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CN-224205636-U - Die bonding mechanism and die bonding equipment

CN224205636UCN 224205636 UCN224205636 UCN 224205636UCN-224205636-U

Abstract

The utility model relates to the technical field of die bonders, in particular to a die bonder, which comprises an adjusting component, wherein a ZR motor is fixed on the adjusting component, a die bonder arm is fixed at the output end position of the ZR motor, the output end of the ZR motor drives the die bonder arm to move in the vertical direction, an adsorption component is rotatably arranged on the die bonder arm, the output end of the ZR motor drives the adsorption component to rotate on the die bonder arm, the vertical movement of the die bonder arm and the rotation of the adsorption component can be simultaneously driven by the ZR motor, the integral structure of the die bonder is simplified, the mechanical inertia is reduced, the vertical position of the die bonder arm and the rotation angle of the adsorption component can be controlled more accurately, the positioning of a wafer in the adsorption, transfer and placement processes is more accurate, the quality of die bonder and the yield of products are improved, the adjusting component can finely adjust the position of the adsorption component connected with the ZR motor, different die bonder process requirements and working scenes are met, and the die bonder has stronger universality and flexibility.

Inventors

  • HUANG XINYUAN
  • Wan Aomei
  • YE JIAHAO

Assignees

  • 深圳市万福达智能装备有限公司

Dates

Publication Date
20260505
Application Date
20250421

Claims (10)

  1. 1. A die bonding mechanism, comprising: An adjustment assembly (10); A ZR motor (20), the ZR motor (20) being fixed to the adjustment assembly (10); The die bonding arm (30), the die bonding arm (30) is fixed at the output end position of the ZR motor (20), and the output end of the ZR motor (20) drives the die bonding arm (30) to move in the vertical direction; the adsorption component (40) is rotatably mounted on the die bonding arm (30), and the output end of the ZR motor (20) drives the adsorption component (40) to rotate on the die bonding arm (30).
  2. 2. The die bonding mechanism according to claim 1, wherein the die bonding arm (30) is provided with a cross roller guide rail (31), the cross roller guide rail (31) is vertically arranged, and the cross roller guide rail (31) and the adjusting assembly (10) form a sliding fit.
  3. 3. The die bonding mechanism according to claim 2, wherein the suction assembly (40) comprises a suction nozzle (41), and an upper end of the suction nozzle (41) is communicated with a suction port of the negative pressure suction unit through a pipeline.
  4. 4. A die bonding mechanism according to claim 3, wherein the die bonding arm (30) is integrally formed in a right-angle folded plate-shaped structure, the cross roller guide rail (31) is fixed on a vertical section of the die bonding arm (30), and the adsorption assembly (40) is rotatably mounted on a horizontal section of the die bonding arm (30).
  5. 5. The die bonding mechanism according to claim 4, wherein the suction nozzle (41) is integrally tubular and vertically arranged, a pipe body of the suction nozzle (41) is rotatably mounted on the die bonding arm (30) through a first bearing (42), a sealing ring (411) is arranged at the upper end of the suction nozzle (41), an upper cover (32) is arranged on the die bonding arm (30), an air passage channel is arranged on the upper cover (32), the sealing ring (411) abuts against one end of the air passage channel, an air nozzle (321) is arranged at the other end of the air passage channel, and the air nozzle (321) is communicated with an adsorption port of the negative pressure adsorption unit.
  6. 6. The die bonding mechanism according to claim 5, wherein a first synchronous pulley (21) is arranged at the output end of the ZR motor (20), a second synchronous pulley (412) is arranged on the pipe body of the suction nozzle (41), and the first synchronous pulley (21) and the second synchronous pulley (412) are connected through a synchronous belt.
  7. 7. The die bonding mechanism according to claim 5, wherein the output end of the ZR motor (20) is provided with a second bearing (22), and the second bearing (22) is rotatably disposed on the die bonding arm (30).
  8. 8. The die bonding mechanism according to claim 7, wherein the second bearing (22) is rotatably disposed on a bearing block (23), and the bearing block (23) is fixed on the die bonding arm (30).
  9. 9. The die bonding mechanism according to claim 4, wherein the adjustment assembly (10) comprises a base fixing plate (11), a front and rear adjusting plate (12) is arranged on the base fixing plate (11), a motor fixing plate (13) is arranged on the front and rear adjusting plate (12), a mounting plate (14) is arranged on the motor fixing plate (13), the ZR motor (20) is mounted on the motor fixing plate (13), and a vertical section of the die bonding arm (30) is fixed on the mounting plate (14).
  10. 10. A die bonding apparatus comprising the die bonding mechanism of any one of claims 1 to 9.

