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CN-224205631-U - Vacuum chuck device suitable for multiple wafer sizes

CN224205631UCN 224205631 UCN224205631 UCN 224205631UCN-224205631-U

Abstract

The utility model provides a vacuum chuck device suitable for various wafer sizes, which comprises an upper part chuck body and a lower part chuck body, wherein the bottom surface of the upper part chuck body is fixed on the top surface of the lower part chuck body, the upper part chuck body comprises an outer O-shaped rubber ring, a middle O-shaped rubber ring, an inner O-shaped rubber ring and a metal surface, the outer O-shaped rubber ring, the middle O-shaped rubber ring and the inner O-shaped rubber ring are all concentrically fixed on the top surface of the metal surface, a plurality of air holes are arranged on the metal surface along the inner O-shaped rubber ring, a plurality of fan ring grooves are arranged on the metal surface between the middle O-shaped rubber ring and the outer O-shaped rubber ring, air holes are arranged in the fan ring grooves, and a connecting hole is formed in the center of the bottom surface of the lower part chuck body. The utility model uses a plurality of O-shaped rubber rings for adsorption, the wafer is not in direct contact with the metal surface, the probability of breaking the wafer is reduced, and the utility model is applicable to wafers with different sizes.

Inventors

  • HU XIAOWEI
  • CHEN LING
  • YE WEIQIANG

Assignees

  • 南京美赫半导体设备有限公司

Dates

Publication Date
20260505
Application Date
20250521

Claims (6)

  1. 1. The vacuum chuck device suitable for various wafer sizes is characterized by comprising an upper chuck body (1) and a lower chuck body (7), wherein the bottom surface of the upper chuck body (1) is fixed on the top surface of the lower chuck body (7), the upper chuck body (1) comprises an outer O-shaped rubber ring (2), a middle O-shaped rubber ring (3), an inner O-shaped rubber ring (4) and a metal surface (5), the outer O-shaped rubber ring (2), the middle O-shaped rubber ring (3) and the inner O-shaped rubber ring (4) are all concentrically fixed on the top surface of the metal surface (5), a plurality of air holes (6) are arranged in the metal surface (5) along the inner O-shaped rubber ring (4), a plurality of ring grooves (11) are formed in the metal surface (5) between the middle O-shaped rubber ring (3) and the outer O-shaped rubber ring (2), air holes (6) are formed in the ring grooves (11), and connecting holes (9) are formed in the center of the bottom surface of the lower chuck body (7).
  2. 2. The vacuum chuck device for multiple wafer sizes according to claim 1, wherein the fan ring grooves (11) are arranged along the circumferential direction of the outer O-shaped rubber ring (2), rectangular strips (12) are arranged between the adjacent fan ring grooves (11), and the top surface height of each rectangular strip (12) does not exceed the top surface height of the outer O-shaped rubber ring (2) or the middle O-shaped rubber ring (3).
  3. 3. The vacuum chuck device for multiple wafer sizes according to claim 1, wherein circular grooves (21) are formed in the tops of the outer O-shaped rubber ring (2), the middle O-shaped rubber ring (3) and the inner O-shaped rubber ring (4), and the inner O-shaped rubber ring (4) is in a protruding cylindrical shape.
  4. 4. The vacuum chuck device for multiple wafer sizes according to claim 1, wherein a plurality of fan-shaped grooves (71) are formed in the bottom of the lower chuck body (7), a plurality of air holes (6) formed in the metal surface (5) and arranged along the inner O-shaped rubber ring (4) penetrate through the bottom surface of the fan-shaped grooves (71), a plurality of reinforcing ribs (8) are fixed at the bottom of the lower chuck body (7), and no-thread fixing holes (81) and thread fixing holes (82) are formed in the bottom of the reinforcing ribs (8).
  5. 5. The vacuum chuck device for various wafer sizes as set forth in claim 1, wherein the air hole (6) in the fan ring groove (11) is close to the outer O-shaped rubber ring (2), and the outer diameter of the lower chuck body (7) is smaller than the distance between the innermost side of the air hole (6) in the fan ring groove (11) and the center of the upper chuck body (1).
  6. 6. A vacuum chuck assembly for multiple wafer sizes as set forth in claim 4 wherein said scallop grooves (71) are circumferentially aligned with the middle O-ring (3) and said metal surfaces (5) are positioned at the tips of the scallop grooves (71) along a plurality of air holes (6) aligned with the inner O-ring (4).

