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CN-224205583-U - Automatic wafer double-sided detection device

CN224205583UCN 224205583 UCN224205583 UCN 224205583UCN-224205583-U

Abstract

The utility model discloses a double-sided automatic wafer detection device which comprises a base, a turntable, a first visual detection lens, a second visual detection lens and a third visual detection lens, wherein a rotary driving mechanism is arranged on the base, the turntable is horizontally arranged on the rotary driving mechanism, a plurality of positioning grooves corresponding to wafers are annularly arranged on the top surface of the turntable in an array mode, through holes extending to the bottom surface of the turntable are arranged at the bottoms of the positioning grooves, the first visual detection lens is suspended above an a-th positioning groove, the second visual detection lens is arranged below a through hole of a b-th positioning groove, a lifting driving mechanism positioned below a through hole of a c-th positioning groove is arranged on the base, a telescopic rod pointing upwards is arranged on the lifting driving mechanism, a tray positioned below the top part is concentrically arranged on the telescopic rod, and the third visual detection lens is annularly arranged on the tray and pointing upwards, so that automatic visual detection of the front surface and the back surface of the wafer is realized, and the automatic level is improved.

Inventors

  • ZHOU BING

Assignees

  • 张家港意发功率半导体有限公司

Dates

Publication Date
20260505
Application Date
20250518

Claims (9)

  1. 1. The double-sided automatic wafer detection device is used for visual detection of wafers and is characterized by comprising a base, a turntable, a first visual detection lens, a second visual detection lens and a third visual detection lens, wherein a rotary driving mechanism is arranged on the base, the turntable is horizontally arranged on the rotary driving mechanism, a plurality of positioning grooves corresponding to the wafers are arranged on an annular array of the top surface of the turntable, through holes extending to the bottom surface of the turntable are arranged at the bottom of the positioning grooves, the first visual detection lens is suspended above the a-th positioning groove, the second visual detection lens is arranged below the through holes of the b-th positioning groove, a lifting driving mechanism positioned below the through holes of the c-th positioning groove is arranged on the base, a telescopic rod pointing upwards is arranged on the lifting driving mechanism, a tray positioned below the top is concentrically arranged on the telescopic rod, and the third visual detection lens is annularly arranged on the tray and pointing upwards.
  2. 2. The apparatus according to claim 1, wherein the rotation driving mechanism is a cam divider.
  3. 3. The apparatus according to claim 1, wherein the positioning groove is a circular groove, and the diameter of the through hole is smaller than the diameter of the positioning groove.
  4. 4. The automatic wafer double-sided inspection device according to claim 1, wherein a stand column located at one side of the turntable is arranged on the base, a sliding sleeve is arranged on the stand column, a cantilever extending to the upper portion of the first visual inspection lens is arranged on the sliding sleeve, and the first visual inspection lens is arranged at the bottom of the cantilever.
  5. 5. The automatic wafer double-sided inspection device according to claim 4, wherein a fastening screw pointing to the column is provided on the slide sleeve.
  6. 6. The apparatus according to claim 1, wherein the number of the positioning grooves is at least 4.
  7. 7. The automatic wafer double-sided inspection device according to claim 1, wherein a silica gel pad is provided on top of the telescopic rod.
  8. 8. The apparatus according to claim 1, wherein the number of the third vision inspection lenses is at least 3.
  9. 9. The automatic wafer double-sided inspection device according to claim 1, wherein a cushion block located below the second vision inspection lens is disposed on the base.

Description

Automatic wafer double-sided detection device Technical Field The utility model relates to the technical field of wafer detection, in particular to a wafer double-sided automatic detection device. Background In the processing process of the wafer, visual detection is needed, the front and back images of the wafer are acquired by utilizing a visual detection lens, and whether the detected wafer is qualified or not is judged by comparing the front and back images with the wafer standard images in a database. In order to ensure accuracy of visual inspection, the wafer needs to be positioned first, for example, a positioning groove is designed on the carrier, the wafer is placed into the positioning groove for inspection, but only visual inspection of the front surface of the wafer can be performed, and the edge of the back surface of the wafer is blocked by the positioning groove. In order to realize the detection of the back of the wafer, the turnover surface of the wafer is required to be changed, the operation is complex, the detection efficiency is affected, and the improvement is required. Disclosure of utility model The utility model aims to provide a double-sided automatic wafer detection device which is used for carrying out double-sided visual detection on a wafer and improving detection efficiency. To achieve the purpose, the utility model adopts the following technical scheme: The double-sided automatic wafer detection device comprises a base, a turntable, a first visual detection lens, a second visual detection lens and a third visual detection lens, wherein a rotary driving mechanism is arranged on the base, the turntable is horizontally arranged on the rotary driving mechanism, a plurality of positioning grooves corresponding to wafers are formed in an annular array on the top surface of the turntable, through holes extending to the bottom surface of the turntable are formed in the bottom of the positioning grooves, the first visual detection lens is suspended above an a-th positioning groove, the second visual detection lens is arranged below a through hole of a b-th positioning groove, a lifting driving mechanism positioned below a through hole of a c-th positioning groove is arranged on the base, a telescopic rod pointing upwards is arranged on the lifting driving mechanism, a tray positioned below the top is concentrically arranged on the telescopic rod, and the annular array of the third visual detection lens is arranged on the tray and points upwards. Wherein the rotary driving mechanism adopts a cam divider. The positioning groove is a round groove, and the diameter of the through hole is smaller than that of the positioning groove. The base is provided with an upright post positioned on one side of the turntable, the upright post is provided with a sliding sleeve, the sliding sleeve is provided with a cantilever extending to the upper part of the first visual inspection lens, and the first visual inspection lens is arranged at the bottom of the cantilever. Wherein, be provided with the fastening screw that points to the stand on the sliding sleeve. Wherein, the quantity of constant head tank is 4 at least. Wherein, the telescopic link top is provided with the silica gel pad. Wherein the number of the third visual inspection lenses is at least 3. And a cushion block positioned below the second visual inspection lens is arranged on the base. The wafer double-sided automatic detection device has the beneficial effects that after a wafer is placed in a positioning groove by a manual or mechanical arm, the wafer is sent to the lower part of a first visual detection lens through rotation of a turntable, image acquisition of the top surface of the wafer is carried out, then the turntable continues to rotate for an angle, the wafer is sent to the upper part of a second visual detection lens, image acquisition of the middle part of the bottom surface of the wafer is carried out, the turntable continues to rotate for an angle, the wafer is sent to the upper part of a third visual detection lens, the wafer is lifted upwards by a telescopic rod to be separated from the positioning groove, and then image acquisition of the edge of the bottom surface of the wafer is carried out by the third visual detection lens, so that automatic visual detection of the front surface and the back surface of the wafer is realized, and the automation level and the detection efficiency are improved. Drawings FIG. 1 is a schematic diagram of the structure of the present utility model; Fig. 2 is a schematic view showing the structure of the third visual inspection lens in fig. 1 when it is raised. Detailed Description The technical scheme of the utility model is further described below by means of specific embodiments in combination with fig. 1-2. The automatic wafer double-sided detection device shown in fig. 1 comprises a base 1, a turntable 3, a first visual detection lens 11, a second visual detection lens 12 and a thi