a semiconductor cleaning apparatus comprising a support device of the semiconductor cleaning apparatus according to the first