CN-224205622-U - Clamping jig and chip mounting equipment

CN224205622UCN 224205622 UCN224205622 UCN 224205622UCN-224205622-U

Abstract

The application relates to a clamping jig and chip mounting equipment, the clamping jig comprises a mounting plate, a movable assembly, a first magnetic piece and a second magnetic piece. The mounting plate comprises a mounting part and a connecting part, wherein the mounting part is provided with a mounting groove for placing a semiconductor device, the movable component is arranged on the connecting part and can move along a first direction to be close to or far away from the semiconductor device, when the movable component moves to a preset position, the movable component is abutted against the side wall of the semiconductor device, the first magnetic component is arranged on the mounting plate, the second magnetic component is arranged on the movable component, and when the movable component moves to the preset position, the first magnetic component and the second magnetic component are attracted to enable the relative positions of the movable component and the mounting plate to be fixed. The upper surface and the lower surface of the semiconductor device are not damaged when the semiconductor device is fixed through the movable component, the semiconductor device is not shielded, the chip mounting equipment is convenient to process, the movable component is fixed through the magnetic component, an additional circuit is not required, and the size of the clamping jig is effectively reduced.

Inventors

TANG YITAO
TAN JIEMING
TIAN ZEJUN
LI BOYANG

Assignees

珠海市硅酷科技有限公司

Dates

Publication Date: 20260505
Application Date: 20250507

Claims (10)

1. A clamping jig, characterized by comprising: The mounting plate comprises a mounting part and a connecting part, wherein the mounting part is provided with a mounting groove for placing a semiconductor device; The movable assembly is arranged on the connecting part and can move along a first direction to approach or separate from the semiconductor device arranged in the mounting groove, and when the movable assembly moves to a preset position, the movable assembly is used for abutting against the side wall of the semiconductor device so as to limit the semiconductor device to the mounting groove; The first magnetic piece and the second magnetic piece are arranged on the mounting plate, the second magnetic piece is arranged on the movable assembly, and when the movable assembly moves to the preset position, the first magnetic piece and the second magnetic piece are attracted to enable the relative positions of the movable assembly and the mounting plate to be fixed.
2. The clamping jig according to claim 1, wherein the movable assembly includes a movable plate movably connected to the connection portion and movable in the first direction with respect to the mounting plate, and a spring post having one end connected to the movable plate and the other end for abutting against a side wall of the semiconductor device when the movable assembly moves to a predetermined position.
3. The clamping jig of claim 2, wherein the mounting portion and the connecting portion are on a same side of the mounting plate, the mounting portion having first and second opposite sides in the first direction, the mounting slot extending through the mounting portion in the first direction; The movable assembly is characterized by further comprising a positioning baffle, wherein the side wall of the positioning baffle is abutted against the first side surface, and when the movable assembly moves to the preset position, the movable plate is abutted against the second side surface.
4. The clamping jig of claim 3, wherein a plurality of mounting slots are provided, the plurality of mounting slots being arranged side by side.
5. The clamping jig according to claim 2, wherein the connecting portion is provided with a sliding groove, the movable plate is provided in the sliding groove, the thickness direction of the movable plate has a first surface and a second surface which are opposite, and the first surface is flush with the surface of the mounting portion provided with the mounting groove.
6. The clamping jig according to claim 5, wherein the connecting portion is provided with a guide rail provided along the first direction, and the movable plate is slidably connected with the guide rail.
7. The clamping jig of claim 2, wherein the second magnetic member comprises a magnetic plate provided on a side of the movable plate opposite to the mounting portion.
8. The clamping jig according to claim 7, wherein a push-pull groove is formed in a side surface of the movable plate opposite to the mounting portion, and the magnetic plate and an inner side wall of the push-pull groove enclose a push-pull hole.
9. The clamping jig according to claim 1, wherein the bottom wall of the mounting groove is provided with a vacuum suction hole.
10. A chip mounting apparatus comprising the clamping jig according to any one of claims 1 to 9.

Description

Clamping jig and chip mounting equipment Technical Field The application relates to the technical field of semiconductor device processing, in particular to a clamping jig and chip mounting equipment. Background With the development of semiconductor technology, a chip mounting process has emerged, in which a chip-like semiconductor device such as a chip needs to be placed at a designated position of a jig. The semiconductor device is fed along with the movement of the jig, so that the semiconductor device is subjected to related treatment processing by matching with processing elements such as a spray head or a sucker at a fixed position, the automatic production is realized, and the production efficiency is improved. In the related art, a groove for placing a semiconductor device is formed in a jig, and the semiconductor device is placed in the groove for simple fixation, so that the semiconductor device is ensured not to deviate or fall in the processing process. Some jigs are pressed against the surface edge of the semiconductor device by a pre-fixing device (such as a pressing plate, etc.) to fix the semiconductor device, ensuring that the semiconductor device remains stable during processing, and the pre-fixing device is usually adjusted and fixed by an electrical control. Some jigs do not include a pre-fixing device, and the semiconductor device is directly placed inside the slot, and is limited by the inner wall of the slot. However, the manner in which the pre-fixing means is not provided restricts the semiconductor device only by the groove position, and the restricting effect of this manner is poor, and the semiconductor device is liable to shift or fall during the movement or processing of the semiconductor device. The force for pressing the semiconductor device is not easy to control in a mode that the pre-fixing device presses the edge of the semiconductor device, and the upper surface of the semiconductor device is easy to damage due to the fact that the main functions of the semiconductor device are achieved through the upper surface and the lower surface, so that the yield is reduced. In addition, the pre-fixing device is generally fixed in an electric control mode, and an additional circuit is required, so that the internal structure of the jig is complex, and the space occupation is large. Disclosure of utility model Accordingly, it is necessary to provide a clamping jig and a die attach apparatus which are less likely to damage the semiconductor device and occupy a smaller space, in order to solve the problem that the semiconductor device and the jig occupy a larger space when the semiconductor device is fixed. In one aspect, the present application provides a clamping jig, comprising: The mounting plate comprises a mounting part and a connecting part, wherein the mounting part is provided with a mounting groove for placing a semiconductor device; The movable assembly is arranged on the connecting part and can move along a first direction to approach or separate from the semiconductor device arranged in the mounting groove, and when the movable assembly moves to a preset position, the movable assembly is used for abutting against the side wall of the semiconductor device so as to limit the semiconductor device to the mounting groove; The first magnetic piece and the second magnetic piece are arranged on the mounting plate, the second magnetic piece is arranged on the movable assembly, and when the movable assembly moves to the preset position, the first magnetic piece and the second magnetic piece are attracted to enable the relative positions of the movable assembly and the mounting plate to be fixed. In some embodiments, the movable assembly includes a movable plate movably connected to the connection portion and capable of moving along the first direction relative to the mounting plate, and a spring post having one end connected to the movable plate and having another end for abutting against a sidewall of the semiconductor device when the movable assembly moves to a predetermined position. In some embodiments, the mounting portion and the connecting portion are located on a same side of the mounting plate, the mounting portion having first and second sides opposite each other in the first direction, the mounting slot extending through the mounting portion in the first direction; The movable assembly is characterized by further comprising a positioning baffle, wherein the side wall of the positioning baffle is abutted against the first side surface, and when the movable assembly moves to the preset position, the movable plate is abutted against the second side surface. In some embodiments, a plurality of mounting grooves are formed, and a plurality of mounting grooves are arranged side by side. In some embodiments, the connecting portion is provided with a sliding groove, the movable plate is arranged in the sliding groove, the thickness direction of the movable plate is provided with