CN-224205589-U - Improve air blowing device of silicon chip pad pasting trailing edge bubble

CN224205589UCN 224205589 UCN224205589 UCN 224205589UCN-224205589-U

Abstract

The utility model discloses an air blowing device for improving bubbles at the rear edge of a silicon wafer film, which comprises a supporting mechanism and an air blowing mechanism positioned on the supporting mechanism, wherein the air blowing mechanism is used for blowing air aiming at the silicon wafer film sticking device, and the supporting mechanism is used for supporting the air blowing mechanism. According to the air blowing device provided by the utility model, the air blowing is carried out on the silicon wafer film pasting device during film pasting, the blue film is blown up in the pasting process, and the blue film is effectively prevented from being contacted with the silicon wafer in advance, so that the occurrence rate of bubbles is reduced, and the product yield is improved.

Inventors

SUN NAN
HUANG YUXUAN
GENG FAN
ZHANG LIXIANG
Feng Chenji
Ran Yanzhi

Assignees

郑州合晶硅材料有限公司

Dates

Publication Date: 20260505
Application Date: 20250606

Claims (10)

1. The blowing device for improving the bubbles at the edge of the silicon wafer film is characterized by comprising a supporting mechanism and a blowing mechanism positioned on the supporting mechanism; the air blowing mechanism is used for blowing air aiming at the silicon wafer film pasting device; The supporting mechanism is used for supporting the blowing mechanism.
2. The blowing device for improving the air bubbles at the edge of a silicon wafer film according to claim 1, The supporting mechanism comprises a supporting base and a supporting column positioned on the supporting base; The blowing mechanism is positioned on the support column.
3. The blowing device for improving the air bubbles at the edge of a silicon wafer film according to claim 2, The support base comprises a lower support bottom plate, an upper support plate and a vertical support plate positioned between the lower support bottom plate and the upper support plate; The area of the lower supporting bottom plate is larger than that of the upper supporting plate.
4. The blowing device for improving the air bubbles at the edge of a silicon wafer film according to claim 3, And the lower supporting bottom plate is provided with a mounting hole.
5. The blowing device for improving the air bubbles at the edge of a silicon wafer film according to claim 3, And the lower supporting bottom plate is provided with an opening.
6. The blowing device for improving the air bubbles at the edge of a silicon wafer film according to claim 1, The blowing mechanism comprises a blowing pipeline and blowing holes distributed on the blowing pipeline.
7. The air blowing device for improving the air bubbles at the edge of a silicon wafer film according to claim 6, The air blowing pipeline is also provided with an auxiliary air hole, and the air blowing direction of the auxiliary air hole is different from the air blowing direction of the air blowing hole.
8. The air blowing device for improving the air bubbles at the edge of a silicon wafer film according to claim 6, The air blowing pipeline is connected with an air source.
9. The air blowing device for improving the air bubbles at the edge of a silicon wafer film according to claim 8, The air blowing pipeline is connected with the air source through an air source pipeline.
10. The blowing device for improving the air bubbles at the edge of a silicon wafer film according to claim 1, The system also comprises a control system; the control system is electrically connected with the blowing mechanism.

Description

Improve air blowing device of silicon chip pad pasting trailing edge bubble Technical Field The utility model belongs to the technical field of semiconductor production, and particularly relates to an air blowing device for improving bubbles at the edge of a silicon wafer film. Background Today, where modern information technology is rapidly developed, the silicon wafer manufacturing industry is an important component, and each link of the manufacturing process is crucial, so that the performance and reliability of the final product are directly affected. The film pasting process is used as a key step in the silicon wafer manufacturing process and is mainly used for protecting an oxide layer on the surface of the silicon wafer and preventing the surface oxide layer from being damaged in the process of removing the chamfer oxide layer in the subsequent ring etching process. However, the existence of bubbles at the edge of the film is a technical problem to be solved in the process for a long time. The current mainstream film pasting technology mainly relies on mechanical roller lamination to realize that a blue film is attached to the surface of the silicon oxide layer (as shown in fig. 1). Although this method is relatively simple to handle, it inevitably generates edge bubbles during the fitting process. The edge bubbles not only affect the appearance of the film, but also can cause the damage of the silicon wafer edge oxide layer in the subsequent ring etching process, and affect the quality of the product after epitaxy, such as causing defects of edge formation silicon nodule (silicon nodule). To solve this problem, attempts have been made in the industry to use vacuum bonding, high temperature and high pressure bonding, and the like. However, these methods have problems of high cost, complicated process, and difficulty in large-scale application, or have problems of unsatisfactory effects on certain specific materials or structures. Therefore, how to effectively eliminate the bubbles after film lamination becomes a critical problem to be solved in the field of silicon wafer manufacturing. Disclosure of Invention The utility model aims to provide a blowing device for improving bubbles at the edge of a silicon wafer film after being stuck to solve the defects in the prior art. The utility model aims at realizing the following technical scheme: An air blowing device for improving bubbles at the edge of a silicon wafer film comprises a supporting mechanism and an air blowing mechanism positioned on the supporting mechanism; the air blowing mechanism is used for blowing air aiming at the silicon wafer film pasting device; The supporting mechanism is used for supporting the blowing mechanism. Preferably, the support mechanism comprises a support base and a support column positioned on the support base; The blowing mechanism is positioned on the support column. Preferably, the support base comprises a lower support base plate, an upper support plate and a vertical support plate positioned between the lower support base plate and the upper support plate; The area of the lower supporting bottom plate is larger than that of the upper supporting plate. Preferably, the lower supporting bottom plate is provided with a mounting hole. Preferably, the lower supporting bottom plate is provided with an opening. Preferably, the blowing mechanism comprises a blowing pipeline and blowing holes distributed on the blowing pipeline. Preferably, the air blowing pipeline is also provided with an auxiliary air hole, and the air blowing direction of the auxiliary air hole is different from that of the air blowing hole. Preferably, the air blowing pipeline is connected with an air source. Preferably, the air blowing pipeline is connected with the air source through an air source pipeline. Preferably, the blowing device further comprises a control system; the control system is electrically connected with the blowing mechanism. According to the air blowing device provided by the application, the air blowing is carried out on the silicon wafer film pasting device during film pasting, the blue film is blown up in the pasting process, and the blue film is effectively prevented from being contacted with the silicon wafer in advance, so that the occurrence rate of bubbles is reduced, and the product yield is improved. Drawings FIG. 1 is a schematic diagram of a prior art silicon wafer film lamination process; FIG. 2 is a view of the OM pattern after edge bubbling and edge etching after film lamination; FIG. 3 is a schematic view of the structure of the blowing device provided by the application; FIG. 4 is a schematic diagram of the film laminating process (the direction of blowing is indicated by the arrow) after installing the blowing device; FIG. 5 is a graph showing the change of bubble defect rate before and after the addition of the blowing device. Reference numerals illustrate: 1-silicon wafer, 2-roller, 3-blue film, 4-release film,