CN-224205607-U - Resin integral feeding structure for semiconductor packaging equipment

CN224205607UCN 224205607 UCN224205607 UCN 224205607UCN-224205607-U

Abstract

The utility model discloses a resin integral feeding structure for semiconductor packaging equipment, which relates to the technical field of semiconductor packaging and comprises a vibration disc, an integral table, a taking manipulator and a lifting part, wherein a U-shaped conveying groove is formed in the output end of the vibration disc, a baffle plate is arranged on one side of the U-shaped conveying groove, a stop lever is arranged above the U-shaped conveying groove, a first transverse displacement mechanism is arranged on the integral table, a movable plate is arranged on the first transverse displacement mechanism, a plurality of containing openings are arranged on the movable plate in a row, a feeding opening is formed in the integral table, a turnover cavity with a rectangular structure is formed in the turnover cavity and the feeding opening direction wheel, and the turnover cavity is positioned below the containing openings. This whole material loading structure of resin adopts the vertical ejection of compact of resin, need not to take the manipulator and carries out the upset operation, can effectively improve the material loading efficiency of resin material.

Inventors

FANG TANGLI
HE HAOJIA
ZHANG GUOWEI
QIAN PENG
CHEN HAITAO
ZUO CHEN

Assignees

安徽耐科装备科技股份有限公司

Dates

Publication Date: 20260505
Application Date: 20250513

Claims (5)

1. The resin integral feeding structure for the semiconductor packaging equipment comprises a vibration disc (1), an integral table (2), a taking manipulator (3) and a lifting part (4), wherein a U-shaped conveying groove (101) is formed in the output end of the vibration disc (1), and a baffle plate (102) is arranged on one side of the U-shaped conveying groove (101); Install first lateral displacement mechanism (201) on whole row's platform (2), just install fly leaf (202) on first lateral displacement mechanism (201), be provided with a plurality of accommodation opening (204) on fly leaf (202) in a row, be equipped with feed opening (203) on whole row's platform (2), and be provided with rectangular structure's upset chamber (205) to the wheel with feed opening (203), upset chamber (205) are located the below of accommodation opening (204).
2. A resin integral feeding structure for semiconductor packaging equipment according to claim 1, wherein the picking manipulator (3) comprises a second transverse displacement mechanism (31) mounted on a frame, a longitudinal displacement mechanism (32) is mounted on the second transverse displacement mechanism (31), a telescopic cylinder (33) is mounted on the longitudinal displacement mechanism (32), a pneumatic chuck (34) is mounted at the lower end of the telescopic cylinder (33), and a plurality of pneumatic clamping jaws (35) are mounted on the pneumatic chuck (34).
3. The resin integral feeding structure for semiconductor packaging equipment according to claim 1, wherein the lifting part (4) comprises a mounting frame (41) on which a lifting frame (44) is movably arranged, a belt (43) driven by a motor is arranged on the mounting frame (41), the side end of the mounting frame (41) is fixed on the belt (43), and a plurality of placement holes (42) matched with a cylindrical resin material are formed in the mounting frame (41).
4. The resin integral feeding structure for semiconductor packaging apparatus as set forth in claim 3, further comprising a lifting mechanism for lifting the resin material in said placement hole (42) to a certain height.
5. The resin integral feeding structure for semiconductor packaging equipment according to claim 4, wherein the feeding mechanism comprises a jacking cylinder (45) mounted on the mounting frame (41), a movable frame (46) is mounted on the output end of the jacking cylinder (45), a plurality of jacking rods (47) are arranged on the movable frame (46) in a row, the jacking rods (47) are in one-to-one correspondence with the placing holes (42), through holes with the same size as the jacking rods (47) are formed in the bottoms of inner cavities of the placing holes (42), and the diameter of the through holes is smaller than that of the resin.

Description

Resin integral feeding structure for semiconductor packaging equipment Technical Field The utility model relates to the technical field of semiconductor packaging, in particular to a resin integral feeding structure for semiconductor packaging equipment. Background The semiconductor packaging refers to a process of processing a wafer passing through a test to obtain an independent chip according to a product model and a function requirement, and is an important link in a semiconductor device manufacturing process, so as to protect the chip from the external environment and realize connection between the chip and an external circuit. Specifically, the packaging process involves dicing the wafer into small dies, then affixing the dies to the substrate in a specific manner (e.g., glue mounting), and connecting the bond pads of the dies to corresponding pins of the substrate using metal wires or conductive resin to form the desired circuitry. Finally, the individual wafers are encapsulated and protected with a plastic housing or other material to perform the physical protection, electrical connection and thermal management functions. The resin alignment structure is a key structure for arranging resin and conveying the resin in the automatic semiconductor packaging system, and mainly comprises feeding, orderly arranging, feeding and conveying, finally conveying to a die for hot melting, wherein the existing resin alignment structure mainly comprises a vibration disc, an alignment table, a taking manipulator and a lifting part, and when the existing vibration disc is used for feeding towards the alignment table, the cylindrical resin material is fed in a lying manner, so that after the resin material is taken by a subsequent taking manipulator, the resin material is required to be turned over and then placed on the lifting part, the whole resin material feeding time is prolonged, and the whole working efficiency is reduced. Disclosure of utility model The application aims to provide a resin integral feeding structure for semiconductor packaging equipment, which is used for solving the technical problem of longer resin feeding time in the prior art. The application provides a resin integral feeding structure for semiconductor packaging equipment, which comprises a vibration disc, an integral table, a taking manipulator and a lifting part, wherein the output end of the vibration disc is provided with a U-shaped conveying groove, one side of the U-shaped conveying groove is provided with a baffle plate, and a stop lever is also arranged, and is positioned above the U-shaped conveying groove; The novel overturning device comprises a movable plate, a first transverse displacement mechanism is arranged on a whole row of tables, the movable plate is provided with a plurality of accommodating openings in a row, a feeding opening is arranged on each whole row of tables, and an overturning cavity of a rectangular structure is arranged with a feeding opening direction wheel and is located below the accommodating opening. As a preferred implementation manner in this embodiment, the picking manipulator includes a second lateral displacement mechanism mounted on the frame, a longitudinal displacement mechanism is mounted on the second lateral displacement mechanism, a telescopic cylinder is mounted on the longitudinal displacement mechanism, a pneumatic chuck is mounted at the lower end of the telescopic cylinder, and a plurality of pneumatic clamping jaws are mounted on the pneumatic chuck. As a preferred implementation manner in this embodiment, the lifting part includes a mounting frame on which a lifting frame is movably disposed, a belt driven by a motor is mounted on the mounting frame, a side end of the mounting frame is fixed on the belt, and a plurality of placement holes adapted to the cylindrical resin material are formed in the mounting frame. As a preferred implementation manner in this embodiment, the device further includes a material pushing mechanism, configured to push the resin material in the placement hole to a certain height. As a preferred implementation manner in this embodiment, the material ejection mechanism comprises a jacking cylinder installed on the installation frame, a movable frame is installed on the output end of the jacking cylinder, a plurality of jacking rods are arranged on the movable frame in a row, the jacking rods are in one-to-one correspondence with the placing holes, through holes with the same size as the jacking rods are formed in the bottoms of the inner cavities of the placing holes, and the diameter of each through hole is smaller than that of the resin material. In summary, the utility model has the technical effects and advantages that: The resin feeding mechanism is reasonable in structure, the resin vertical discharging is adopted in the resin integral feeding structure, a manipulator is not required to be taken for overturning operation, and the resin feeding efficiency