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CN-224205656-U - Semiconductor wafer pre-bonding jig

CN224205656UCN 224205656 UCN224205656 UCN 224205656UCN-224205656-U

Abstract

The utility model relates to a semiconductor wafer pre-bonding jig which comprises a pressure applying mechanism, a wafer bearing unit, a wafer positioning mechanism and a spring mechanism, wherein the gravity is used as a power source, the pressure applying mechanism applies pressure to a wafer in the pre-bonding process through a connected pressing plate, the wafer bearing unit and a plurality of wafer bearing units are arranged on a bearing substrate and used for bearing the wafer to be bonded, the wafer positioning mechanism comprises positioning bearings and slide block guide rail mechanisms, the positioning bearing mechanisms are respectively arranged on two sides of each wafer bearing unit, the guide rail slide block mechanisms move to drive the positioning bearing mechanisms to move so as to realize the alignment and positioning of the wafer, and the spring mechanism automatically returns the wafer positioning mechanism to the original point position after the guide rail slide block mechanisms are manually pushed to move. The utility model realizes the high-precision and stable bonding of the thinned wafer, particularly the wafer with larger warpage and the bearing substrate, and improves the bonding quality and the production efficiency.

Inventors

  • WANG CHENGGANG
  • HUANG LEI
  • Shen Nengfeng
  • CHEN JIAKUAN

Assignees

  • 安徽格恩半导体有限公司

Dates

Publication Date
20260505
Application Date
20250507

Claims (6)

  1. 1. A semiconductor wafer pre-bonding jig is characterized by comprising; the pressure applying mechanism (1) adopts gravity as a power source, applies pressure to the wafer in the pre-bonding process through the connected pressing plate, The wafer bearing units (2) are arranged on the bearing substrate in a plurality and are used for bearing wafers to be bonded; The wafer positioning mechanism (3) comprises positioning bearings and slide block guide rail mechanisms, positioning bearing mechanisms are respectively arranged on two sides of each wafer bearing unit, and the guide rail slide block mechanisms move to drive the positioning bearing mechanisms to move so as to realize the alignment and positioning of the wafers; the spring mechanism (4) enables the wafer positioning mechanism (3) to automatically return to the original point position after the guide rail sliding block mechanism is manually pushed to move; the buffer mechanism (5) is matched with the spring mechanism (4) for use, and plays a role in buffering; And the heating mechanism (6) is used for heating the bearing substrate, heating the wafer bearing unit (2) and keeping constant temperature, and softening bonding glue on the surface of the bearing substrate in the pre-bonding process so as to enable the wafer to be adhered on the bearing substrate.
  2. 2. The semiconductor wafer pre-bonding jig according to claim 1, wherein the wafer carrying unit (2) comprises a wafer positioning groove (7), a picking station (8) and two positioning bearing grooves (9), and the positioning bearing grooves (9) are matched with the positioning bearing mechanism.
  3. 3. The jig for pre-bonding semiconductor wafers according to claim 1, wherein the pressure applying mechanism (1) is provided with wafer pressing pieces adapted to the wafer positioning grooves (7).
  4. 4. A semiconductor wafer pre-bonding jig according to claim 1, wherein the heating mechanism (6) heats and holds 100 ℃ to 200 ℃ for the wafer carrying unit (2).
  5. 5. The jig for pre-bonding semiconductor wafers according to claim 1, wherein the buffer mechanism (5) is disposed on the spring mechanism (4) and is used in cooperation with the spring mechanism (4) to perform a buffer function.
  6. 6. The jig for pre-bonding semiconductor wafers according to claim 1, wherein the spring mechanism (4) is located on a carrier substrate.

Description

Semiconductor wafer pre-bonding jig Technical Field The utility model relates to the technical field of semiconductor lasers, in particular to a semiconductor wafer pre-bonding jig. Background In the manufacturing process of semiconductor devices, particularly for processing special semiconductor devices such as thin wafers, flexible chips and the like, the temporary bonding technology plays a vital role. For example, in advanced 3D integrated circuit fabrication, wafer level packaging, and some processes requiring backside processing (e.g., wafer thinning, backside metallization, etc.), temporary bonding of the wafer to be processed to a carrier substrate is required. The existing temporary bonding process has a plurality of problems. Firstly, in the bonding process, the alignment precision of the thinned wafer, particularly the wafer with larger warpage and the bearing substrate is difficult to ensure, so that the relative position deviation of the thinned wafer and the bearing substrate is larger, and the precision and the device performance of the subsequent process are affected. Secondly, the traditional bonding mode lacks an effective pre-bonding means, and the problem that bubbles, stress concentration and the like are easily generated between the wafer and the bearing substrate by directly bonding at high temperature and high pressure can be solved, so that the bonding quality and the reliability of devices are reduced. Furthermore, some existing bonding devices have complex structures and high cost, and are not beneficial to mass production and application. Disclosure of utility model Based on the technical problems in the background art, the utility model provides a pre-bonding jig for semiconductor wafers, which realizes high-precision and stable bonding of thinned wafers, particularly wafers with larger warpage and bearing substrates, and improves bonding quality and production efficiency. The utility model provides a semiconductor wafer pre-bonding jig, which comprises the following components; The pressure applying mechanism adopts gravity as a power source, applies pressure to the wafer in the pre-bonding process through the connected pressing plate, The wafer bearing units are arranged on the bearing substrate in a plurality and are used for bearing wafers to be bonded; The wafer positioning mechanism comprises positioning bearings and slide block guide rail mechanisms, positioning bearing mechanisms are respectively arranged on two sides of each wafer bearing unit, and the guide rail slide block mechanisms move to drive the positioning bearing mechanisms to move so as to realize the alignment and positioning of the wafer; The spring mechanism enables the wafer positioning mechanism to automatically return to the original point position after the guide rail sliding block mechanism is manually pushed to move; the buffer mechanism is matched with the spring mechanism for use, and plays a role in buffering; And the heating mechanism is used for heating the bearing substrate, heating the wafer bearing unit and keeping the constant temperature, and softening the bonding adhesive on the surface of the bearing substrate in the pre-bonding process so as to enable the wafer to be adhered on the bearing substrate. Preferably, the wafer carrying unit comprises a wafer positioning groove, a picking station and two positioning bearing grooves, wherein the positioning bearing grooves are matched with the positioning bearing mechanisms. Preferably, the pressure applying mechanism is provided with a wafer pressing sheet matched with the wafer positioning groove. Preferably, the heating mechanism heats and maintains the wafer carrying unit at 100-200 ℃. Preferably, the buffer mechanism is arranged on the spring mechanism and is matched with the spring mechanism for use, so as to play a role in buffering. Preferably, the spring mechanism is located on the carrier substrate. The pre-bonding jig has the advantages that the adopted pre-bonding jig can effectively accurately position the thinned wafer, particularly the wafer with larger warpage and the bearing substrate, bonding offset is reduced, the pre-bonding jig is matched with the heating unit and the pressure mechanism, a pre-bonding structure can be formed between the semiconductor wafer and the bearing substrate, defects such as bubbles are reduced, and a good foundation is provided for formal bonding. Drawings Fig. 1 is a schematic structural diagram of a pre-bonding jig for semiconductor wafers according to the present utility model. Fig. 2 is a schematic structural view of a wafer carrying unit according to the present utility model. In the figure, 1, a pressure applying mechanism, 2, a wafer bearing unit, 3, a wafer positioning mechanism, 4, a spring mechanism, 5, a buffer mechanism, 6, a heating mechanism, 7, a wafer positioning groove, 8, a wafer picking station, 9 and a positioning bearing groove. Detailed Description The following description of