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CN-224205640-U - Die-casting box radiator, inverter and photovoltaic system

CN224205640UCN 224205640 UCN224205640 UCN 224205640UCN-224205640-U

Abstract

The utility model discloses a die-casting box radiator, an inverter and a photovoltaic system, wherein the die-casting box radiator (100) comprises a substrate (10) and a first boss (30), the substrate (10) is provided with an IGBT power module (20), one surface of the IGBT power module (20) is arranged in the substrate (10), the other surface of the IGBT power module is attached to the substrate (20), the first boss (30) is provided with a first thickness, the first boss (30) is arranged on the substrate (10) corresponding to the IGBT power module (20), the first boss (30) lifts the IGBT power module (20), the thickness of the position of the substrate (10) where the IGBT power module (20) is arranged is increased, heat generated when the IGBT power module (20) works is radiated better, and the substrate (10) and the first boss (30) are integrally die-cast. The utility model maintains the characteristics of small volume and portability of the die-casting box radiator, and ensures that the radiating effect is optimal, the cost is lower and the competitive power is higher.

Inventors

  • PENG ZHIQUAN
  • HE JINJIN

Assignees

  • 深圳市盛能杰科技有限公司

Dates

Publication Date
20260505
Application Date
20250610

Claims (10)

  1. 1. A die-cast box radiator (100), characterized by comprising A substrate (10), wherein the substrate (10) is provided with an IGBT power module (20), the substrate (10) is provided with two opposite surfaces, and the IGBT power module (20) is arranged on one surface of the substrate (10); a first boss (30), wherein the first boss (30) has a first thickness, the first boss (30) is arranged on the substrate (10) corresponding to the IGBT power module (20), the first boss (30) lifts the IGBT power module (20) and increases the thickness of the position of the IGBT power module (20) on the substrate (10); the base plate (10) and the first boss (30) are integrally molded by die casting.
  2. 2. The die-cast case radiator (100) according to claim 1, wherein the first boss (30) protrudes toward the front surface of the substrate (10) where the IGBT power module (20) is provided, and the first boss (30) covers an IGBT mounting area (21) where the IGBT power module (20) is located.
  3. 3. The die-cast case radiator (100) according to claim 2, wherein the area of the first boss (30) is larger than the area of the IGBT mounting region (21), and the periphery of the first boss (30) is outside the periphery of the IGBT mounting region (21), and/or, The first thickness is not less than 2.4mm and not greater than 2.6mm.
  4. 4. A die-cast box radiator (100) according to any one of claims 1 to 3, characterized in that the die-cast box radiator (100) further comprises: And a second boss (40), wherein the second boss (40) has a second thickness and protrudes towards the back surface of the substrate (10), and the second boss (40) is arranged corresponding to the IGBT power module (20).
  5. 5. The die-cast case radiator (100) according to claim 4, wherein a plurality of the second bosses (40) are provided, and a plurality of the second bosses (40) are provided at intervals, and/or, The second thickness is not less than 1.4mm and not greater than 1.6mm.
  6. 6. The die cast case radiator (100) of claim 4, wherein at least two of the second bosses (40) are different in length, including a second long boss (41) and a second short boss (42), the second long boss (41) being longer than the second short boss (42).
  7. 7. The die-cast case radiator (100) according to claim 6, wherein at least two of the second long bosses (41) are arranged side by side at intervals on the back surface of the base plate (10), and at least two of the second short bosses (42) are arranged side by side at intervals on the back surface of the base plate (10).
  8. 8. The die-cast case radiator (100) according to any one of claims 5 to 7, wherein the die-cast case radiator (100) further comprises a heat radiation fin (50), the heat radiation fin (50) being provided on the back surface of the base plate (10); And/or the thickness of the substrate (10) is not less than 2.9mm and not more than 3.1mm.
  9. 9. An inverter comprising an IGBT power module (20), and a die-cast box heat sink (100) according to claim 8, wherein the IGBT power module (20) is connected to the die-cast box heat sink (100).
  10. 10. A photovoltaic system comprising a photovoltaic module and the inverter of claim 9, the inverter being electrically connected to the photovoltaic module.

