CN-224205611-U - Wafer transmission module adjusting device and semiconductor device

CN224205611UCN 224205611 UCN224205611 UCN 224205611UCN-224205611-U

Abstract

The utility model relates to the technical field of semiconductors, and provides a wafer transmission module adjusting device and semiconductor equipment, wherein the wafer transmission module adjusting device comprises a swinging piece, a constraint component, a locking component and a linear motion component; the first end of the swinging piece is used for being in rotary connection with the linear motion assembly, the linear motion assembly is in linear motion, the constraint assembly is connected with the swinging piece and used for constraining the second end of the swinging piece to move linearly along a first direction when the swinging piece rotates around the first end, and the locking assembly is connected with the swinging piece and used for locking the position of the second end of the swinging piece along the first direction. The adjusting device can lock the adjusting height in real time so as to conveniently calibrate the positioning height and improve the positioning precision.

Inventors

ZHOU ZIJIAN
TIAN LONG
LI XIAOLONG

Assignees

重庆芯联微电子有限公司

Dates

Publication Date: 20260505
Application Date: 20250527

Claims (10)

1. The wafer transmission module adjusting device is characterized by comprising a swinging piece, a constraint component, a locking component and a linear motion component; The first end of the swinging piece is used for being rotationally connected with the linear motion assembly, and the linear motion assembly is arranged in a linear motion manner; the restraining component is connected with the swinging piece and used for restraining the second end of the swinging piece from moving linearly along the first direction when the swinging piece rotates around the first end; the locking component is connected with the swinging piece and used for locking the position of the second end of the swinging piece along the first direction.
2. The wafer transfer module adjustment apparatus of claim 1, further comprising an adjustment assembly coupled to the oscillating member, the adjustment assembly configured to drive the oscillating member in motion such that the first end of the oscillating member rotates relative to the linear motion assembly.
3. The wafer transfer module adjustment apparatus of claim 1, further comprising a distance detection assembly for detecting a linear movement distance of the linear movement assembly.
4. The wafer transport module adjustment apparatus of any one of claims 1 to 3, wherein the restraint assembly comprises a rolling member and a restraint member; the rolling piece is arranged at the second end of the swinging piece in a rolling way, and when the rolling piece rolls along the restraining piece, the second end of the swinging piece is driven to linearly move along the first direction.
5. The wafer transport module adjustment apparatus of claim 4, wherein the rolling member is a gear, the restraining member is a rack, and the rolling member is engaged with the restraining member.
6. The wafer transport module adjustment apparatus of claim 4, wherein the locking assembly comprises a locking member movably disposed on the swing member; the locking piece is in a locking state and an unlocking state when moving relative to the swinging piece; when the locking piece is in the locking state, the locking piece is in contact with the rolling piece and prevents the rolling piece from rotating relative to the swinging piece; When the locking piece is in the unlocking state, the locking piece is separated from the rolling piece, so that the rolling piece rotates relative to the swinging piece.
7. The wafer transport module adjustment apparatus of claim 6, wherein the locking assembly further comprises a driving member coupled to the locking member for driving the locking member to move to switch between the locked state and the locked state.
8. The apparatus of claim 7, wherein the distance detection assembly is in communication with or electrically connected to the driving member when the apparatus comprises the distance detection assembly.
9. The wafer transport module adjustment apparatus of claim 7, wherein the driving member is an electromagnet.
10. A semiconductor apparatus, characterized in that the semiconductor apparatus comprises the wafer transfer module adjusting device according to any one of claims 1 to 9.

Description

Wafer transmission module adjusting device and semiconductor device Technical Field The present utility model relates to the field of semiconductor technologies, and in particular, to a wafer transmission module adjusting device and a semiconductor device. Background For some semiconductor devices, preventive Maintenance (PM) is often required. For example, the lithography tool carrier transport system CARRIER HANDLER may be mechanically decoupled from the wafer transport module WAFER HANDLER when performing Preventative Maintenance (PM) or performing exception handling. After maintenance is completed, the wafer transmission module needs to be reset and installed, and in the reset and installation process, an operator needs to lift the wafer transmission module to a top end interlocking device (inter) for fixing. However, the following technical problems exist in this process: The existing lifting process of the wafer transmission module is usually to manually determine the lifting height, and in the lifting process, the real-time position locking of the wafer transmission module cannot be realized, the final position of the wafer transmission module is easy to be inaccurate, the systematic positioning deviation can cause forced triggering of an equipment safety protocol, and a carrier Height Work Calibration (HWCZ) test procedure which takes about 30 minutes must be executed, so that the effective utilization time loss of the equipment is high. Therefore, based on the above technical problems, there is a need for a wafer transmission module adjusting device and a semiconductor device to ensure the positioning accuracy of the wafer transmission module. Disclosure of utility model The utility model aims to provide a wafer transmission module adjusting device and semiconductor equipment, wherein the adjusting device can lock the adjusting height in real time so as to conveniently calibrate the positioning height and improve the positioning accuracy. The utility model provides a wafer transmission module adjusting device which comprises a swinging piece, a constraint assembly, a locking assembly and a linear motion assembly, wherein a first end of the swinging piece is in rotary connection with the linear motion assembly, the linear motion assembly is in linear motion, the constraint assembly is connected with the swinging piece and is used for constraining a second end of the swinging piece to move linearly along a first direction when the swinging piece rotates around the first end, and the locking assembly is connected with the swinging piece and is used for locking the position of the second end of the swinging piece along the first direction. In the above-mentioned wafer transmission module adjusting device, in the actual adjusting process, the second end of the swinging member faces downwards, i.e. the lower end of the swinging member moves linearly along the first direction. The first end of the swinging member faces upwards, i.e. the upper end of the swinging member is rotationally connected with the linear motion assembly. Therefore, when the swinging member is driven to swing, the height of the lower end (the second end) of the swinging member is unchanged, the upper end (the first end) of the swinging member rotates relative to the linear motion assembly, the upper end (the first end) of the swinging member synchronously moves linearly along the linear motion direction of the linear motion assembly, and at the moment, the upper end (the first end) of the swinging member synchronously drives the linear motion assembly to move linearly, so that the height adjustment of the wafer transmission module is realized. When the horizontal position of the second end (lower end) of the swinging piece along the first direction is locked, the positions of the first end (upper end) and the linear motion assembly along the linear motion direction are limited, at the moment, the vertical position of the linear motion assembly is locked, namely the vertical position of the wafer transmission module is locked, and the adjusting device can lock the adjusting height in real time, so that the adjusting height is conveniently calibrated and positioned, and the positioning precision is improved. Optionally, the wafer transmission module adjusting device further includes an adjusting component, the adjusting component is connected with the swinging component, and the adjusting component is used for driving the swinging component to move, so that the first end of the swinging component rotates relative to the linear motion component. Optionally, the wafer transmission module adjusting device further includes a distance detection component, where the distance detection component is used to detect a linear motion distance of the linear motion component. Optionally, the constraining assembly includes a rolling member and a constraining member; the rolling piece is arranged at the second end of the swinging piece in a rolling wa