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CN-224205623-U - Grabbing clamping jaw for SMIF wafer carrier

CN224205623UCN 224205623 UCN224205623 UCN 224205623UCN-224205623-U

Abstract

The utility model discloses a grabbing clamping jaw for an SMIF wafer carrier, which comprises a clamping jaw bottom plate, wherein one end of the clamping jaw bottom plate is provided with a positioning groove for positioning the SMIF wafer carrier, one end of the clamping jaw bottom plate is also provided with a pressure detection module, the other end of the clamping jaw bottom plate is provided with a camera fixing bracket, and the camera fixing bracket is sequentially provided with a light supplementing lamp and a depth camera which are obliquely downward from top to bottom.

Inventors

  • ZHANG GUINA
  • GAO BOYANG

Assignees

  • 北京知形科技有限公司

Dates

Publication Date
20260505
Application Date
20250509

Claims (9)

  1. 1. The utility model provides a snatch clamping jaw for SMIF wafer carrier, includes clamping jaw bottom plate (2), its characterized in that, constant head tank (2 a) that is used for fixing a position SMIF wafer carrier (1) have been seted up to one end of clamping jaw bottom plate (2), one end of clamping jaw bottom plate (2) still has pressure detection module, camera fixed bolster (10) are installed to the other end of clamping jaw bottom plate (2), install light filling lamp (4) and depth camera (5) down in proper order from top to bottom on camera fixed bolster (10).
  2. 2. A gripping jaw for SMIF wafer carriers according to claim 1, characterized in that the other end of the jaw base plate (2) is further provided with a cover (3) with a notch, and the notch is next to the camera fixing bracket (10).
  3. 3. The grabbing clamping jaw for the SMIF wafer carrier according to claim 2, wherein a reinforcing rib plate (7) is further connected between the cover body (3) and the clamping jaw bottom plate (2).
  4. 4. The grabbing clamping jaw for the SMIF wafer carrier according to claim 1, wherein the pressure detection module comprises a piezoelectric sensor (9), a sensor mounting base (8) and a sensor pressure pin (6), the sensor pressure pin (6) is slidably mounted at one end of the clamping jaw base plate (2), the piezoelectric sensor (9) is mounted at one end of the clamping jaw base plate (2) through the sensor mounting base (8), and the piezoelectric sensor (9) is located right below the sensor pressure pin (6).
  5. 5. A gripping jaw for SMIF wafer carriers according to claim 4, characterized in that the sensor pressure pins (6) are arranged at the detent (2 a).
  6. 6. The grabbing clamping jaw for the SMIF wafer carrier according to claim 2, wherein the cover body (3) comprises an upper panel (3 a), a front vertical plate (3 b) and left and right vertical plates (3 c), the upper ends of the front vertical plate (3 b) and the left and right vertical plates (3 c) are connected with the upper panel (3 a), the lower ends of the front vertical plate (3 b) and the left and right vertical plates (3 c) are connected with the clamping jaw bottom plate (2), the left and right vertical plates (3 c) are hollow frame bodies, and a shell (3 d) with a heat dissipation hole part is further installed between the left and right vertical plates (3 c).
  7. 7. A gripping jaw for SMIF wafer carriers according to claim 6, characterized in that the jaw base plate (2) is made of a high strength aluminium alloy material or stainless steel material.
  8. 8. A gripping jaw for SMIF wafer carriers according to claim 6, characterized in that the front riser (3 b) is made of lightweight material.
  9. 9. A gripping jaw for SMIF wafer carriers according to claim 6, wherein the left and right side uprights (3 c) are made of a high strength material.

Description

Grabbing clamping jaw for SMIF wafer carrier Technical Field The utility model belongs to the technical field of SMIF wafer carriers, and relates to a grabbing clamping jaw for an SMIF wafer carrier. Background In the field of semiconductor manufacturing today, with the rapid development of integrated circuit technology, the production and transportation of wafers is increasingly demanding in terms of precision, efficiency and cleanliness. SMIF (Standard Mechanical Interface) systems are widely used in semiconductor manufacturing facilities as an advanced wafer transfer and storage solution to ensure efficient and clean transfer of wafers between different process tools. One of the core components of the SMIF system is a wafer carrier that is used to load and protect wafers from contamination and damage during transport. The wafer carrier gripping jaw is a key component for realizing the precise transport of the wafer carrier in the SMIF system. The existing wafer carrier grabbing clamping jaw in the current market can meet basic carrying requirements to a certain extent, but has a plurality of defects. Firstly, the grabbing precision of the traditional clamping jaw is limited, the traditional clamping jaw is difficult to adapt to wafer carriers with different sizes, shapes and weights, position deviation easily occurs in the grabbing process, faults occur when the wafer carriers are in butt joint with equipment, and production efficiency is affected. Secondly, the structure of current clamping jaw is complicated, and spare part is numerous, and wearing and tearing and trouble appear easily after long-time the use, and cost of maintenance is higher, has increased the operation burden of enterprise. In addition, partial clamping jaws can damage the wafer carrier due to uneven pressure distribution applied to the surface of the wafer carrier during the grabbing process, thereby affecting the safety of the wafer. Along with the continuous upgrading of the semiconductor manufacturing process, the wafer size is gradually increased, and the performance requirement on the wafer carrier grabbing clamping jaw is correspondingly improved. Therefore, the grabbing clamping jaw for the SMIF wafer carrier has the characteristics of higher grabbing precision, more stable structure, more uniform pressure distribution and easier maintenance, and has very important significance for improving the automation level of the semiconductor manufacturing process, reducing the production cost and improving the product quality. Disclosure of Invention In order to solve the defects in the prior art, the utility model provides a grabbing clamping jaw for a SMIF wafer carrier. In order to achieve the above purpose, the technical scheme of the utility model is that the grabbing clamping jaw for the SMIF wafer carrier comprises a clamping jaw bottom plate, and is characterized in that one end of the clamping jaw bottom plate is provided with a positioning groove for positioning the SMIF wafer carrier, one end of the clamping jaw bottom plate is also provided with a pressure detection module, the other end of the clamping jaw bottom plate is provided with a camera fixing support, and the camera fixing support is sequentially provided with a light supplementing lamp and a depth camera which are inclined downwards from top to bottom. The other end of the clamping jaw bottom plate is also provided with a cover body with a notch, and the notch is close to the camera fixing support. And a reinforcing rib plate is further connected between the cover body and the clamping jaw bottom plate. The pressure detection module comprises a piezoelectric sensor, a sensor mounting base and a sensor pressure pin, wherein the sensor pressure pin is slidably mounted at one end of the clamping jaw bottom plate, the piezoelectric sensor is mounted at one end of the clamping jaw bottom plate through the sensor mounting base, and the piezoelectric sensor is located under the sensor pressure pin. The sensor pressure pin is arranged at the positioning groove. The cover body comprises an upper panel, a front vertical plate and left and right vertical plates, wherein the upper ends of the front vertical plate and the left and right vertical plates are connected with the upper panel, the lower ends of the front vertical plate and the left and right vertical plates are connected with a clamping jaw bottom plate, the left and right vertical plates are hollow frame bodies, and a shell with a heat dissipation hole part is further arranged between the left and right vertical plates. The clamping jaw bottom plate is made of a high-strength aluminum alloy material or a stainless steel material. The front vertical plate is made of lightweight materials. The left and right side vertical plates are made of high-strength materials. By adopting the technical scheme, the utility model has the beneficial effects that: the utility model integrates various advanced sensors, including a