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CN-224205592-U - Continuous quick tectorial membrane equipment

CN224205592UCN 224205592 UCN224205592 UCN 224205592UCN-224205592-U

Abstract

The utility model relates to the technical field of semiconductor processing, in particular to continuous and rapid film laminating equipment which comprises an equipment frame, a displacement mechanism, a film laminating mechanism and a circular cutting mechanism, wherein a plurality of film laminating stations are arranged on the equipment frame, each film laminating station is provided with a corresponding film laminating mechanism and a circular cutting mechanism, the displacement mechanism is provided with a displacement bracket, a translation part, a lifting part and a plurality of displacement suckers, the displacement bracket is arranged on the equipment frame, the translation part is arranged on the displacement bracket, the lifting part is arranged on the driving end of the translation part, and the plurality of displacement suckers are respectively and uniformly arranged on the driving end of the lifting part at intervals, so that equidistant conveying operation is carried out on a plurality of wafers. In conclusion, the assembly line operation is realized through the equidistant displacement mechanism and the multiple film coating stations, the film pasting efficiency is greatly improved, the accurate positioning of the wafer is ensured by utilizing correction and visual detection, the rotating and overturning stations are adapted to a multi-element process, the design of each mechanism is optimized, the stability and reliability of equipment are ensured, and the high-efficiency production requirement is met.

Inventors

  • ZHANG KAI

Assignees

  • 韦森特(东莞)科技技术有限公司

Dates

Publication Date
20260505
Application Date
20250610

Claims (10)