Description

Vacuum chuck device suitable for multiple wafer sizes Technical Field The utility model relates to the technical field of semiconductor wafer detection equipment, in particular to a vacuum chuck device suitable for various wafer sizes. Background In the wafer detection process, the wafer needs to be flatly adsorbed on the wafer clamp at the ultrahigh rotating speed so as to provide the defect bad problem that the wafer is rapidly detected at the ultrahigh rotating speed, in the prior art, the wafer clamp has small sucker size, uneven air hole distribution or processing errors, centrifugal force oscillation is caused, the contact surface of the wafer and the sucker generates relative displacement, edge fragmentation is caused, and all wafers cannot be adapted. Disclosure of Invention In view of the above, the present utility model provides a vacuum chuck apparatus suitable for various wafer sizes. The vacuum chuck device suitable for various wafer sizes comprises an upper chuck body and a lower chuck body, wherein the bottom surface of the upper chuck body is fixed on the top surface of the lower chuck body, the upper chuck body comprises an outer O-shaped rubber ring, a middle O-shaped rubber ring, an inner O-shaped rubber ring and a metal surface, the outer O-shaped rubber ring, the middle O-shaped rubber ring and the inner O-shaped rubber ring are concentrically fixed on the top surface of the metal surface, a plurality of air holes are arranged on the metal surface along the inner O-shaped rubber ring, a plurality of fan ring grooves are formed in the metal surface between the middle O-shaped rubber ring and the outer O-shaped rubber ring, air holes are formed in the fan ring grooves, and a connecting hole is formed in the center of the bottom surface of the lower chuck body. Preferably, the fan ring grooves are arranged along the circumferential direction of the outer O-shaped rubber ring, rectangular strips are arranged between the adjacent fan ring grooves, and the top surface height of each rectangular strip is not more than the top surface height of the outer O-shaped rubber ring or the middle O-shaped rubber ring. Preferably, circular grooves are formed in the tops of the outer O-shaped rubber ring, the middle O-shaped rubber ring and the inner O-shaped rubber ring, and the inner O-shaped rubber ring is in a protruding cylindrical shape. Preferably, the bottom of the lower sucker body is provided with a plurality of fan-shaped grooves, a plurality of air holes formed in the metal surface along the inner O-shaped rubber ring penetrate through the bottom surfaces of the fan-shaped grooves, a plurality of reinforcing ribs are fixed at the bottom of the lower sucker body, and unthreaded fixing holes and threaded fixing holes are formed in the bottom of the reinforcing ribs. Preferably, the air hole in the fan ring groove is close to the external O-shaped rubber ring, and the outer diameter of the lower sucker body is smaller than the distance between the innermost side of the air hole in the fan ring groove and the center of the upper sucker body. Preferably, the fan-shaped groove is arranged along the circumferential direction of the middle O-shaped rubber ring, and a plurality of air holes of the metal surface arranged along the inner O-shaped rubber ring are positioned at the tip of the fan-shaped groove. Compared with the prior art, the novel air hole type rubber ring has the advantages that the novel air hole type rubber ring has good elasticity and wear resistance, can adapt to objects with different shapes and surfaces, plays a supporting and adsorbing role, does not directly contact a wafer with a metal surface, reduces the wafer breaking probability, is suitable for wafers with different sizes, has the functions of adsorbing and radiating, simultaneously provides a ventilation path for internal components, and is used for reducing the overall weight and dynamic balance, facilitating local maintenance, avoiding material waste, adopting a single air path design, having simpler structure, reducing the number of components such as pipelines, valves and the like, and reducing the complexity of manufacturing and installation. Drawings Fig. 1 is a top view of a vacuum chuck apparatus of the present utility model adapted for use with a variety of wafer sizes. Fig. 2 is a bottom view of a vacuum chuck apparatus of the present utility model adapted for use with a variety of wafer sizes. Figure 3 is a side view of a vacuum chuck apparatus of the present utility model adapted for use with a variety of wafer sizes. Figure 4 is a cross-sectional view of A-A of the vacuum chuck apparatus of the present utility model adapted for use with a variety of wafer sizes. Figure 5 is a cross-sectional view of a B-B view of a vacuum chuck apparatus of the present utility model adapted for use with a variety of wafer sizes. Figure 6 is a C-C cross-sectional view of a vacuum chuck apparatus of the present utility model a