Description

Die-casting box radiator, inverter and photovoltaic system Technical Field The utility model relates to the field of heat dissipation, in particular to a die-casting box radiator, an inverter and a photovoltaic system. Background In power electronic equipment, an IGBT (insulated gate bipolar transistor) power module is used as a core power device, and a large amount of heat is generated during operation, so that the reliability and efficiency of the system are not affected, and the heat dissipation performance is very critical. The traditional heat dissipation scheme generally adopts an aluminum extruded radiator, and an IGBT power module is attached to a radiator substrate, and is characterized by having a thicker substrate, when the heat of the IGBT power module is diffused to the other side through the substrate, because the substrate is thicker, the heat resistance is lower when the heat is laterally diffused, the temperature distribution is more uniform, and then the heat is dissipated by flowing air through the radiating fins. However, as electronic devices are being miniaturized and light-weighted, aluminum extruded heat sinks are gradually replaced by die-cast case heat sinks due to their greater weight and lower structural flexibility. The thickness of the die-casting box body is far lower than that of the base plate of the aluminum extruded section for weight reduction, so that the diffusion thermal resistance is obviously increased, and the heat dissipation is poor. The former practice is to increase the height of the fins, expand the heat dissipation area of the radiator to improve the temperature rise, and increase the whole volume and weight of the fins, so that the product lacks competitiveness. Disclosure of utility model The utility model mainly aims to provide a die-casting box radiator, which aims to reduce the diffusion thermal resistance of the die-casting box radiator under the condition of maintaining the size of the whole machine, has good radiating effect and simultaneously has the advantages of weight and cost. In order to achieve the above purpose, the utility model provides a die-casting box radiator, which comprises a substrate, wherein the substrate is provided with an IGBT power module, one surface of the IGBT power module is arranged in the substrate, and the other surface of the IGBT power module is attached to the substrate; The first boss is provided with a first thickness, the first boss corresponds to the IGBT power module and is arranged on the substrate, the IGBT power module is lifted by the first boss, and the thickness of the position of the IGBT power module on the substrate is increased. Optionally, the substrate and the first boss are integrally die-cast. Optionally, the first boss protrudes towards the front surface of the substrate, where the IGBT power module is disposed, and the first boss covers an IGBT mounting area where the IGBT power module is located. Optionally, the first thickness is not less than 2.4mm and not more than 2.6mm. Optionally, the area of the first boss is larger than the area of the IGBT mounting region, and the periphery of the first boss is outside the periphery of the IGBT mounting region. Optionally, the die-casting box radiator further comprises a second boss, wherein the second boss has a second thickness and protrudes towards the back surface of the substrate, and the second boss is arranged corresponding to the IGBT power module. Optionally, the second thickness is not less than 1.4mm and not greater than 1.6mm. Optionally, a plurality of second bosses are provided, and a plurality of second bosses are arranged at intervals. Optionally, the lengths of the plurality of second bosses are different, including a second long boss and a second short boss, and the length of the second long boss is greater than the length of the second short boss. Optionally, at least two second long bosses are arranged on the back surface of the substrate side by side at intervals, and at least two second short bosses are arranged on the back surface of the substrate side by side at intervals. Optionally, the substrate thickness is not less than 2.9mm and not more than 3.1mm. Optionally, the die-casting box radiator further comprises a heat dissipation rib, and the heat dissipation rib is arranged on the back surface of the base plate. The utility model further provides an inverter, which comprises an IGBT power module and the die-casting box radiator, wherein the IGBT power module is connected with the die-casting box radiator. The utility model further provides a photovoltaic system, which comprises a photovoltaic module and the inverter, wherein the inverter is electrically connected with the photovoltaic module. According to the technical scheme, the die-casting box radiator is provided with the local bosses (the first bosses and/or the second bosses) through the positions of the IGBT modules, the poor heat dissipation caused by the fact that the ba