  1. 1. The continuous and rapid film laminating equipment is characterized by comprising an equipment frame (10), a displacement mechanism (20), a film laminating mechanism (40) and a circular cutting mechanism (60), wherein a plurality of film laminating stations (11) are arranged on the equipment frame (10), the film laminating mechanism (40) and the circular cutting mechanism (60) are respectively arranged on each film laminating station (11), film laminating and circular cutting operations are respectively carried out on wafers on the film laminating stations (11), the displacement mechanism (20) is provided with a displacement bracket (21), a translation part (30), a lifting part (33) and a plurality of displacement sucking discs (22), the displacement bracket (21) is arranged on the equipment frame (10), the translation part (30) is arranged on the displacement bracket (21), the lifting part (33) is arranged on the driving end of the translation part (30), and the plurality of displacement sucking discs (22) are respectively and uniformly arranged on the driving end of the lifting part (33) at intervals, so that the wafers are equidistantly conveyed under the driving of the translation part (30).
  2. 2. The continuous rapid film laminating apparatus according to claim 1, wherein the translation member (30) is provided with a first linear module (31) and a translation bracket (32), the lifting member (33) is provided with a first actuator (34) and a lifting bracket (35), the first linear module (31) is mounted on the displacement bracket (21), the translation bracket (32) is mounted on a sliding table portion of the first linear module (31) to enable the first linear module (31) to operate and drive the translation bracket (32) to perform linear movement in a horizontal direction, the first actuator (34) is mounted on the translation bracket (32), and the lifting bracket (35) is slidingly connected to the translation bracket (32) and is in transmission connection with an output end of the first actuator (34) to enable the first actuator (34) to operate and drive the lifting bracket (35) to perform lifting movement in a vertical direction.
  3. 3. The continuous rapid film laminating device according to claim 1, wherein the device frame (10) is further provided with a correction station (12), the correction station (12) is provided with a correction mechanism (70), the correction mechanism (70) is provided with a correction motor (71) and a correction table (72), and the correction table (72) is in transmission connection with the output end of the correction motor (71), so that the wafer is subjected to edge finding correction operation under the driving of the correction motor (71), and the placement position of the wafer is corrected.
  4. 4. The continuous rapid film laminating apparatus according to claim 1, wherein a rotating station (13) is further provided on the apparatus frame (10), the rotating station (13) is provided with a rotating mechanism (74), the rotating mechanism (74) is provided with a rotating motor (75) and a rotating table (76), and the rotating table (76) is in transmission connection with the output end of the rotating motor (75), so that the wafer is rotated by a certain angle under the driving of the rotating motor (75).
  5. 5. The continuous rapid film laminating apparatus according to claim 1, wherein the apparatus frame (10) is further provided with a turnover station (14), the turnover station (14) is provided with a turnover mechanism (80), the turnover mechanism (80) is provided with a turnover support (81), a turnover shaft lever (82), a turnover motor (83), a turnover table (84) and a receiving table (86), the turnover shaft lever (82) is rotatably connected to the turnover support (81), the turnover motor (83) is fixedly connected to the turnover support (81), an output shaft thereof is in transmission connection with the turnover shaft lever (82), the turnover table (84) is fixedly connected to the turnover shaft lever (82) and is provided with an adsorption disc (85) for adsorbing a wafer, the turnover motor (83) is operated to drive the turnover shaft lever (82) to synchronously rotate and drive the turnover table (84) to rotate 180 degrees, and the wafer adsorbed by the adsorption disc (85) is placed on the receiving table (86).
  6. 6. The continuous rapid lamination apparatus according to claim 1, wherein the lamination mechanism (40) is provided with a lamination support (42), a second linear module (43), a film supply member (50), a film attaching member (55) and an attaching base (41), the lamination support (42) is mounted on the apparatus frame (10), the second linear module (43) is mounted on the lamination support (42) and is provided with a material waiting end (44) and an attaching end (45) at both ends thereof, the attaching base (41) is mounted on a sliding table portion of the second linear module (43) so as to operate the second linear module (43), the attaching base (41) is driven to reciprocate between the material waiting end (44) and the attaching end (45), the film supply member (50) is used for supplying the attaching base (41) at the position of the attaching end (45), and the film attaching member (55) is used for performing film attaching operation on a wafer on the attaching base (41).
  7. 7. The continuous rapid film laminating apparatus according to claim 6, wherein the film feeding member (50) is provided with a raw material shaft (51), a rim charge shaft (52), a backing material shaft (53) and a spreading shaft (54) respectively mounted on the film laminating support (42), the raw material shaft (51) is used for placing and supplying film raw materials, the rim charge shaft (52) is used for collecting film rim charges remained after the circular cutting operation, the backing material shaft (53) is used for collecting film bottom lining materials, and the two sets of spreading shafts (54) are respectively mounted on the film laminating support (42) at two sides of the attaching end (45) and used for spreading the film raw materials supplied by the raw material shaft (51), so that the film raw materials are kept above the attaching end (45) smoothly, and the film attaching member (55) is convenient for attaching.
  8. 8. The continuous rapid lamination apparatus according to claim 7, wherein the film attaching member (55) is provided with a second actuator (56) and a vacuum lamination assembly (57), the second actuator (56) is mounted on the lamination support (42), and the vacuum lamination assembly (57) is mounted on the driving end of the second actuator (56) and is in air passage communication with an external vacuum generating device, so that vacuum attaching operation is performed on the film raw material above the attaching end (45) to attach the film raw material to the wafer.
  9. 9. The continuous rapid lamination device according to claim 1, characterized in that the circular cutting mechanism (60) is provided with a longitudinal displacement module (61), a transverse displacement module (63), a third actuating member (64), a rotating device (65) and a circular cutting knife (66), the longitudinal displacement module (61) is mounted on the device frame (10), the transverse displacement module (63) is mounted on a sliding table part of the longitudinal displacement module (61) through an extension bracket (62), the third actuating member (64) is mounted on the sliding table part of the transverse displacement module (63), the rotating device (65) is mounted on a driving end of the third actuating member (64), and the circular cutting knife (66) is mounted on an output shaft of the rotating device (65).
  10. 10. The continuous rapid film laminating equipment according to claim 1, further comprising an automatic feeder (16), an automatic blanking machine (17), a feeding mechanical arm (18) and a blanking mechanical arm (19), wherein the automatic feeder (16) is used for conveying wafers to be laminated into the equipment, the feeding mechanical arm (18) is used for transferring the wafers to be laminated to a correction table (72) of the correction station (12), the equipment frame (10) is further provided with a discharging station (15), the discharging station (15) is provided with a discharging table (77), the blanking mechanical arm (19) is used for transferring the wafers coated on the discharging table (77) to the automatic blanking machine (17), and the automatic blanking machine (17) is used for conveying the wafers coated with films out of the equipment.