Description

Die bonding mechanism and die bonding equipment Technical Field The utility model relates to the technical field of die bonders, in particular to a die bonder and die bonder equipment. Background The die bonding is also called chip mounting, and the die bonding is used for bonding a wafer to a designated area of a bracket through colloid to form a thermal path or an electric path, so as to provide conditions for subsequent wire bonding connection, and is mainly used for various suction nozzles, ejector pins, dispensing heads, porcelain nozzles, pins, motors, carbon brushes, encoders, transmission belts, various parts of automatic manipulators, instruments and meters and the like of various gold wire ultrasonic welding equipment. Die bonding is a critical process for precisely fixing a wafer at a specific position on a substrate, and has extremely high performance requirements on a die bonding mechanism. At present, a plurality of problems to be solved urgently are exposed when a crystal fixing mechanism adopted by most crystal fixing equipment in the market is used for realizing the adsorption and transportation functions of wafers. For motion implementation, conventional designs rely on multiple independent mechanisms to work cooperatively to achieve the necessary vertical and rotational motion of the die attach mechanism. It is common practice to provide separate motors and to transmit and convert power by means of mechanical conversion means such as screws, gears, etc. The complex structural design not only greatly increases the number of parts of the whole die bonding mechanism, but also greatly complicates assembly and debugging work among the parts, and the integral performance of the mechanism can be affected by deviation of any link. In terms of operating efficiency and accuracy, excessive mechanical components mean greater mechanical inertia and motion errors. In the die bonding process, when starting, stopping or changing the motion direction each time, mechanical inertia can lead to the response speed of the die bonding mechanism to be slow, and quick and accurate adsorption and transportation operation is difficult to realize. Moreover, the fit clearance among a plurality of mechanical components and the accumulation of machining precision errors seriously affect the positioning precision of the die bonding mechanism. The current situation of low speed and low precision directly restricts the whole productivity and product quality of the die bonder, and is difficult to meet the urgent requirements of the current semiconductor industry on high-efficiency and high-precision die bonding technology. In summary, the existing die bonding mechanism has drawbacks in terms of structural design, cost control, operation speed and precision, etc., which have become bottlenecks for preventing the performance improvement and industry development of the die bonding machine, and an innovative die bonding mechanism design is needed to overcome the dilemma. Disclosure of utility model The utility model aims to provide a die bonding mechanism and die bonding equipment, which aim to solve the defects in structural design, cost control, running speed, precision and the like in the problems, so as to improve the integration level and the precision of the die bonding mechanism and ensure the precision of die bonding. The technical scheme adopted in the utility model is as follows: A die attach mechanism comprising: An adjustment assembly; the ZR motor is fixed on the adjusting component; The die bonding arm is fixed at the output end position of the ZR motor, and the output end of the ZR motor drives the die bonding arm to move in the vertical direction; and the adsorption component is rotatably installed on the die bonding arm, and the output end of the ZR motor drives the adsorption component to rotate on the die bonding arm. The utility model also has the following technical characteristics: In an embodiment of the present utility model, the die attach arm is provided with a cross roller guide rail, the cross roller guide rail is vertically arranged, and the cross roller guide rail and the adjustment assembly form a sliding fit. In an embodiment of the present utility model, the suction assembly includes a suction nozzle, and an upper end of the suction nozzle is communicated with a suction port of the negative pressure suction unit through a pipeline. In an embodiment of the utility model, the die bonding arm is integrally in a right-angle folded plate structure, the crossed roller guide rail is fixed on a vertical section of the die bonding arm, and the adsorption component is rotatably mounted on a horizontal section of the die bonding arm. In an embodiment of the utility model, the whole suction nozzle is tubular and vertically arranged, the pipe body of the suction nozzle is rotatably arranged on the die bonding arm through a first bearing, the upper end of the suction nozzle is provided with a sealing ring, t