CN-224205615-U - Positioning device and positioning and edge finding system for wafer

Abstract

The application relates to a wafer positioning device and a positioning edge searching system, which comprises a jacking mechanism and a rotating mechanism, wherein the rotating mechanism comprises a turntable and an adjusting motor, the adjusting motor is arranged below the turntable and used for driving the turntable to rotate, the jacking mechanism comprises a driving assembly, a jacking platform and a first adsorption device, the driving assembly is used for driving the jacking platform to lift, the jacking platform is arranged around the periphery of the turntable, and the first adsorption device comprises a plurality of sucking disc assemblies uniformly distributed on the jacking platform. The lifting platform adsorbs the lower surface of the wafer through the first adsorption device, is favorable for positioning the wafer with the warping problem, ensures the stability of the wafer in the moving process, avoids the shaking or displacement of the wafer, and improves the adaptability of the positioning device to wafers with different sizes and shapes.

Inventors

• WANG YONG
• TANG RENWEI
• XIE ZHIYIN

Assignees

• 苏州联讯仪器股份有限公司

Dates

Publication Date

20260505

Application Date

20250331

Claims (10)

1. 1. The wafer positioning device is characterized by comprising a jacking mechanism and a rotating mechanism; The rotating mechanism comprises a turntable and an adjusting motor, wherein the adjusting motor is arranged below the turntable and is used for driving the turntable to rotate; The jacking mechanism comprises a driving assembly, a jacking platform and a first adsorption device, wherein the driving assembly is used for driving the jacking platform to lift, the jacking platform is arranged around the periphery of the turntable, and the first adsorption device comprises a plurality of sucker assemblies which are uniformly distributed on the jacking platform.
2. 2. The wafer positioning device of claim 1, wherein the jacking platform comprises a first half and a second half symmetrically disposed about the periphery of the turntable, and the plurality of chuck assemblies are symmetrically disposed on the first half and the second half.
3. 3. The wafer positioning device of claim 1, wherein each of the chuck assemblies includes a movable chuck and an elastic member disposed thereunder.
4. 4. The wafer positioning device according to claim 3, wherein at least one first air passage is provided in the jacking platform, and each of the movable suction cups is communicated with a corresponding first vacuum generator through a corresponding first air passage.
5. 5. The wafer positioning device of claim 1, wherein the rotation mechanism comprises a second suction device comprising a second air passage, a second vacuum generator, and at least one suction nozzle disposed on the turntable, at least one suction nozzle in communication with the second vacuum generator through the second air passage.
6. 6. The wafer positioning device according to claim 5, wherein the second suction device includes a plurality of suction nozzles, and the plurality of suction nozzles are uniformly distributed along the circumference of the turntable.
7. 7. The wafer positioning device of claim 5, wherein the second air passage is disposed within an output shaft of the adjustment motor.
8. 8. The wafer positioning device according to claim 3, wherein after the lifting mechanism drives the wafer to contact with the rotating mechanism and to be connected, the lifting mechanism further descends to a first position, and in the first position, an upper surface of the movable chuck is lower than an upper surface of the turntable.
9. 9. A wafer positioning and edge searching system, which is characterized by comprising the positioning device and an auxiliary edge searching mechanism as claimed in any one of claims 1-8; The auxiliary edge searching mechanism comprises an edge camera, wherein the edge camera is arranged above the side of the turntable of the positioning device and is used for shooting images with the edges of the wafers, and the auxiliary edge searching mechanism is electrically connected with the adjusting motor of the positioning device and the edge camera respectively.
10. 10. The wafer positioning and edge-seeking system as in claim 9, wherein the auxiliary edge-seeking mechanism comprises a reflector plate disposed below a side of the turntable for cooperating with the edge camera to form a wafer edge imaging optical path.

Description

Positioning device and positioning and edge finding system for wafer Technical Field The application relates to the technical field of wafer testing, in particular to a wafer positioning device and a positioning and edge-seeking system. Background In the aging test process of the wafer, feeding is an important link. In order to ensure that the wafer can be accurately and stably loaded into the burn-in fixture, a special positioning device is required. The storage positions of the wafers in the storage bins are different, so that the positions of the wafers are difficult to control accurately in the feeding process, and the wafers are easy to shift in the feeding and positioning processes. The positioning device in the prior art is difficult to stably and accurately position the wafer, the subsequent testing precision of the wafer is affected, and the wafer is possibly damaged. Disclosure of utility model In order to solve the problems that the positioning device in the prior art is difficult to stably and accurately position the wafer, the subsequent testing precision of the wafer is affected, and the wafer is possibly damaged. The application provides a wafer positioning device, which comprises a jacking mechanism and a rotating mechanism; The rotating mechanism comprises a turntable and an adjusting motor, wherein the adjusting motor is arranged below the turntable and is used for driving the turntable to rotate; The jacking mechanism comprises a driving assembly, a jacking platform and a first adsorption device, wherein the driving assembly is used for driving the jacking platform to lift, the jacking platform is arranged around the periphery of the turntable, and the first adsorption device comprises a plurality of sucker assemblies which are uniformly distributed on the jacking platform. Further, the jacking platform comprises a first half table and a second half table which are symmetrically arranged on the periphery of the turntable, and the sucker assemblies are symmetrically arranged on the first half table and the second half table. Further, each sucker assembly comprises a movable sucker and an elastic piece arranged below the movable sucker. Further, at least one first air passage is arranged in the jacking platform, and each movable sucker is communicated with a corresponding first vacuum generator through a corresponding first air passage. Further, the rotating mechanism comprises a second adsorption device, the second adsorption device comprises a second air passage, a second vacuum generator and at least one suction nozzle, at least one suction nozzle is arranged on the rotary table, and at least one suction nozzle is communicated with the second vacuum generator through the second air passage. Further, the second adsorption device comprises a plurality of suction nozzles, and the suction nozzles are uniformly distributed along the circumferential direction of the turntable. Further, the second air passage is arranged in the output shaft of the adjusting motor. Further, when the lifting mechanism drives the wafer to contact with the rotating mechanism and to be connected, the lifting mechanism further descends to a first position, and in the first position, the upper surface of the movable sucker is lower than the upper surface of the turntable. The application also provides a wafer positioning and edge searching system, which comprises the positioning device and an auxiliary edge searching mechanism; the positioning device comprises a rotating mechanism, wherein the rotating mechanism comprises a turntable and an adjusting motor; The auxiliary edge searching mechanism comprises an edge camera, wherein the edge camera is arranged above the side of the turntable of the positioning device and is used for shooting images with the edges of the wafers, and the auxiliary edge searching mechanism is electrically connected with the adjusting motor of the positioning device and the edge camera respectively. Further, the auxiliary edge finding mechanism comprises a reflecting plate, and the reflecting plate is arranged below the side of the turntable and is used for being matched with the edge camera to form a wafer edge imaging light path. The embodiment of the application has the following beneficial effects: The lifting mechanism and the rotating mechanism of the positioning device are matched to realize high-precision positioning of the wafer. The jacking platform surrounds the periphery of the turntable, and the first adsorption devices are uniformly distributed on the jacking platform. When the lifting platform ascends to receive the wafer, the lower surface of the wafer can be adsorbed through the first adsorption device, positioning of the wafer with the warping problem is facilitated, stability of the wafer in the moving process is ensured, shaking or displacement of the wafer is avoided, and adaptability of the positioning device to wafers with different sizes and shapes is improved. The jac