Description

Continuous quick tectorial membrane equipment Technical Field The utility model relates to the technical field of semiconductor processing, in particular to continuous and rapid film laminating equipment. Background In the semiconductor manufacturing process, wafer film lamination is a pre-step of a key process such as photolithography and etching, and a protective film (such as a blue film, a UV film, etc.) needs to be attached to the surface or the back of the wafer. In practical production, part of the process requires not only the front side but also the back side of the wafer, even two or more films. At present, wafer film pasting operation can be divided into manual film pasting and automatic film pasting. The automatic film sticking equipment can solve the problems to a certain extent, but the existing automatic film sticking machine has the remarkable defects of lower film sticking speed, lower film sticking efficiency and serious limitation on the overall production efficiency of a semiconductor manufacturing factory when a plurality of layers of films are needed to be stuck or the film sticking process is carried out on the front side and the back side of a wafer at the same time. The Chinese patent document with the bulletin number of CN222355075U discloses a wafer film pasting platform, which comprises a transverse moving frame, a transverse moving driving module, a height adjusting component, a lifting component and a rotating component, wherein the adsorbing platform is used for adsorbing a wafer to be pasted with a film, the auxiliary supporting platform is used for supporting the film when an inner ring of film is cut, the transverse moving driving module is configured to drive the transverse moving frame to move, the height adjusting component is configured to drive the auxiliary supporting platform to be at a high position or at a low position, the lifting component is configured to drive the adsorbing platform to rise to a preset height, the wafer is placed on the adsorbing platform, and the rotating component is configured to drive the adsorbing platform to rotate by a preset angle so as to drive the wafer positioned on the adsorbing platform to rotate. Although the above solution can attach two or more films to a wafer at a time, only one wafer can be operated at a time, which is not convenient for performing rapid film coating operation on a large number of wafers, and needs to be improved. Disclosure of utility model The utility model aims to overcome the defects of the prior art and provides a technical scheme capable of solving the problems. The utility model provides continuous and rapid laminating equipment which comprises an equipment frame, a displacement mechanism, a laminating mechanism and a circular cutting mechanism, wherein a plurality of laminating stations are arranged on the equipment frame, each laminating station is provided with a corresponding laminating mechanism and a circular cutting mechanism, so that laminating and circular cutting operations are respectively carried out on wafers on the laminating stations, the displacement mechanism is provided with a displacement bracket, a translation part, a lifting part and a plurality of displacement suckers, the displacement bracket is arranged on the equipment frame, the translation part is arranged on the displacement bracket, the lifting part is arranged on the driving end of the translation part, and the plurality of displacement suckers are respectively and uniformly arranged on the driving end of the lifting part at intervals, so that equidistant conveying operations are carried out on the plurality of wafers under the driving of the translation part. The lifting component is provided with a first executing piece and a lifting support, the first linear module is arranged on the displacement support, the lifting support is arranged on a sliding table part of the first linear module, the first linear module is enabled to operate and drive the lifting support to conduct linear motion in the horizontal direction, the first executing piece is arranged on the lifting support, the lifting support is connected to the lifting support in a sliding mode and is connected to the output end of the first executing piece in a transmission mode, the first executing piece is enabled to operate, and the lifting support is driven to conduct lifting motion in the vertical direction. The device comprises a device frame, a correction station, a correction mechanism, a correction motor and a correction table, wherein the correction station is further arranged on the device frame and is provided with the correction mechanism, the correction table is in transmission connection with the output end of the correction motor, so that the wafer is subjected to edge searching correction operation under the driving of the correction motor, and the placement position of the wafer is corrected. The equipment rack is further provided with a rotating